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    • 8. 发明授权
    • Method of fabricating a semiconductor device including a pattern of line segments
    • 制造包括线段图案的半导体器件的方法
    • US07879727B2
    • 2011-02-01
    • US12354480
    • 2009-01-15
    • Sergei PostnikovThomas SchulzHans-Joachim BarthKlaus von Arnim
    • Sergei PostnikovThomas SchulzHans-Joachim BarthKlaus von Arnim
    • H01L21/311
    • H01L27/11G03F7/40G03F7/7035H01L21/32139
    • A method of fabricating a semiconductor device including depositing a hardmask layer on a layer of the semiconductor device, selectively etching a pattern of continuous lines in the hardmask layer, depositing an antireflective coating over remaining portions of the hardmask layer, depositing a photoresist layer on the antireflective coating, patterning the photoresist layer with a plurality of isolation trenches via a lithography process, each of the isolation trenches extending perpendicular to and crossing portions of at least one of the continuous lines of the underlying hardmask layer, and with each isolation trench having an initial width. The method further includes reducing the width of each of the isolation trenches from the initial width to desired width via a shrinking process, etching the antireflective coating underlying the isolation trenches to expose intersecting portions of the underlying continuous lines, and etching the exposed intersecting portions of the underlying continuous lines of the hardmask layer to form a pattern of line segments having line ends separated by the desired width.
    • 一种制造半导体器件的方法,包括在半导体器件的层上沉积硬掩模层,选择性地蚀刻硬掩模层中的连续线的图案,在硬掩模层的剩余部分上沉积抗反射涂层,将光致抗蚀剂层沉积在 抗反射涂层,通过光刻工艺用多个隔离沟槽图案化光致抗蚀剂层,每个隔离沟槽垂直于并交叉下层硬掩模层的至少一条连续线的部分延伸,并且每个隔离沟槽具有 初始宽度。 该方法还包括通过收缩过程将每个隔离沟槽的宽度从初始宽度减小到期望宽度,蚀刻隔离沟槽下方的抗反射涂层以暴露下面的连续线的相交部分,并蚀刻暴露的相交部分 硬掩模层的下面的连续线以形成具有以期望宽度分隔的线端部的线段的图案。