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1. 发明授权

US08168471B2 Semiconductor device and manufacturing method of a semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US08168471B2
公开(公告)日：2012-05-01
申请号：US12712604
申请日：2010-02-25
申请人： Takashi Kanda , Kenji Fukuzono
发明人： Takashi Kanda , Kenji Fukuzono
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L24/83 , H01L21/6835 , H01L23/36 , H01L24/29 , H01L24/81 , H01L25/0655 , H01L25/16 , H01L2221/68345 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/73253 , H01L2224/81101 , H01L2224/81203 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/838 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/1517 , H01L2924/19041 , H01L2924/19043 , H01L2924/19106 , H05K3/323 , H05K3/4614 , H05K3/462 , H05K3/467 , H05K2201/10378 , H05K2201/10674 , H01L2924/00 , H01L2924/01083 , H01L2224/05599
摘要： A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.
摘要翻译：半导体器件包括多层基板和安装在多层基板上的半导体元件。多层基板包含由第一树脂材料连接的多个电路形成层。半导体元件通过第二树脂材料与多层基板接合而安装在多层基板上。第一树脂材料和第二树脂材料在相同的加热条件下可固化。

2. 发明申请

US20090196002A1 PRINTED WIRING BOARD UNIT 有权
标题翻译：印刷线路板单元
公开(公告)号：US20090196002A1
公开(公告)日：2009-08-06
申请号：US12362149
申请日：2009-01-29
申请人： Kenji FUKUZONO
发明人： Kenji FUKUZONO
IPC分类号： H05K1/18 , H05K1/11
CPC分类号： H05K1/0271 , H05K3/0058 , H05K3/301 , H05K3/325 , H05K3/3436 , H05K2201/0311 , H05K2201/10659 , H05K2201/10734 , H05K2201/2009 , H05K2201/2018
摘要： A printed wiring board unit includes an electronic circuit component, a printed wiring board, a plurality of first conductive terminals disposed between the electronic circuit component and the printed wiring board, at least one of the first conductive terminals arranged along a quadrangular outline, and a plurality of second conductive terminals disposed between the electronic circuit component and the printed wiring board, the second conductive terminals arranged at a corner of the quadrangular outline, and the second conductive terminals contacting at least one of the printed wiring board and the electronic circuit component in a relatively displaceable manner.
摘要翻译：印刷电路板单元包括电子电路部件，印刷线路板，布置在电子电路部件和印刷线路板之间的多个第一导电端子，沿着四边形轮廓布置的至少一个第一导电端子，以及设置在电子电路部件和印刷线路板之间的多个第二导电端子，布置在四边形轮廓的角部的第二导电端子和与印刷线路板和电子电路部件中的至少一个接触的第二导电端子相对位移的方式。

3. 发明申请

US20080006915A1 Semiconductor package, method of production of same, printed circuit board, and electronic apparatus 审中-公开
标题翻译：半导体封装，生产方法，印刷电路板和电子设备
公开(公告)号：US20080006915A1
公开(公告)日：2008-01-10
申请号：US11641718
申请日：2006-12-20
申请人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
发明人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
IPC分类号： H01L23/495
CPC分类号： H01L21/563 , H01L23/3128 , H01L23/36 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83104 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor package provided with a heat radiator achieving a further improvement of reliability by reducing an influence of thermal stress. For this purpose, the heat radiator is formed by a heat radiator comprised of a heat radiation plate plus a box shaped part and comprised so that the entire semiconductor chip is enclosed in this box shaped part together with a board via a metallic bonding material.
摘要翻译：具有散热器的半导体封装件通过减少热应力的影响而进一步提高可靠性。为此，散热器由散热板和盒状部件构成的散热片形成，并且包含半导体芯片整体通过金属接合材料与基板一体地包封在该盒状部件中。

4. 发明申请

US20070228530A1 Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader 审中-公开
标题翻译：导热接合材料，半导体封装，散热器，半导体芯片和将半导体芯片接合到散热器的接合方法
公开(公告)号：US20070228530A1
公开(公告)日：2007-10-04
申请号：US11544630
申请日：2006-10-10
申请人： Toshihisa Sato , Kenji Fukuzono , Masateru Koide
发明人： Toshihisa Sato , Kenji Fukuzono , Masateru Koide
IPC分类号： H01L23/495
CPC分类号： H01L23/42 , H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/10158 , H01L2924/14 , H01L2924/16152 , H01L2924/16195 , H01L2924/3511 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
摘要： A heat conductive bonding material 6 has a first bonding region 7 transferring heat of a semiconductor chip 1 to a heat spreader 4, and a second bonding region 8 relaxing a thermal stress generated between the semiconductor chip 1 and the heat spreader 4.
摘要翻译：导热接合材料6具有将半导体芯片1的热传递到散热器4的第一接合区域7和放松半导体芯片1和散热器4之间产生的热应力的第二接合区域8。

5. 发明授权

US07222316B2 Board design aiding apparatus, board design aiding method and board design aiding program 有权
标题翻译：板设计辅助设备，板设计辅助方法和板设计辅助程序
公开(公告)号：US07222316B2
公开(公告)日：2007-05-22
申请号：US10986135
申请日：2004-11-12
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： G06F17/50 , G01R31/02
CPC分类号： G06F17/5068 , H05K3/0005 , H05K3/4602 , H05K2201/0191
摘要： A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.
摘要翻译：简化设计的印刷线路板以预测印刷线路板的位移量的板设计辅助装置包括：层厚度计算部21，用于通过规定的规则获得板的面积的平均厚度，用于构成印刷电路板的每个层的层;以及层叠模型形成部22，用于通过层叠由层厚度计算部21计算的层厚度的层来形成简单的层叠模型。

6. 发明申请

US20130083504A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20130083504A1
公开(公告)日：2013-04-04
申请号：US13587268
申请日：2012-08-16
申请人： Kenji FUKUZONO , Naoaki NAKAMURA
发明人： Kenji FUKUZONO , Naoaki NAKAMURA
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/4056 , H01L2023/4062 , H01L2023/4068 , H01L2023/4075 , H01L2023/4081 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311
摘要： An electronic device includes: a first plate; a wiring board arranged on the first plate and configured to have a plurality of first terminals on a surface opposite to a surface facing the first plate; an electronic component arranged above the wiring board and configured to have a plurality of second terminals on a surface facing the wiring board; a connecting unit arranged between the wiring board and the electronic component and configured to electrically couple the first terminals and the second terminals; a second plate arranged on the electronic component; a fixing unit arranged in an area outside of an area where the electronic component is placed and configured to pressurize the first plate and the second plate; and a pressing unit arranged below the area where the electronic component is placed and configured to press the wiring board toward the electronic component.
摘要翻译：电子设备包括：第一板; 布线板，布置在第一板上并且被配置为在与面对第一板的表面相对的表面上具有多个第一端子; 布置在所述布线板上方并构成为在与所述布线板对置的表面上具有多个第二端子的电子部件; 连接单元，布置在所述布线板和所述电子部件之间，并且被配置为电连接所述第一端子和所述第二端子; 布置在所述电子部件上的第二板; 固定单元，其布置在所述电子部件放置的区域的外侧的区域中，并且构造成对所述第一板和所述第二板加压; 以及压电单元，布置在放置电子部件的区域的下方并被配置为将电路板朝向电子部件按压。

7. 发明申请

US20100014254A1 Printed circuit board unit and semiconductor package 有权
标题翻译：印刷电路板单元和半导体封装
公开(公告)号：US20100014254A1
公开(公告)日：2010-01-21
申请号：US12461867
申请日：2009-08-26
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： H05K7/20 , H01L23/48 , H01L23/36
CPC分类号： H01L23/4006 , H01L21/10 , H01L21/563 , H01L23/3675 , H01L23/433 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401
摘要： A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.
摘要翻译：一种端子凸块组，包括内嵌在封装基板前表面上的直立的第一棱镜中的最外凸块排。导热构件与半导体元件的表面接触。导热构件向外延伸超过半导体元件的轮廓。在半导体元件的轮廓外部的导热构件和封装基板之间插入加强构件。加强构件在预定的接合区域结合到封装基板的前表面。预定的结合区域从封装基板的外周向内延伸超过封装基板的前表面。第二棱镜直立在第一棱镜内部的封装基板的前表面上，以允许最外面的凸起行包围第二棱镜。

8. 发明申请

US20090294160A1 METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE BINDER 审中-公开
标题翻译：制造印刷电路板和电导体粘合剂的方法
公开(公告)号：US20090294160A1
公开(公告)日：2009-12-03
申请号：US12390131
申请日：2009-02-20
申请人： Hideaki YOSHIMURA , Tomohisa YAGI , Kenji FUKUZONO , Takashi KANDA
发明人： Hideaki YOSHIMURA , Tomohisa YAGI , Kenji FUKUZONO , Takashi KANDA
IPC分类号： H05K1/09 , C08K3/08 , H01B1/22 , C09J5/06
CPC分类号： H05K3/4614 , H05K1/056 , H05K1/095 , H05K3/20 , H05K3/3484 , H05K3/4069 , H05K3/4608 , H05K3/4644 , H05K2201/0218 , H05K2201/0323 , H05K2201/10378 , H05K2203/0384 , H05K2203/061
摘要： A thermosetting resin sheet is sandwiched between first and second support bodies so that a first electrically-conductive land on the first support body is opposed to a second electrically-conductive land on the second support body in an opening formed in the sheet. The opening is filled with an electrically-conductive binder. The electrically-conductive binder includes matrix material containing a thermosetting resin and fillers including copper particles dispersed in the matrix material. The copper particles have the surface coated with a tin-bismuth alloy. When heat is applied to the electrically-conductive binder, the tin-bismuth alloy melts. The tin forms an intermetallic compound on the surface of the individual copper particle. The copper-tin alloy layers serve to unit the copper particles together. Electrical connection is established. The bismuth embeds the copper particles. The bismuth is hardened or cured. The matrix material is then hardened or cured.
摘要翻译：热固性树脂片被夹在第一和第二支撑体之间，使得第一支撑体上的第一导电凸台与形成在片材中的开口中的第二支撑体上的第二导电凸台相对。开口填充有导电粘合剂。导电粘合剂包括含有热固性树脂的基质材料和分散在基质材料中的包含铜颗粒的填料。铜颗粒具有涂覆有锡 - 铋合金的表面。当对导电粘合剂施加热量时，锡 - 铋合金熔化。锡在单个铜颗粒的表面上形成金属间化合物。铜 - 锡合金层用于将铜颗粒整合在一起。建立电气连接。铋包埋铜颗粒。铋被硬化或固化。然后将基质材料硬化或固化。

9. 发明申请

US20070289706A1 Process for producing multilayer board 有权
标题翻译：多层板生产工艺
公开(公告)号：US20070289706A1
公开(公告)日：2007-12-20
申请号：US11649203
申请日：2007-01-04
申请人： Takashi Nakagawa , Seiichi Sugano , Kenji Iida , Yasutomo Maehara , Hitoshi Suzuki , Kaoru Sugimoto , Kenji Fukuzono , Takashi Kanda , Hiroaki Date , Tomohisa Yagi
发明人： Takashi Nakagawa , Seiichi Sugano , Kenji Iida , Yasutomo Maehara , Hitoshi Suzuki , Kaoru Sugimoto , Kenji Fukuzono , Takashi Kanda , Hiroaki Date , Tomohisa Yagi
IPC分类号： C09J5/06
CPC分类号： H05K3/4614 , H05K3/321 , H05K3/361 , H05K3/4069 , H05K2201/0218 , H05K2203/0425 , H05K2203/0568 , H05K2203/063 , Y10T29/49117
摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
摘要翻译：一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成，金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

10. 发明申请

US20070222039A1 Semiconductor device and manufacturing method of a semiconductor device 审中-公开
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US20070222039A1
公开(公告)日：2007-09-27
申请号：US11526100
申请日：2006-09-25
申请人： Takashi Kanda , Kenji Fukuzono
发明人： Takashi Kanda , Kenji Fukuzono
IPC分类号： H01L23/58
CPC分类号： H01L24/83 , H01L21/6835 , H01L23/36 , H01L24/29 , H01L24/81 , H01L25/0655 , H01L25/16 , H01L2221/68345 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/73253 , H01L2224/81101 , H01L2224/81203 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/838 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/1517 , H01L2924/19041 , H01L2924/19043 , H01L2924/19106 , H05K3/323 , H05K3/4614 , H05K3/462 , H05K3/467 , H05K2201/10378 , H05K2201/10674 , H01L2924/00 , H01L2924/01083 , H01L2224/05599
摘要： A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.
摘要翻译：半导体器件包括多层基板和安装在多层基板上的半导体元件。多层基板包含由第一树脂材料连接的多个电路形成层。半导体元件通过第二树脂材料与多层基板接合而安装在多层基板上。第一树脂材料和第二树脂材料在相同的加热条件下可固化。

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