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1. 发明授权

US5245198A Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold 失效
标题翻译：光电器件，用于制造器件的金属模具和使用金属模具的器件的制造方法
公开(公告)号：US5245198A
公开(公告)日：1993-09-14
申请号：US772883
申请日：1991-10-08
申请人： Kazuo Kusuda , Katsunori Makiya
发明人： Kazuo Kusuda , Katsunori Makiya
IPC分类号： H01L23/495 , H01L25/075 , H01L31/0203 , H01L31/167 , H01L33/00
CPC分类号： H01L31/167 , H01L23/49575 , H01L24/97 , H01L25/167 , H01L31/0203 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/12041 , H01L2924/12043 , H01L2924/181
摘要： An optoelectronic device comprising: a plurality of light emitting elements; light receiving elements, each light receiving element facing a light emitting element; a lead made of a thin metal plate and having the light receiving elements fixed thereon, the lead being connected by wires to ground electrodes provided on the light receiving elements; a plurality of ground terminals common to the light receiving elements and integrated with the lead; an inner package, made of translucid resin, for separately sealing each pair of the facing light emitting elements and light receiving elements; and a package, made of resin having light interrupting properties, for sealing the entire inner package. Also, a metal mold that can simultaneously mold a plurality of the inner packages; and a manufacturing method of the optoelectronic device using the metal mold, comprising the steps of: molding the inner package; and then molding the package. Accordingly, a miniature optoelectronic device which has a small number of terminals and in which no crosstalk occurs can be achieved and efficiently manufactured.
摘要翻译：一种光电器件，包括：多个发光元件; 光接收元件，每个光接收元件面向发光元件; 由薄金属板制成并具有固定在其上的光接收元件的引线，引线通过导线连接到设置在光接收元件上的接地电极; 多个接地端子，与光接收元件共同并且与引线成一体; 由透明树脂制成的内包装，用于单独密封每对面对的发光元件和光接收元件; 以及由具有光中断性的树脂制成的封装，用于密封整个内包装。另外，可以同时模制多个内部包装件的金属模具; 以及使用金属模具的光电子器件的制造方法，包括以下步骤：模制内部封装; 然后成型包装。因此，可以实现并且有效地制造具有少量端子并且不发生串扰的微型光电子器件。

2. 发明授权

US06507048B1 Light coupled device with insulating and light shielding element and light insulating and transmitting element 失效
标题翻译：具有绝缘和遮光元件的光耦合器件和光隔离和发射元件
公开(公告)号：US06507048B1
公开(公告)日：2003-01-14
申请号：US09643905
申请日：2000-08-23
申请人： Katsunori Makiya
发明人： Katsunori Makiya
IPC分类号： H01L3300
CPC分类号： H01L31/167
摘要： The invention provides a lead frame size requiring a reduced area, and a package reduced in size. Adjacent light couplings have an insulating and light shielding element disposed therebetween to block a light transmission from one to the other. The insulating and light shielding element allows the light couplings to be arranged close together while preventing crosstalk occurring therebetween. In another construction, a primary light coupling section and a secondary light coupling section are formed around each light emitting element on the primary side and each light receiving element on the secondary side. The primary and secondary light coupling sections are optically interconnected through an insulating and light transmitting element. This construction realizes optical paths of reduced volume, and secures a sufficient distance for preventing crosstalk even where adjacent light couplings are arranged with a reduced distance therebetween.
摘要翻译：本发明提供了一种需要减小面积的引线框尺寸和尺寸减小的封装。相邻的光耦合器具有设置在它们之间的绝缘和屏蔽元件，以阻挡从一个到另一个的光透射。绝缘和遮光元件允许光耦合器紧密配置在一起，同时防止它们之间发生串扰。在另一种结构中，在初级侧的每个发光元件和次级侧上的每个光接收元件周围形成初级光耦合部分和次级光耦合部分。主和次级光耦合部分通过绝缘和光透射元件光学互连。这种结构实现了体积减小的光路，并且即使在相邻的光耦合之间以较小的距离布置的情况下，也可以确保足够的距离以防止串扰。

3. 发明授权

US5285076A Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold 失效
标题翻译：光电器件，用于制造器件的金属模具和使用金属模具的器件的制造方法
公开(公告)号：US5285076A
公开(公告)日：1994-02-08
申请号：US63699
申请日：1993-05-20
申请人： Kazuo Kusuda , Katsunori Makiya
发明人： Kazuo Kusuda , Katsunori Makiya
IPC分类号： H01L23/495 , H01L25/075 , H01L31/0203 , H01L31/167 , H01L33/00 , G02B27/00
CPC分类号： H01L31/167 , H01L23/49575 , H01L24/97 , H01L25/167 , H01L31/0203 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/12041 , H01L2924/12043 , H01L2924/181
摘要： An optoelectronic device comprising: a plurality of light emitting elements; light receiving elements, each light receiving element facing a light emitting element; a lead made of a thin metal plate and having the light receiving elements fixed thereon, the lead being connected by wires to ground electrodes provided on the light receiving elements; a plurality of ground terminals common to the light receiving elements and integrated with the lead; an inner package, made of translucid resin, for separately sealing each pair of the facing light emitting elements and light receiving elements; and a package, made of resin having light interrupting properties, for sealing the entire inner package. Also, a metal mold that can simultaneously mold a plurality of the inner packages; and a manufacturing method of the optoelectronic device using the metal mold, comprising the steps of: molding the inner package; and then molding the package. Accordingly, a miniature optoelectronic device which has a small number of terminals and in which no crosstalk occurs can be achieved and efficiently manufactured.
摘要翻译：一种光电器件，包括：多个发光元件; 光接收元件，每个光接收元件面向发光元件; 由薄金属板制成并具有固定在其上的光接收元件的引线，引线通过导线连接到设置在光接收元件上的接地电极; 多个接地端子，与光接收元件共同并且与引线成一体; 由透明树脂制成的内包装，用于单独密封每对面对的发光元件和光接收元件; 以及由具有光中断性的树脂制成的封装，用于密封整个内包装。另外，可以同时模制多个内部包装件的金属模具; 以及使用金属模具的光电子器件的制造方法，包括以下步骤：模制内部封装; 然后成型包装。因此，可以实现并且有效地制造具有少量端子并且不发生串扰的微型光电子器件。

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