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1. 发明申请

US20100014254A1 Printed circuit board unit and semiconductor package 有权
标题翻译：印刷电路板单元和半导体封装
公开(公告)号：US20100014254A1
公开(公告)日：2010-01-21
申请号：US12461867
申请日：2009-08-26
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： H05K7/20 , H01L23/48 , H01L23/36
CPC分类号： H01L23/4006 , H01L21/10 , H01L21/563 , H01L23/3675 , H01L23/433 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401
摘要： A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.
摘要翻译：一种端子凸块组，包括内嵌在封装基板前表面上的直立的第一棱镜中的最外凸块排。导热构件与半导体元件的表面接触。导热构件向外延伸超过半导体元件的轮廓。在半导体元件的轮廓外部的导热构件和封装基板之间插入加强构件。加强构件在预定的接合区域结合到封装基板的前表面。预定的结合区域从封装基板的外周向内延伸超过封装基板的前表面。第二棱镜直立在第一棱镜内部的封装基板的前表面上，以允许最外面的凸起行包围第二棱镜。

2. 发明申请

US20060036978A1 Board design aiding apparatus, board design aiding method and board design aiding program 有权
标题翻译：板设计辅助设备，板设计辅助方法和板设计辅助程序
公开(公告)号：US20060036978A1
公开(公告)日：2006-02-16
申请号：US10986135
申请日：2004-11-12
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： G06F17/50 , G01R31/02
CPC分类号： G06F17/5068 , H05K3/0005 , H05K3/4602 , H05K2201/0191
摘要： A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.
摘要翻译：简化设计的印刷线路板以预测印刷线路板的位移量的板设计辅助装置包括：层厚度计算部21，用于通过规定的规则获得板的面积的平均厚度，用于构成印刷电路板的每个层的层;以及层叠模型形成部22，用于通过层叠由层厚度计算部21计算的层厚度的层来形成简单的层叠模型。

3. 发明申请

US20080006915A1 Semiconductor package, method of production of same, printed circuit board, and electronic apparatus 审中-公开
标题翻译：半导体封装，生产方法，印刷电路板和电子设备
公开(公告)号：US20080006915A1
公开(公告)日：2008-01-10
申请号：US11641718
申请日：2006-12-20
申请人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
发明人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
IPC分类号： H01L23/495
CPC分类号： H01L21/563 , H01L23/3128 , H01L23/36 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83104 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor package provided with a heat radiator achieving a further improvement of reliability by reducing an influence of thermal stress. For this purpose, the heat radiator is formed by a heat radiator comprised of a heat radiation plate plus a box shaped part and comprised so that the entire semiconductor chip is enclosed in this box shaped part together with a board via a metallic bonding material.
摘要翻译：具有散热器的半导体封装件通过减少热应力的影响而进一步提高可靠性。为此，散热器由散热板和盒状部件构成的散热片形成，并且包含半导体芯片整体通过金属接合材料与基板一体地包封在该盒状部件中。

4. 发明授权

US07222316B2 Board design aiding apparatus, board design aiding method and board design aiding program 有权
标题翻译：板设计辅助设备，板设计辅助方法和板设计辅助程序
公开(公告)号：US07222316B2
公开(公告)日：2007-05-22
申请号：US10986135
申请日：2004-11-12
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： G06F17/50 , G01R31/02
CPC分类号： G06F17/5068 , H05K3/0005 , H05K3/4602 , H05K2201/0191
摘要： A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.
摘要翻译：简化设计的印刷线路板以预测印刷线路板的位移量的板设计辅助装置包括：层厚度计算部21，用于通过规定的规则获得板的面积的平均厚度，用于构成印刷电路板的每个层的层;以及层叠模型形成部22，用于通过层叠由层厚度计算部21计算的层厚度的层来形成简单的层叠模型。

5. 发明授权

US08119923B2 Circuit board 失效
标题翻译：电路板
公开(公告)号：US08119923B2
公开(公告)日：2012-02-21
申请号：US12188257
申请日：2008-08-08
申请人： Hideaki Yoshimura , Kenji Fukuzono , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano , Takashi Kanda
发明人： Hideaki Yoshimura , Kenji Fukuzono , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano , Takashi Kanda
IPC分类号： H05K1/00 , B32B9/00
CPC分类号： H05K1/0366 , H05K1/0271 , H05K1/056 , H05K3/4608 , H05K2201/0323 , H05K2201/068 , H05K2201/09145 , Y10T428/24917 , Y10T428/24926
摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.
摘要翻译：电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

6. 发明申请

US20110100690A1 ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：电导体和印刷线路板及其制造方法
公开(公告)号：US20110100690A1
公开(公告)日：2011-05-05
申请号：US12915786
申请日：2010-10-29
申请人： Hideaki Yoshimura , Kenji Fukuzono , Takashi Kanda , Tomohisa Yagi , Hiroki Ikeda , Katsu Yanagimoto
发明人： Hideaki Yoshimura , Kenji Fukuzono , Takashi Kanda , Tomohisa Yagi , Hiroki Ikeda , Katsu Yanagimoto
IPC分类号： H05K1/02 , B32B15/08 , B23K35/12 , H01B1/02 , B23K31/02
CPC分类号： H05K3/4614 , H01B1/02 , H01B1/026 , H01L2224/16225 , H01L2924/01322 , H01L2924/01327 , H05K1/186 , H05K3/1216 , H05K3/3463 , H05K3/3484 , H05K3/4069 , H05K3/4647 , H05K2201/0272 , H05K2201/09036 , H05K2201/10992 , Y10T428/31678 , H01L2924/00
摘要： An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.
摘要翻译：导电体包括：第一导电材料; 第二导电材料; 以及至少用于导电的将第一导电材料接合到第二导电材料的接合材料。接合材料由含有铜 - 锡基金属间化合物相和锡 - 铋相的金属结构制成，铜 - 锡基金属间化合物相在第一导电材料和第二导电材料之间连续，锡 - 铋相被铜 - 锡基金属间化合物相包围。

7. 发明申请

US20070012477A1 Electronic component package including joint material having higher heat conductivity 审中-公开
标题翻译：包括具有较高导热性的接头材料的电子部件封装
公开(公告)号：US20070012477A1
公开(公告)日：2007-01-18
申请号：US11231871
申请日：2005-09-22
申请人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
发明人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
IPC分类号： H01L23/34
CPC分类号： B23K35/26 , B23K35/3006 , B23K35/3601 , B23K2101/40 , B32B15/01 , B32B15/018 , C22C28/00 , H01L23/3735 , H01L23/3736 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00 , H01L2224/05599
摘要： An electronic component is mounted on the surface of a printed wiring board. A heat conductive member is received on the surface of the electronic component. A joint material is interposed between the electronic component and the heat conductive member. The joint material is made of material containing Ag in a range exceeding 3 wt % and In. The inventors have demonstrated that voids decrease at the boundary between the joint material and the electronic component as well as at the boundary between the joint material and the heat conductive member as the content of Ag increases in the overall weight of the joint material. The joint material is allowed to enjoy a higher heat conductivity as compared with a conventional solder material. The joint material allows the heat conductive member to efficiently receive heat from the electronic component.
摘要翻译：电子部件安装在印刷电路板的表面上。导电构件被容纳在电子部件的表面上。在电子部件和导热部件之间插入有接合材料。接头材料由含有Ag超过3重量％的In的材料制成。本发明人已经证明，在接头材料和电子部件之间的边界以及接头材料和导热部件之间的边界处，随着Ag含量的增加，接头材料的总重量的增加，空隙减小。与常规焊料材料相比，使接合材料具有更高的导热性。接合材料允许导热构件有效地从电子部件接收热量。

8. 发明申请

US20060212155A1 Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program 有权
标题翻译：印刷线路板设计辅助设备，印刷线路板设计辅助方法和印刷线路板设计辅助程序
公开(公告)号：US20060212155A1
公开(公告)日：2006-09-21
申请号：US11167264
申请日：2005-06-28
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： G06F19/00
CPC分类号： H05K3/0005 , G06F17/5018 , G06F2217/80 , H05K1/0271 , H05K2201/068
摘要： The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiring board design aiding program makes a computer execute the steps including a mesh division step that divides an analytical model of a printed wiring board obtained as data into meshes, a mesh displacement calculation step that calculates displacements of respective meshes of a printed wiring board which is divided in the mesh division step, a mesh displacement connection step that connects mesh displacements calculated in the mesh displacement calculation step so that the inclination of borders of respective meshes become equal, and a displacement calculation step that calculates a displacement using an entire displacement of a printed wiring board which is obtained in the mesh displacement connection step.
摘要翻译：本发明提供一种印刷线路板设计辅助装置，方法和程序，其可以容易且廉价地预测由于温度变化而导致的复杂形状和结构的印刷线路板的位移。印刷线路板设计辅助程序使得计算机执行包括将作为数据获得的印刷线路板的分析模型划分成网格的网格分割步骤的步骤，网格位移计算步骤，其计算印刷线路板的各个网格的位移其在网格划分步骤中被划分为网格位移连接步骤，其连接在网格位移计算步骤中计算的网格位移，使得各个网格的边界的倾斜度相等;以及位移计算步骤，其使用整个位移计算位移在网格位移连接步骤中获得的印刷线路板。

9. 发明授权

US08152953B2 Method of making printed wiring board and method of making printed circuit board unit 有权
标题翻译：制造印刷电路板的方法和制造印刷电路板单元的方法
公开(公告)号：US08152953B2
公开(公告)日：2012-04-10
申请号：US12365279
申请日：2009-02-04
申请人： Hideaki Yoshimura , Takashi Nakagawa , Kenji Fukuzono , Takashi Kanda , Tomohisa Yagi
发明人： Hideaki Yoshimura , Takashi Nakagawa , Kenji Fukuzono , Takashi Kanda , Tomohisa Yagi
IPC分类号： B32B37/12
CPC分类号： H05K3/321 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4641 , H05K3/4644 , H05K2201/0218 , H05K2201/0323 , H05K2201/0361 , H05K2201/10378 , H05K2201/10674 , H05K2203/0156 , H05K2203/061
摘要： The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.
摘要翻译：响应于粘合片的软化，第一支撑体被压靠在第二支撑体上。允许填料在第一导电焊盘和第二导电焊盘之间彼此可靠地接触。粘合片软化后，填料熔化。金属间化合物形成在填料和导电性焊盘之间以及填料之间。电连接以这种方式建立在第一导电焊盘和第二导电焊盘之间。然后将基质材料和粘合片固化。第一支撑体和第二支撑体彼此牢固地接合。

10. 发明授权

US08023268B2 Printed circuit board unit and semiconductor package 有权
标题翻译：印刷电路板单元和半导体封装
公开(公告)号：US08023268B2
公开(公告)日：2011-09-20
申请号：US12461867
申请日：2009-08-26
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L21/10 , H01L21/563 , H01L23/3675 , H01L23/433 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401
摘要： A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.
摘要翻译：一种端子凸块组，包括内嵌在封装基板前表面上的直立的第一棱镜中的最外凸块排。导热构件与半导体元件的表面接触。导热构件向外延伸超过半导体元件的轮廓。在半导体元件的轮廓外部的导热构件和封装基板之间插入加强构件。加强构件在预定的接合区域结合到封装基板的前表面。预定的接合区域从封装基板的外周向内延伸超过封装基板的前表面。第二棱镜直立在第一棱镜内部的封装基板的前表面上，以允许最外面的凸起行包围第二棱镜。

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