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    • 1. 发明授权
    • Heat-dissipating structure and heat-dissipating semiconductor package having the same
    • 散热结构及其散热半导体封装
    • US07863731B2
    • 2011-01-04
    • US12001612
    • 2007-12-11
    • Chin-Te ChenKe-Chuan YangChang-Fu Lin
    • Chin-Te ChenKe-Chuan YangChang-Fu Lin
    • H01L23/10
    • H01L23/367H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/73253H01L2924/00011H01L2924/00014H01L2924/3011H01L2924/00H01L2224/0401
    • A heat-dissipating structure and a heat-dissipating semiconductor package having the same are disclosed in the present invention. The heat-dissipating semiconductor package includes a chip carrier, a flip chip semiconductor chip attached and electrically connected to the chip carrier, and a heat sink bonded to the flip chip semiconductor chip via a thermal interface material, such as a solder material, wherein a groove is formed on the heat sink around the bonding area of the thermal interface material, and a blocking layer, such as a metal oxide layer, is formed on the surface of the groove to reduce the wetting capability of the thermal interface material, thus further prevents the thermal interface material from wetting the groove in the fusion process performed the thermal interface material, therefore, it ensures the thermal interface material has sufficient thickness for forming solder bonding between the heat sink and the flip chip semiconductor chip.
    • 在本发明中公开了一种散热结构和具有该散热结构的散热半导体封装。 散热半导体封装包括芯片载体,安装并电连接到芯片载体的倒装芯片半导体芯片,以及通过诸如焊料材料的热界面材料接合到倒装芯片半导体芯片的散热器,其中a 在热界面材料的接合区域周围的散热器上形成凹槽,并且在凹槽的表面上形成诸如金属氧化物层的阻挡层,以降低热界面材料的润湿能力,因此进一步 防止热界面材料在进行热界面材料的熔融过程中润湿槽,因此,确保热界面材料具有足够的厚度,用于在散热器和倒装芯片半导体芯片之间形成焊接。
    • 5. 发明授权
    • Circuit board structure and method for fabricating the same
    • 电路板结构及其制造方法
    • US07999189B2
    • 2011-08-16
    • US12218891
    • 2008-07-18
    • Chin-Te ChenKe-Chuan YangHung-Ming Chang
    • Chin-Te ChenKe-Chuan YangHung-Ming Chang
    • H05K1/09
    • H01L23/49816H01L23/49822H01L23/49838H01L2924/0002H05K1/114H05K3/108H05K3/3452H05K3/4644H05K2201/09236H05K2201/09436H05K2203/025H05K2203/0733Y10T29/49149H01L2924/00
    • A circuit board structure and a method for fabricating the same are disclosed, including providing a core board having conductive traces and solder pads respectively formed thereon, wherein width of the solder pads corresponds to that of the conductive traces, and pitch between adjacent solder pads is made wide enough to allow multiple conductive traces to pass through; forming on the core board an insulating layer with openings for exposing the solder pads therefrom; forming on the insulating layer a plurality of extending pads electrically connected to the solder pads respectively, wherein the projection area of the extending pads is larger than that of the corresponding solder pads and covers conductive traces adjacent to the corresponding solder pads. Thus, more conductive traces are allowed to pass between adjacent solder pads and meanwhile, the extending pads provide an effective solder ball wetting area for achieving good solder joints and sufficient height after collapse.
    • 公开了一种电路板结构及其制造方法,包括提供具有分别形成在其上的导电迹线和焊盘的芯板,其中焊盘的宽度对应于导电迹线的宽度,相邻焊盘之间的间距是 足够宽以允许多个导电迹线通过; 在所述芯板上形成具有用于从其露出焊盘的开口的绝缘层; 在所述绝缘层上形成分别电连接到所述焊盘的多个延伸焊盘,其中所述延伸焊盘的所述投影区域大于相应焊接焊盘的所述投影区域并且覆盖与相应焊盘相邻的导电迹线。 因此,允许更多的导电迹线在相邻焊盘之间通过,同时,延伸焊盘提供有效的焊球润湿区域,以实现良好的焊点和崩溃后的足够的高度。