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1. 发明申请

US20060060882A1 Optical semiconductor device, optical communication device, and electronic equipment 失效
标题翻译：光学半导体器件，光通信设备和电子设备
公开(公告)号：US20060060882A1
公开(公告)日：2006-03-23
申请号：US11230822
申请日：2005-09-21
申请人： Nobuyuki Ohe , Kazuhito Nagura , Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
发明人： Nobuyuki Ohe , Kazuhito Nagura , Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
IPC分类号： H01L33/00
CPC分类号： H01L31/0203 , G02B6/4212 , H01L33/56 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00011 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/01049
摘要： An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., −40° C.−+85° C.)
摘要翻译：光学半导体器件具有诸如LED或PD的光学半导体元件（2）和封装光学半导体元件的透光树脂（4）。透光树脂含有基础树脂和填料。透光性树脂（4）具有其工作温度范围（例如-40℃〜+ 85℃）内的温度上升的透过率的特性，

2. 发明申请

US20060054901A1 Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment 失效
标题翻译：光半导体装置及其制造方法，引线框架和电子设备
公开(公告)号：US20060054901A1
公开(公告)日：2006-03-16
申请号：US11226434
申请日：2005-09-15
申请人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
发明人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L25/167 , H01L21/565 , H01L23/3135 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48599 , H01L2224/73265 , H01L2224/85051 , H01L2224/8592 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01055 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/351 , H01L2224/85186 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.
摘要翻译：将光学半导体元件2安装在引线框架1上，用具有透光性的第一层的模制树脂部分14封装光学半导体元件2，并且用模具封装第一层的模制树脂部分14 具有透光性的第二层的树脂部分15。然后，使第一层的模制树脂部分14的线膨胀系数小于第二层的模制树脂部分15的线性膨胀系数。

3. 发明授权

US5648687A Resin for sealing compound semiconductor, semiconductor device, and process for manufacturing it 失效
标题翻译：用于密封化合物半导体的树脂，半导体器件及其制造方法
公开(公告)号：US5648687A
公开(公告)日：1997-07-15
申请号：US207165
申请日：1994-03-08
申请人： Yoshihiko Matsuo , Kazuo Kusuda , Naoki Sata , Toshihumi Yoshikawa , Tsuneo Matsumura
发明人： Yoshihiko Matsuo , Kazuo Kusuda , Naoki Sata , Toshihumi Yoshikawa , Tsuneo Matsumura
IPC分类号： C08G77/00 , C08G77/02 , H01L21/56 , H01L23/29 , H01L23/31 , H01L31/0203 , H01L31/12 , H01L33/30 , H01L33/54 , H01L33/56 , H01L33/62 , H01L23/28
CPC分类号： H01L31/0203 , H01L23/293 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L2924/181 , H01L2924/3025
摘要： A resin for sealing a compound semiconductor is here disclosed which contains, as a matrix, a siloxane compound for producing a silicone resin by addition reaction and which has a group comprising the bond of an organic group and an oxy group. The group comprising the bond of the organic group and the oxy group bonds to a terminal of the molecule of the siloxane compound, and as this group comprising the bond, 0.1 to 10% by weight, preferably 0.1 to 1.5% by weight of an alkoxy group (--OR') is used. A compound semiconductor chip is covered with the resin for sealing the compound semiconductor and then reacted under predetermined conditions to produce a silicone resin and simultaneously to chemically bond a siloxane group (--Si--O--) in the silicone resin to an element in a portion of the compound semiconductor chip which comes in contact with the silicone resin.
摘要翻译：这里公开了用于密封化合物半导体的树脂，其包含作为基质的通过加成反应制备硅氧烷树脂的硅氧烷化合物，并且具有包含有机基团和氧基的键的基团。包含有机基团和氧基键与硅氧烷化合物的分子的末端的基团，并且作为包含该键的基团，为0.1〜10重量％，优选为0.1〜1.5重量％的烷氧基使用组（-OR'）。化合物半导体芯片用树脂密封化合物半导体，然后在预定条件下反应以产生硅树脂，同时将硅氧烷树脂中的硅氧烷基团（-Si-O-）化学键合到部分中的元素与硅树脂接触的化合物半导体芯片。

4. 发明授权

US5285076A Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold 失效
标题翻译：光电器件，用于制造器件的金属模具和使用金属模具的器件的制造方法
公开(公告)号：US5285076A
公开(公告)日：1994-02-08
申请号：US63699
申请日：1993-05-20
申请人： Kazuo Kusuda , Katsunori Makiya
发明人： Kazuo Kusuda , Katsunori Makiya
IPC分类号： H01L23/495 , H01L25/075 , H01L31/0203 , H01L31/167 , H01L33/00 , G02B27/00
CPC分类号： H01L31/167 , H01L23/49575 , H01L24/97 , H01L25/167 , H01L31/0203 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/12041 , H01L2924/12043 , H01L2924/181
摘要： An optoelectronic device comprising: a plurality of light emitting elements; light receiving elements, each light receiving element facing a light emitting element; a lead made of a thin metal plate and having the light receiving elements fixed thereon, the lead being connected by wires to ground electrodes provided on the light receiving elements; a plurality of ground terminals common to the light receiving elements and integrated with the lead; an inner package, made of translucid resin, for separately sealing each pair of the facing light emitting elements and light receiving elements; and a package, made of resin having light interrupting properties, for sealing the entire inner package. Also, a metal mold that can simultaneously mold a plurality of the inner packages; and a manufacturing method of the optoelectronic device using the metal mold, comprising the steps of: molding the inner package; and then molding the package. Accordingly, a miniature optoelectronic device which has a small number of terminals and in which no crosstalk occurs can be achieved and efficiently manufactured.
摘要翻译：一种光电器件，包括：多个发光元件; 光接收元件，每个光接收元件面向发光元件; 由薄金属板制成并具有固定在其上的光接收元件的引线，引线通过导线连接到设置在光接收元件上的接地电极; 多个接地端子，与光接收元件共同并且与引线成一体; 由透明树脂制成的内包装，用于单独密封每对面对的发光元件和光接收元件; 以及由具有光中断性的树脂制成的封装，用于密封整个内包装。另外，可以同时模制多个内部包装件的金属模具; 以及使用金属模具的光电子器件的制造方法，包括以下步骤：模制内部封装; 然后成型包装。因此，可以实现并且有效地制造具有少量端子并且不发生串扰的微型光电子器件。

5. 发明授权

US07234231B2 Method of manufacturing a lead frame 有权
标题翻译：制造引线框架的方法
公开(公告)号：US07234231B2
公开(公告)日：2007-06-26
申请号：US10974910
申请日：2004-10-28
申请人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
发明人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
IPC分类号： H01R43/00
CPC分类号： H01L23/49565 , H01L21/4842 , H01L24/45 , H01L24/48 , H01L25/167 , H01L31/12 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/01038 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/3025 , Y10T29/49117 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/5111 , H01L2924/00014 , H01L2924/00012
摘要： A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the tie bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames, in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.
摘要翻译：光耦合装置的制造方法包括：准备细长的引线框架，多个连接杆放置在一对侧轨之间，所述多个连接杆彼此平行地彼此平行，以便与多个的引线端子以交错的形式被放置成正交地穿过连接杆，并且横向地切割细长的引线框架以制备多个带状引线框架，使得一个每个连接条的每个侧轨的切割端的长度大于从每个连接条引导端子的突出长度。

6. 发明授权

US06895664B2 Method of making an optical coupling device 失效
标题翻译：制造光耦合装置的方法
公开(公告)号：US06895664B2
公开(公告)日：2005-05-24
申请号：US10270005
申请日：2002-10-15
申请人： Hideya Takakura , Kazuo Kusuda
发明人： Hideya Takakura , Kazuo Kusuda
IPC分类号： H01L23/48 , H01L21/00 , H01L25/16 , H01L31/12 , H01R43/00
CPC分类号： H01L21/67144 , H01L25/167 , H01L2224/45144 , H01L2224/48247 , H01L2924/3025 , Y10T29/49121 , Y10T29/4913 , H01L2924/00014 , H01L2924/00
摘要： A lead frame of an optical coupling device of the present invention is so arranged that (a) a light-emitting side section in which a plurality of header sections for mounting thereon the light-emitting elements are aligned and (b) a light-receiving side section in which a plurality of header sections for mounting thereon the light-receiving element are aligned, and (c) a connecting section for connecting the light-emitting side section and the light-receiving side section in parallel into one body. The light-emitting side section and the light-receiving side section are integrated via a connecting section at which a V groove is formed for facilitating the folding of the lead frame. As a result, it is possible to provide a low-cost lead frame of an optical coupling device with a small number of components can be realized, in a simplified manner, and a manufacturing method of the optical coupling device.
摘要翻译：本发明的光耦合装置的引线框架被配置为：（a）其上安装有发光元件的多个集管部分对准的发光侧部分，（b）光接收部其中多个用于安装在其上的光接收元件的集管部分对准的侧面部分，以及（c）用于将发光侧部分和光接收侧部分平行连接成一体的连接部分。发光侧部分和光接收侧部分通过形成V沟槽的连接部分一体化，以便引导框架的折叠。结果，可以以简单的方式提供具有少量部件的光耦合装置的低成本引线框架和光耦合装置的制造方法。

7. 发明授权

US06507035B1 Photocoupler device, method for fabricating the same, and lead frame for photocoupler device 失效
标题翻译：光耦合装置及其制造方法以及光电耦合器装置的引线框架
公开(公告)号：US06507035B1
公开(公告)日：2003-01-14
申请号：US09482278
申请日：2000-01-13
申请人： Yasushi Hasegawa , Hideya Takakura , Kazuo Kusuda
发明人： Yasushi Hasegawa , Hideya Takakura , Kazuo Kusuda
IPC分类号： G02B2700
CPC分类号： H01L31/167 , H01L25/167 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A photocoupler device includes a light emitting element; a monitor photodetector and an output photodetector for receiving light from the light emitting element; a primary side lead frame for mounting the light emitting element and the monitor photodetector; and a secondary side lead frame for mounting the output photodetector, wherein the light emitting element and the output photodetector are placed so as to face each other.
摘要翻译：光电耦合器件包括发光元件; 监视器光电检测器和用于接收来自发光元件的光的输出光电检测器; 用于安装发光元件和监视器光电检测器的初级侧引线框架; 以及用于安装输出光电检测器的次级侧引线框架，其中发光元件和输出光电检测器被放置成彼此面对。

8. 发明授权

US06270712B1 Molding die and marking method for semiconductor devices 失效
标题翻译：半导体器件的成形模具和标记方法
公开(公告)号：US06270712B1
公开(公告)日：2001-08-07
申请号：US09248142
申请日：1999-02-09
申请人： Hiroyuki Shoji , Kazuo Kusuda , Tsuneo Matsumura
发明人： Hiroyuki Shoji , Kazuo Kusuda , Tsuneo Matsumura
IPC分类号： B29C4502
CPC分类号： B29C45/14655 , B29C33/424 , B29C45/372 , H01L21/565 , H01L23/544 , H01L24/45 , H01L24/48 , H01L31/167 , H01L2223/54406 , H01L2223/54473 , H01L2223/54486 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
摘要： An object of the invention is to eliminate a marking process and shorten the time and decrease the cost required for changing contents of marking. An uneven mask is mounted, using a mask set jig, on a mark surface die of the molding die for forming a resin mold package of a semiconductor device. The mark surface die is formed with jig-fixing grooves for mounting the mask set jig. The uneven mask is formed with protrusions and recesses corresponding to the contents of marking to be attached to the surface of the resin mold package. The contents of marking can thus be attached simultaneously with the molding process, and therefore the marking process after molding can be omitted. In accordance with the contents of marking, the uneven mask can be replaced. The time and cost required for changing the contents of marking can thus be reduced.
摘要翻译：本发明的目的是消除标记过程并缩短时间并降低改变标记内容所需的成本。使用掩模组装夹具将不均匀的掩模安装在用于形成半导体器件的树脂模制包装的成型模具的标记表面模具上。标记面模具形成有用于安装掩模组装夹具的夹具固定槽。不均匀掩模形成有与要附着到树脂模包装表面上的标记内容物相对应的突出部和凹部。因此，标记的内容可以与成型工艺同时附着，因此可以省略成型后的标记处理。根据标记的内容，可以更换不均匀的面膜。因此可以减少改变标记内容所需的时间和成本。

9. 发明申请

US20050091842A1 Manufacturing method of lead frame for optical coupling device as well as optical coupling device using this lead frame 有权
标题翻译：用于光耦合器件的引线框架的制造方法以及使用该引线框架的光耦合器件
公开(公告)号：US20050091842A1
公开(公告)日：2005-05-05
申请号：US10974910
申请日：2004-10-28
申请人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
发明人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
IPC分类号： H01L23/50 , H01L21/48 , H01L23/495 , H01L25/16 , H01L31/12 , H01L31/18 , H01R43/00
CPC分类号： H01L23/49565 , H01L21/4842 , H01L24/45 , H01L24/48 , H01L25/167 , H01L31/12 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/01038 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/3025 , Y10T29/49117 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/5111 , H01L2924/00014 , H01L2924/00012
摘要： In a manufacturing method of a lead frame for an optical coupling device, the method includes the steps of preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames. Herein, the elongated lead frame is cut in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.
摘要翻译：在一种用于光耦合装置的引线框架的制造方法中，该方法包括以下步骤：制备细长的引线框架，多个连接杆放置在彼此相互平行的一对侧轨之间，从而以正交方式穿过杆，其中多个引线端子以交错的形式被放置成正交地穿过连接杆，并横向切割细长引线框架以制备多个带状引线框架。这里，细长引线框架以这样的方式被切割，使得每个侧栏的每个侧轨的切割端的突出长度比每个连接条的引线端子的突出长度长酒吧。

10. 发明授权

US07425727B2 Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment 失效
标题翻译：光半导体装置及其制造方法，引线框架和电子设备
公开(公告)号：US07425727B2
公开(公告)日：2008-09-16
申请号：US11226434
申请日：2005-09-15
申请人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
发明人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
IPC分类号： H01L21/00
CPC分类号： H01L25/167 , H01L21/565 , H01L23/3135 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48599 , H01L2224/73265 , H01L2224/85051 , H01L2224/8592 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01055 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/351 , H01L2224/85186 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.
摘要翻译：将光学半导体元件2安装在引线框架1上，用具有透光性的第一层的模制树脂部分14封装光学半导体元件2，并且用模具封装第一层的模制树脂部分14 具有透光性的第二层的树脂部分15。然后，使第一层的模制树脂部分14的线膨胀系数小于第二层的模制树脂部分15的线性膨胀系数。

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