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1. 发明授权

US08721888B2 Wastewater treatment method using annularly arranged microorganism carriers 有权
标题翻译：使用环状布置的微生物载体的污水处理方法
公开(公告)号：US08721888B2
公开(公告)日：2014-05-13
申请号：US13223416
申请日：2011-09-01
申请人： Der-Ming Lee , Ming-Kuei Chiang , Chin-Te Chen , Keng-Chuan Sung , Jih-Gaw Lin , Sin-Han Su
发明人： Der-Ming Lee , Ming-Kuei Chiang , Chin-Te Chen , Keng-Chuan Sung , Jih-Gaw Lin , Sin-Han Su
IPC分类号： C02F3/30 , C02F3/06 , C02F3/10 , C02F3/12 , C02F101/16
CPC分类号： C02F3/301 , C02F3/06 , C02F3/101 , C02F3/109 , C02F3/1263 , C02F3/302 , C02F3/307 , C02F2101/16 , C02F2203/006 , Y02W10/15 , Y10S210/903
摘要： A wastewater treatment method using annularly arranged microorganism carriers in a reaction tank, which defines therein an upper reaction area, a lower reaction area and a passage area surrounded by the microorganism carriers and kept in communication between the upper reaction area and the lower reaction area. Microorganisms including nitrifying bacteria and autotrophic denitrifying bacteria are attached to the surface of each microorganisms carriers and suspending in the water of the reaction tank for causing Anammox reaction to convert NH4+ and NO2− in wastewater into nitrogen gas, achieving removal of total nitrogen compounds from water. The microorganism carriers are used to retain microorganisms in the reaction tank, enhancing the treatment efficiency.
摘要翻译：一种在反应槽中使用环状布置的微生物载体的废水处理方法，其中限定了上述反应区域，较低的反应区域和由微生物载体包围的通道区域，并保持在上部反应区域和下部反应区域之间的连通。包括硝化细菌和自养反硝化细菌在内的微生物附着在每个微生物载体的表面，并悬浮在反应罐的水中，使得Anammox反应将废水中的NH4 +和NO2-转化为氮气，从水中除去总氮化合物。微生物载体用于将微生物保留在反应罐中，提高处理效率。

2. 发明授权

US07863731B2 Heat-dissipating structure and heat-dissipating semiconductor package having the same 有权
标题翻译：散热结构及其散热半导体封装
公开(公告)号：US07863731B2
公开(公告)日：2011-01-04
申请号：US12001612
申请日：2007-12-11
申请人： Chin-Te Chen , Ke-Chuan Yang , Chang-Fu Lin
发明人： Chin-Te Chen , Ke-Chuan Yang , Chang-Fu Lin
IPC分类号： H01L23/10
CPC分类号： H01L23/367 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： A heat-dissipating structure and a heat-dissipating semiconductor package having the same are disclosed in the present invention. The heat-dissipating semiconductor package includes a chip carrier, a flip chip semiconductor chip attached and electrically connected to the chip carrier, and a heat sink bonded to the flip chip semiconductor chip via a thermal interface material, such as a solder material, wherein a groove is formed on the heat sink around the bonding area of the thermal interface material, and a blocking layer, such as a metal oxide layer, is formed on the surface of the groove to reduce the wetting capability of the thermal interface material, thus further prevents the thermal interface material from wetting the groove in the fusion process performed the thermal interface material, therefore, it ensures the thermal interface material has sufficient thickness for forming solder bonding between the heat sink and the flip chip semiconductor chip.
摘要翻译：在本发明中公开了一种散热结构和具有该散热结构的散热半导体封装。散热半导体封装包括芯片载体，安装并电连接到芯片载体的倒装芯片半导体芯片，以及通过诸如焊料材料的热界面材料接合到倒装芯片半导体芯片的散热器，其中a 在热界面材料的接合区域周围的散热器上形成凹槽，并且在凹槽的表面上形成诸如金属氧化物层的阻挡层，以降低热界面材料的润湿能力，因此进一步防止热界面材料在进行热界面材料的熔融过程中润湿槽，因此，确保热界面材料具有足够的厚度，用于在散热器和倒装芯片半导体芯片之间形成焊接。

3. 发明授权

US07413553B2 Exercising apparatus 失效
标题翻译：运动器具
公开(公告)号：US07413553B2
公开(公告)日：2008-08-19
申请号：US11640338
申请日：2006-12-18
申请人： Chin-Te Chen
发明人： Chin-Te Chen
IPC分类号： A61H1/00 , A61H1/02 , A61H5/00 , A61H7/00 , A61H19/00
CPC分类号： A61H1/003 , A61H1/005 , A61H23/0254 , A61H2201/0165 , A61H2201/1635 , A61H2201/164 , A61H2201/1678 , A61H2203/0406 , A61H2203/0431 , A61H2203/0456
摘要： An exercising apparatus includes a base, two supporting brackets, a driving assembly, a pedal assembly and a case. The supporting brackets are mounted on the base. The driving assembly includes a motor, an eccentric wheel and a lifting bracket. The motor has a motor shaft. The eccentric wheel is mounted eccentrically on the motor shaft. The lifting bracket has a wheel slot and two pivoting brackets. The wheel slot is defined through the lifting bracket and engages the eccentric wheel. The pivoting brackets are formed near two ends of the lifting bracket. The pedal assembly includes two pedals and two pedal pads. The pedals are mounted respectively and pivotally on the supporting brackets and the pivoting brackets of the lifting bracket. The pedal pads are mounted respectively on the pedals. The case is mounted on the base and has two openings corresponding to the pedal pads.
摘要翻译：运动装置包括基座，两个支撑托架，驱动组件，踏板组件和壳体。支撑托架安装在底座上。驱动组件包括马达，偏心轮和提升托架。电机有电机轴。偏心轮偏心安装在电机轴上。提升支架有一个轮槽和两个枢轴支架。轮槽通过提升支架定义并与偏心轮接合。枢转支架形成在提升支架的两端附近。踏板组件包括两个踏板和两个脚踏板。踏板分别安装在支架上和提升支架的枢转支架上。脚踏板分别安装在踏板上。壳体安装在基座上，并具有对应于脚踏板的两个开口。

4. 发明授权

US06818538B2 Ball grid array semiconductor package and method of fabricating the same 失效
公开(公告)号：US06818538B2
公开(公告)日：2004-11-16
申请号：US10418838
申请日：2003-04-18
申请人： Kuo-Chu Chiang , Yu-Ting Lai , Chin Te Chen
发明人： Kuo-Chu Chiang , Yu-Ting Lai , Chin Te Chen
IPC分类号： H01L2144
CPC分类号： H01L24/32 , H01L23/3128 , H01L23/49816 , H01L24/29 , H01L24/73 , H01L24/83 , H01L2224/16225 , H01L2224/27013 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/838 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/0781 , H01L2924/15151 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A ball grid array semiconductor packaging technology is provided, which is characterized in that openings of a solder mask are formed on a given edge of a die attachment area, and entire or partial width of each opening is disposed outside the die attachment area. Accordingly, air within the opening of the solder mask is sufficiently eliminated during die bonding process, so as to prevent void formation as adhesive is filled into the opening. Therefore, in the follow-up steps, high temperature in reflowing process will not cause popcorn as in the prior-art, so as to remain good quality of the semiconductor package.

5. 发明授权

US06388313B1 Multi-chip module 有权
标题翻译：多芯片模块
公开(公告)号：US06388313B1
公开(公告)日：2002-05-14
申请号：US09774227
申请日：2001-01-30
申请人： Ming-Hsun Lee , Chin-Te Chen
发明人： Ming-Hsun Lee , Chin-Te Chen
IPC分类号： H01L2302
CPC分类号： H01L23/49575 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A multi-chip module is proposed, which is designed to pack two or more semiconductor chips in a stacked manner over a chip carrier in a single package. The proposed multi-chip module is characterized by the use of a reverse wire-bonding technique to allow the topmost bent portions of a first set of bonding wires connected to the bottommost chip to be positioned above the substrate rather than above the bottommost chip. Then, an adhesive layer is formed to a thickness that allows it to entirely wrap the part of the bonding wires that is positioned above the active surface of the bottommost chip to prevent the bonding wires connected to the bottommost chip to come in contact with at least one overlaid chip. This allows the prevention of voids between the two stacked chips in the encapsulation body. Moreover, the proposed multi-chip module allows the stacked chips to be variably-sized according actual needs without the problem of the bonding wires being damaged during the mounting of the overlaid chip. The overlaid chip is electrically connected to the substrate by a second set of bonding wires, and an encapsulation body is provided to encapsulate the first semiconductor chip, the first set of bonding wires, the second semiconductor chip, and the second set of bonding wires.
摘要翻译：提出了一种多芯片模块，其被设计成在单个封装中以堆叠方式在芯片载体上封装两个或更多个半导体芯片。所提出的多芯片模块的特征在于使用反向引线接合技术来允许连接到最底部芯片的第一组接合线的最上部弯曲部分位于衬底上方，而不是位于最下面的芯片之上。然后，形成粘合剂层，使得其能够完全包裹位于最底部芯片的有效表面之上的接合线的部分，以防止连接至最底部芯片的接合线至少与一个重叠的芯片。这允许防止封装体中两个堆叠的芯片之间的空隙。此外，所提出的多芯片模块允许堆叠的芯片根据实际需要变化，而不会在重叠的芯片的安装期间损坏接合线的问题。覆盖的芯片通过第二组接合线电连接到基板，并且提供封装体来封装第一半导体芯片，第一组接合线，第二半导体芯片和第二组接合线。

6. 发明授权

US5904192A Wood planing machine 失效
标题翻译：木刨机
公开(公告)号：US5904192A
公开(公告)日：1999-05-18
申请号：US139278
申请日：1998-08-25
申请人： Chin-Te Chen
发明人： Chin-Te Chen
IPC分类号： B27C1/04 , B27C1/12 , B27C1/14 , B27C1/02
CPC分类号： B27C1/04 , B27C1/12 , B27C1/14
摘要： A wood planing machine includes a working table, and a carrier body that is disposed above and movable relative to the working table in order to adjust the depth of cut. The carrier body is further provided with a gear mechanism disposed at one side thereof such that the gear mechanism does not extend beyond the lowermost portion of the carrier body.
摘要翻译：木刨机包括工作台和载体主体，其设置在工作台上方并可相对于工作台移动，以调节切割深度。承载体还设置有设置在其一侧的齿轮机构，使得齿轮机构不延伸超过载体主体的最下部分。

7. 发明授权

US07999189B2 Circuit board structure and method for fabricating the same 有权
标题翻译：电路板结构及其制造方法
公开(公告)号：US07999189B2
公开(公告)日：2011-08-16
申请号：US12218891
申请日：2008-07-18
申请人： Chin-Te Chen , Ke-Chuan Yang , Hung-Ming Chang
发明人： Chin-Te Chen , Ke-Chuan Yang , Hung-Ming Chang
IPC分类号： H05K1/09
CPC分类号： H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H05K1/114 , H05K3/108 , H05K3/3452 , H05K3/4644 , H05K2201/09236 , H05K2201/09436 , H05K2203/025 , H05K2203/0733 , Y10T29/49149 , H01L2924/00
摘要： A circuit board structure and a method for fabricating the same are disclosed, including providing a core board having conductive traces and solder pads respectively formed thereon, wherein width of the solder pads corresponds to that of the conductive traces, and pitch between adjacent solder pads is made wide enough to allow multiple conductive traces to pass through; forming on the core board an insulating layer with openings for exposing the solder pads therefrom; forming on the insulating layer a plurality of extending pads electrically connected to the solder pads respectively, wherein the projection area of the extending pads is larger than that of the corresponding solder pads and covers conductive traces adjacent to the corresponding solder pads. Thus, more conductive traces are allowed to pass between adjacent solder pads and meanwhile, the extending pads provide an effective solder ball wetting area for achieving good solder joints and sufficient height after collapse.
摘要翻译：公开了一种电路板结构及其制造方法，包括提供具有分别形成在其上的导电迹线和焊盘的芯板，其中焊盘的宽度对应于导电迹线的宽度，相邻焊盘之间的间距是足够宽以允许多个导电迹线通过; 在所述芯板上形成具有用于从其露出焊盘的开口的绝缘层; 在所述绝缘层上形成分别电连接到所述焊盘的多个延伸焊盘，其中所述延伸焊盘的所述投影区域大于相应焊接焊盘的所述投影区域并且覆盖与相应焊盘相邻的导电迹线。因此，允许更多的导电迹线在相邻焊盘之间通过，同时，延伸焊盘提供有效的焊球润湿区域，以实现良好的焊点和崩溃后的足够的高度。

8. 发明授权

US07203072B2 Heat dissipating structure and semiconductor package with the same 有权
标题翻译：散热结构和半导体封装相同
公开(公告)号：US07203072B2
公开(公告)日：2007-04-10
申请号：US10851288
申请日：2004-05-21
申请人： Chin-Te Chen , Chang-Fu Lin
发明人： Chin-Te Chen , Chang-Fu Lin
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H01L23/10 , H01L23/36 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251 , H01L2924/163 , H01L2924/16315 , H01L2924/00
摘要： A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a support portion is mount on the substrate via the support portion by means of an adhesive. At least one groove is formed on the support portion and at least one air vent is formed around the groove to allow the groove to communicate with the outside via the air vent, such that the adhesive is allowed to fill the groove to expel air from the groove to the atmosphere through the air vent, thereby preventing the air from trapped in the groove.
摘要翻译：提出了一种散热结构及其半导体封装。衬底用于容纳至少一个芯片，芯片电连接至衬底。具有平坦部分和支撑部分的散热结构通过粘合剂经由支撑部分安装在基板上。在支撑部分上形成至少一个凹槽，并且围绕凹槽形成至少一个排气孔，以允许凹槽经由排气口与外部连通，使得允许粘合剂填充凹槽以从空气中排出空气通过排气口到大气中，从而防止空气被捕获在槽中。

9. 发明授权

US06980438B2 Semiconductor package with heat dissipating structure 有权
公开(公告)号：US06980438B2
公开(公告)日：2005-12-27
申请号：US10759863
申请日：2004-01-16
申请人： Chien-Ping Huang , Han-Ping Pu , Chin-Te Chen , Chang-Fu Lin
发明人： Chien-Ping Huang , Han-Ping Pu , Chin-Te Chen , Chang-Fu Lin
IPC分类号： H01L21/48 , H01L21/56 , H01L23/055 , H01L23/10 , H01L23/367 , H01L23/467 , H01L25/065 , H05K7/20
CPC分类号： H01L23/467 , H01L21/4882 , H01L21/563 , H01L23/055 , H01L23/10 , H01L23/3672 , H01L23/3675 , H01L25/0655 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/16315 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor package with a heat dissipating structure includes a substrate, a chip and a heat dissipating structure. The chip is mounted on and electrically connected to the substrate. The heat dissipating structure includes a first heat sink having at least one positioning portion, and at least one second heat sink having at least one second positioning portion and at least one hollow portion. The second heat sink is mounted on the substrate, and the first positioning portion of the first heat sink is attached to the second positioning portion of the second heat sink, allowing the chip to be accommodated in a space defined by the first heat sink, the hollow portion of the second heat sink and the substrate. This semiconductor package has good heat dissipating efficiency and is cost-effective to fabricate.

10. 发明申请

US20130056411A1 WASTEWATER TREATMENT METHOD USING ANNULARLY ARRANGED MICROORGANISM CARRIERS 有权
标题翻译：使用环形微生物载体的废水处理方法
公开(公告)号：US20130056411A1
公开(公告)日：2013-03-07
申请号：US13223416
申请日：2011-09-01
申请人： Der-Ming LEE , Ming-Kuei Chiang , Chin-Te Chen , Keng-Chuan Sung , Jih-Gaw Lin , Sin-Han Su
发明人： Der-Ming LEE , Ming-Kuei Chiang , Chin-Te Chen , Keng-Chuan Sung , Jih-Gaw Lin , Sin-Han Su
IPC分类号： C02F3/30 , C02F3/34
CPC分类号： C02F3/301 , C02F3/06 , C02F3/101 , C02F3/109 , C02F3/1263 , C02F3/302 , C02F3/307 , C02F2101/16 , C02F2203/006 , Y02W10/15 , Y10S210/903
摘要： A wastewater treatment method using annularly arranged microorganism carriers in a reaction tank, which defines therein an upper reaction area, a lower reaction area and a passage area surrounded by the microorganism carriers and kept in communication between the upper reaction area and the lower reaction area. Microorganisms including nitrifying bacteria and autotrophic denitrifying bacteria are attached to the surface of each microorganisms carriers and suspending in the water of the reaction tank for causing Anammox reaction to convert NH4+ and NO2− in wastewater into nitrogen gas, achieving removal of total nitrogen compounds from water. The microorganism carriers are used to retain microorganisms in the reaction tank, enhancing the treatment efficiency.
摘要翻译：一种在反应槽中使用环状布置的微生物载体的废水处理方法，其中限定了上述反应区域，较低的反应区域和由微生物载体包围的通道区域，并保持在上部反应区域和下部反应区域之间的连通。包括硝化细菌和自养反硝化细菌在内的微生物附着在每个微生物载体的表面，并悬浮在反应罐的水中，使得Anammox反应将废水中的NH4 +和NO2-转化为氮气，从水中除去总氮化合物。微生物载体用于将微生物保留在反应罐中，提高处理效率。

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