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    • 1. 发明申请
    • Memory Module, Memory System, and Inforamtion Device
    • 内存模块,内存系统和Inforamtion设备
    • US20120271987A1
    • 2012-10-25
    • US13460451
    • 2012-04-30
    • Seiji MIURAKazushige AYUKAWA
    • Seiji MIURAKazushige AYUKAWA
    • G06F12/00
    • G11C11/005G06F12/0638G06F2212/2022G11C7/20G11C11/4072H01L2224/48091H01L2224/48137H01L2924/00014
    • A memory system including ROM and RAM in which reading and writing are enabled. A memory system includes a non-volatile memory (FLASH), DRAM, a control circuit, and an information processing device. Data in FLASH is transferred to SRAM or DRAM in advance. Data transfer between the non-volatile memory and the DRAM can be performed in the background. The memory system including these plural chips is configured as a memory system module in which each chip is mutually laminated and each chip is wired via a ball grid array (BGA) and bonding wire between the chips. Data in FLASH can be read at the similar speed to that of DRAM by securing a region in which the data in FLASH can be copied in DRAM and transferring the data to DRAM in advance immediately after power is turned on or by a load instruction.
    • 包括ROM和RAM的存储器系统,其中启用读和写。 存储器系统包括非易失性存储器(FLASH),DRAM,控制电路和信息处理设备。 预先将FLASH中的数据传送到SRAM或DRAM。 在非易失性存储器和DRAM之间的数据传输可以在后台执行。 包括这些多个芯片的存储器系统被配置为存储器系统模块,其中每个芯片相互层叠,并且每个芯片经由球栅阵列(BGA)和芯片之间的接合线布线。 FLASH中的数据可以通过保护FLASH中的数据可以在DRAM中复制的区域以及在接通电源或通过加载指令之后将数据传送到DRAM中,以与DRAM类似的速度读取速度。
    • 4. 发明授权
    • Memory module, memory system, and information device
    • 内存模块,内存系统和信息设备
    • US07613880B2
    • 2009-11-03
    • US10536460
    • 2003-11-27
    • Seiji MiuraKazushige Ayukawa
    • Seiji MiuraKazushige Ayukawa
    • G06F12/00
    • G11C11/005G06F12/0638G06F2212/2022G11C7/20G11C11/4072H01L2224/48091H01L2224/48137H01L2924/00014
    • A memory system including large-capacity ROM and RAM in which high-speed reading and writing are enabled is provided. A memory system including a non-volatile memory (CHIP1), DRAM (CHIP3), a control circuit (CHIP2) and an information processing device (CHIP4) is configured. Data in FLASH is transferred to SRAM or DRAM in advance to speed up. Data transfer between the non-volatile memory (FLASH) and DRAM (CHIP3) can be performed in the background. The memory system including these plural chips is configured as a memory system module in which each chip is mutually laminated and each chip is wired via a ball grid array (BGA) and bonding wire between the chips. Data in FLASH can be read at the similar speed to that of DRAM by securing a region in which the data in FLASH can be copied in DRAM and transferring the data to DRAM in advance immediately after power is turned on or by a load instruction.
    • 提供了包括大容量ROM和RAM的存储器系统,其中启用了高速读写。 配置包括非易失性存储器(CHIP1),DRAM(CHIP3),控制电路(CHIP2)和信息处理设备(CHIP4))的存储器系统。 FLASH中的数据提前传输到SRAM或DRAM,以加快速度。 在非易失性存储器(FLASH)和DRAM(CHIP3)之间的数据传输可以在后台执行。 包括这些多个芯片的存储器系统被配置为存储器系统模块,其中每个芯片相互层叠,并且每个芯片经由球栅阵列(BGA)和芯片之间的接合线布线。 FLASH中的数据可以通过保护FLASH中的数据可以在DRAM中复制的区域以及在接通电源或通过加载指令之后将数据传送到DRAM中,以与DRAM类似的速度读取速度。