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1. 发明申请

US20070228530A1 Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader 审中-公开
标题翻译：导热接合材料，半导体封装，散热器，半导体芯片和将半导体芯片接合到散热器的接合方法
公开(公告)号：US20070228530A1
公开(公告)日：2007-10-04
申请号：US11544630
申请日：2006-10-10
申请人： Toshihisa Sato , Kenji Fukuzono , Masateru Koide
发明人： Toshihisa Sato , Kenji Fukuzono , Masateru Koide
IPC分类号： H01L23/495
CPC分类号： H01L23/42 , H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/10158 , H01L2924/14 , H01L2924/16152 , H01L2924/16195 , H01L2924/3511 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
摘要： A heat conductive bonding material 6 has a first bonding region 7 transferring heat of a semiconductor chip 1 to a heat spreader 4, and a second bonding region 8 relaxing a thermal stress generated between the semiconductor chip 1 and the heat spreader 4.
摘要翻译：导热接合材料6具有将半导体芯片1的热传递到散热器4的第一接合区域7和放松半导体芯片1和散热器4之间产生的热应力的第二接合区域8。

2. 发明申请

US20080006915A1 Semiconductor package, method of production of same, printed circuit board, and electronic apparatus 审中-公开
标题翻译：半导体封装，生产方法，印刷电路板和电子设备
公开(公告)号：US20080006915A1
公开(公告)日：2008-01-10
申请号：US11641718
申请日：2006-12-20
申请人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
发明人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
IPC分类号： H01L23/495
CPC分类号： H01L21/563 , H01L23/3128 , H01L23/36 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83104 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor package provided with a heat radiator achieving a further improvement of reliability by reducing an influence of thermal stress. For this purpose, the heat radiator is formed by a heat radiator comprised of a heat radiation plate plus a box shaped part and comprised so that the entire semiconductor chip is enclosed in this box shaped part together with a board via a metallic bonding material.
摘要翻译：具有散热器的半导体封装件通过减少热应力的影响而进一步提高可靠性。为此，散热器由散热板和盒状部件构成的散热片形成，并且包含半导体芯片整体通过金属接合材料与基板一体地包封在该盒状部件中。

3. 发明申请

US20070012477A1 Electronic component package including joint material having higher heat conductivity 审中-公开
标题翻译：包括具有较高导热性的接头材料的电子部件封装
公开(公告)号：US20070012477A1
公开(公告)日：2007-01-18
申请号：US11231871
申请日：2005-09-22
申请人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
发明人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
IPC分类号： H01L23/34
CPC分类号： B23K35/26 , B23K35/3006 , B23K35/3601 , B23K2101/40 , B32B15/01 , B32B15/018 , C22C28/00 , H01L23/3735 , H01L23/3736 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00 , H01L2224/05599
摘要： An electronic component is mounted on the surface of a printed wiring board. A heat conductive member is received on the surface of the electronic component. A joint material is interposed between the electronic component and the heat conductive member. The joint material is made of material containing Ag in a range exceeding 3 wt % and In. The inventors have demonstrated that voids decrease at the boundary between the joint material and the electronic component as well as at the boundary between the joint material and the heat conductive member as the content of Ag increases in the overall weight of the joint material. The joint material is allowed to enjoy a higher heat conductivity as compared with a conventional solder material. The joint material allows the heat conductive member to efficiently receive heat from the electronic component.
摘要翻译：电子部件安装在印刷电路板的表面上。导电构件被容纳在电子部件的表面上。在电子部件和导热部件之间插入有接合材料。接头材料由含有Ag超过3重量％的In的材料制成。本发明人已经证明，在接头材料和电子部件之间的边界以及接头材料和导热部件之间的边界处，随着Ag含量的增加，接头材料的总重量的增加，空隙减小。与常规焊料材料相比，使接合材料具有更高的导热性。接合材料允许导热构件有效地从电子部件接收热量。

4. 发明申请

US20080002374A1 Substrate with stiffener and manufacturing method thereof 审中-公开
标题翻译：具有加强筋的基板及其制造方法
公开(公告)号：US20080002374A1
公开(公告)日：2008-01-03
申请号：US11637911
申请日：2006-12-13
申请人： Kenji Fukuzono , Toshihisa Sato , Yuki Samejima
发明人： Kenji Fukuzono , Toshihisa Sato , Yuki Samejima
IPC分类号： H05K1/00 , B29C65/00
CPC分类号： H01L23/49833 , H01L21/4857 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0271 , H05K3/0061 , H05K3/386 , H05K2201/068 , Y10T156/10 , H01L2224/0401
摘要： A manufacturing method for a substrate with a stiffener is disclosed, the substrate being capable of ensuring a good flatness of a printed board when heated to a high temperature and then cooled. The method comprises a first step of preparing a printed board and a stiffener, the printed board including a wiring part and an insulating part formed of an organic insulating material, and the stiffener being formed of a material with a smaller coefficient of thermal expansion than that of the material of the printed board, and a second step of bonding the printed board and the stiffener with a thermosetting adhesive. In the second step, a curing process temperature for curing the thermosetting adhesive is equal to or higher than the glass transition point of the organic insulating material.
摘要翻译：公开了一种具有加强件的基板的制造方法，该基板能够确保当加热至高温然后冷却时印刷板的良好平整度。该方法包括制备印刷板和加强件的第一步骤，印刷板包括布线部分和由有机绝缘材料形成的绝缘部分，加强件由热膨胀系数小的材料形成。的印刷电路板的材料，以及用热固性粘合剂粘合印刷电路板和加强件的第二步骤。在第二步骤中，用于固化热固性粘合剂的固化过程温度等于或高于有机绝缘材料的玻璃化转变点。

5. 发明授权

US06898356B2 Split type optical fiber tape core 有权
标题翻译：分体式光纤胶带芯
公开(公告)号：US06898356B2
公开(公告)日：2005-05-24
申请号：US10432168
申请日：2002-03-14
申请人： Toshihisa Sato , Tomoyuki Hattori , Toshifumi Hosoya
发明人： Toshihisa Sato , Tomoyuki Hattori , Toshifumi Hosoya
IPC分类号： C03C25/10 , G02B6/44
CPC分类号： C03C25/1065 , G02B6/4404 , G02B6/4482
摘要： The separable optical fiber ribbon in accordance with the present invention is an optical fiber ribbon in which a plurality of colored optical fibers arranged in parallel are coated with a collective coating resin so as to be integrated into an optical fiber ribbon, and a plurality of such optical fiber ribbons are arranged in parallel and coated with a binding resin; wherein the binding resin is obtained by curing a UV-curable resin composition satisfying the condition represented by the following expression (1): 1.0×10−4≦(W·N/100MW)≦4.0×10−4 (1) where W is the compounding ratio [wt %] of a urethane acrylate compound contained in the resin composition, N is the number of urethane groups in one molecule of the urethane acrylate compound, and MW is the average molecular weight of the urethane acrylate compound.
摘要翻译：根据本发明的可分离的光纤带是其中平行布置的多个着色光纤被涂覆有聚合涂层树脂以便被整合到光纤带中的多个光纤带，并且多个这样的光纤带光纤带平行布置并涂覆有粘合树脂; 其中所述粘合树脂通过固化满足以下表达式（1）表示的条件的UV可固化树脂组合物获得：<？in-line-formula description =“In-line Formulas”end =“lead”≥> 1.0×10 =（WN / 100MW）<= 4.0×10 -4（1）<？in-line-formula description =“ 其中W是树脂组合物中所含的氨基甲酸酯丙烯酸酯化合物的配混比[wt％]，N是氨基甲酸酯丙烯酸酯化合物的一个分子中的氨基甲酸酯基数，以及 M W是氨基甲酸酯丙烯酸酯化合物的平均分子量。

6. 发明授权

US08689952B2 Damper 失效
标题翻译：阻尼器
公开(公告)号：US08689952B2
公开(公告)日：2014-04-08
申请号：US13522190
申请日：2011-01-11
申请人： Toshihisa Sato
发明人： Toshihisa Sato
IPC分类号： F16F9/14
CPC分类号： F16F9/145
摘要： A damper includes a housing, a cap, a rotor portion, and blade portions projecting from the rotor portion. The blade portions include deformation portions in which the blade portions expand the diameter in one rotational direction in response to a resistance received from a viscous fluid, and in which the blade portions reduce the diameter in the other rotational direction. The blade portions engage a ring member provided on an inner circumference of the housing at a time of diameter expansion, and drag the ring member around.
摘要翻译：阻尼器包括壳体，盖，转子部分和从转子部分突出的叶片部分。叶片部分包括变形部分，其中叶片部分响应于从粘性流体接收的阻力而在一个旋转方向上扩大直径，并且叶片部分在另一旋转方向上减小直径。刀片部分在直径膨胀时接合设置在壳体的内圆周上的环件，并且将环件拖动到周围。

7. 发明授权

US06471892B1 Method of producing tape type optical fiber core wire 有权
标题翻译：制造带式光纤芯线的方法
公开(公告)号：US06471892B1
公开(公告)日：2002-10-29
申请号：US09554683
申请日：2000-05-18
申请人： Ken Takahashi , Shigenori Takaki , Ryoei Oka , Tomoyuki Hattori , Toshihisa Sato , Kohei Kobayashi , Kaoru Okuno
发明人： Ken Takahashi , Shigenori Takaki , Ryoei Oka , Tomoyuki Hattori , Toshihisa Sato , Kohei Kobayashi , Kaoru Okuno
IPC分类号： B29D1100
CPC分类号： G02B6/448 , G02B6/4404
摘要： In a method of making a ribbon type coated optical fiber 3 comprising the step of inserting a plurality of optical fibers 1 flatly arranged parallel to each other through a die orifice 11a so as to collectively coat the optical fibers with a coating resin 2, the ratio W/H of a clearance W in the width direction between the inner surface of the die orifice 11a and the outer surface of the optical fibers 1 to a clearance H in the thickness direction therebetween is set within the range of 1.0 to 2.5.
摘要翻译：在制造带状涂覆光纤3的方法中，包括通过模孔11a彼此平行地平坦地插入多个光纤1以将涂覆树脂2共同涂覆光纤的步骤，在模孔11a的内表面和光纤1的外表面之间的宽度方向上的间隙W与其间的厚度方向的间隙H的W / H设定在1.0〜2.5的范围内。

8. 发明授权

US07299965B2 Method and apparatus for mounting and removing an electronic component 失效
标题翻译：用于安装和拆卸电子部件的方法和装置
公开(公告)号：US07299965B2
公开(公告)日：2007-11-27
申请号：US11288279
申请日：2005-11-29
申请人： Toshihisa Sato
发明人： Toshihisa Sato
IPC分类号： B23K31/00 , B23K1/018
CPC分类号： B23K1/018 , B23K3/0623 , B23K2101/40 , B23Q15/22 , G05B2219/37407 , G05B2219/45235 , H01L21/67144 , H01L24/75 , H01L24/799 , H01L24/81 , H01L24/98 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16 , H01L2224/16225 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75502 , H01L2224/75743 , H01L2224/81048 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/3025 , H01L2924/3511 , H05K3/3436 , H05K3/3494 , H05K2203/163 , Y02P70/613 , H01L2224/05005 , H01L2224/05541 , H01L2224/05599 , H01L2224/05099
摘要： A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to move the electronic component to detect contact of the solder bumps with the substrate or contact of a tool (chuck unit 38) with the electronic component, to define the contact as an original point for raising a heating temperature of the electronic component and the substrate from the heating temperature to a maximum heating temperature HTm as well as move the electronic component in conformity with the temperature rising, and to move the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.
摘要翻译：提供了一种方法和装置，用于使用焊料凸块安装和移除电子部件，同时将热应力约束到基板。用焊料凸块114焊接到衬底上的用于安装和移除要焊接到衬底上的电子部件（承载芯片32）的方法和装置被配置为移动电子部件以检测焊料凸块与基板的接触或工具（卡盘单元38）与电子部件配合，以将触点定义为用于将电子部件和基板的加热温度从加热温度升高到最大加热温度HTm的原点，以及根据温度移动电子部件并且将电子部件从实现最大加热温度的位置移动到基板的安装高度。

9. 发明申请

US20060076388A1 Method and apparatus for mounting and removing an electronic component 失效
标题翻译：用于安装和拆卸电子部件的方法和装置
公开(公告)号：US20060076388A1
公开(公告)日：2006-04-13
申请号：US11288279
申请日：2005-11-29
申请人： Toshihisa Sato
发明人： Toshihisa Sato
IPC分类号： B23K20/00
CPC分类号： B23K1/018 , B23K3/0623 , B23K2101/40 , B23Q15/22 , G05B2219/37407 , G05B2219/45235 , H01L21/67144 , H01L24/75 , H01L24/799 , H01L24/81 , H01L24/98 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16 , H01L2224/16225 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75502 , H01L2224/75743 , H01L2224/81048 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/3025 , H01L2924/3511 , H05K3/3436 , H05K3/3494 , H05K2203/163 , Y02P70/613 , H01L2224/05005 , H01L2224/05541 , H01L2224/05599 , H01L2224/05099
摘要： A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to move the electronic component to detect contact of the solder bumps with the substrate or contact of a tool (chuck unit 38) with the electronic component, to define the contact as an original point for raising a heating temperature of the electronic component and the substrate from the heating temperature to a maximum heating temperature HTm as well as move the electronic component in conformity with the temperature rising, and to move the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.
摘要翻译：提供了一种方法和装置，用于使用焊料凸块安装和移除电子部件，同时将热应力约束到基板。用焊料凸块114焊接到衬底上的用于安装和移除要焊接到衬底上的电子部件（承载芯片32）的方法和装置被配置为移动电子部件以检测焊料凸块与基板的接触或工具（卡盘单元38）与电子部件配合，以将触点定义为用于将电子部件和基板的加热温度从加热温度升高到最大加热温度HTm的原点，以及根据温度移动电子部件并且将电子部件从实现最大加热温度的位置移动到基板的安装高度。

10. 发明申请

US20120298460A1 DAMPER 失效
标题翻译：阻尼器
公开(公告)号：US20120298460A1
公开(公告)日：2012-11-29
申请号：US13522190
申请日：2011-01-11
申请人： Toshihisa Sato
发明人： Toshihisa Sato
IPC分类号： F16F11/00
CPC分类号： F16F9/145
摘要： A damper includes a housing, a cap, a rotor portion, and blade portions projecting from the rotor portion. The blade portions include deformation portions in which the blade portions expand the diameter in one rotational direction in response to a resistance received from a viscous fluid, and in which the blade portions reduce the diameter in the other rotational direction. The blade portions engage a ring member provided on an inner circumference of the housing at a time of diameter expansion, and drag the ring member around.
摘要翻译：阻尼器包括壳体，盖，转子部分和从转子部分突出的叶片部分。叶片部分包括变形部分，其中叶片部分响应于从粘性流体接收的阻力而在一个旋转方向上扩大直径，并且叶片部分在另一旋转方向上减小直径。叶片部分在直径膨胀时接合设置在壳体的内圆周上的环件，并且将环件拖动到周围。

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