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1. 发明授权

US08599170B2 Optical pointing device and electronic equipments 有权
标题翻译：光指向装置和电子设备
公开(公告)号：US08599170B2
公开(公告)日：2013-12-03
申请号：US12854271
申请日：2010-08-11
申请人： Hideya Takakura
发明人： Hideya Takakura
IPC分类号： G06F3/045 , H01H21/04 , F21V7/04
CPC分类号： G06F3/03547 , G06F3/042
摘要： Light emitted from a light source such as LED and reflected by a fingertip is guided by a cover member onto a light receiving surface of an imaging element. A second resin part is provided that is in contact with the cover member and a resin molded part sealing the imaging element. The reflected light guided by the cover member is made to reach the light receiving surface via the second resin part and the resin molded part, traveling along a path spaced apart from an air layer.
摘要翻译：从诸如LED的光源发射并由指尖反射的光由盖构件引导到成像元件的光接收表面上。提供与盖构件接触的第二树脂部件和密封成像元件的树脂模制部件。由盖构件引导的反射光通过第二树脂部分和树脂模制部分沿着与空气层间隔开的路径行进到达光接收表面。

2. 发明申请

US20120188385A1 OPTICAL POINTING DEVICE AND ELECTRONIC EQUIPMENT PROVIDED WITH THE SAME, AND LIGHT-GUIDE AND LIGHT-GUIDING METHOD 审中-公开
标题翻译：光点指示装置及其提供的电子设备，以及指南和指导方法
公开(公告)号：US20120188385A1
公开(公告)日：2012-07-26
申请号：US13499186
申请日：2010-09-29
申请人： Takahiro Miyake , Renzaburou Miki , Tetsushi Noro , Hideya Takakura
发明人： Takahiro Miyake , Renzaburou Miki , Tetsushi Noro , Hideya Takakura
IPC分类号： H04N5/225 , F21V7/04 , F21V7/00
CPC分类号： G02B6/43 , G02B6/4214 , G06F3/042 , G06F2203/04109
摘要： In order to reduce the number of components in the optical pointing device, and the number of steps for assembling, bonding, etc. the components, a light guide (24) according to the present invention for use in an optical pointing device (30) is configured to include a redirecting element (12) for receiving light from a touch surface (11) and reflecting the light so as to guide the light into a horizontal direction, and an image forming section (14) for receiving the reflected light and reflecting the reflected light to an opposite direction backward to the horizontal direction, so as to form an image of the light, the light guide (24) outputting the image of the light from a light output section.
摘要翻译：为了减少光学指向装置中的部件的数量，以及用于组装，接合等部件的步骤的数量，根据本发明的用于光学指向装置（30）的光导（24）被配置为包括用于从触摸表面（11）接收光并反射光以将光引导到水平方向的重定向元件（12），以及用于接收反射光并反射的图像形成部分反射光向与水平方向相反的方向反射，从而形成光的图像，导光体（24）输出来自光输出部的光的图像。

3. 发明申请

US20090074352A1 BIDIRECTIONAL OPTICAL TRANSMISSION DEVICE 审中-公开
标题翻译：双向光传输设备
公开(公告)号：US20090074352A1
公开(公告)日：2009-03-19
申请号：US12207268
申请日：2008-09-09
申请人： Ikuo KOHASHI , Hideya Takakura
发明人： Ikuo KOHASHI , Hideya Takakura
IPC分类号： G02B6/12
CPC分类号： G02B6/4246 , G02B6/4204 , H01L24/45 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/12043 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In a bidirectional optical transmission device, a light-emitting element and a light-receiving element are mounted on one side of a base material and are sealed with an optically permeable resin section. The resin section includes a light emitting side resin section and a light receiving side resin section, and a slit is provided between these resin sections. The device further includes a light-blocking receptacle having a claw, and the claw of the receptacle is disposed in the slit between the light emitting side resin section and the light receiving side resin section. The claw of the receptacle prevents leakage of light from the light-emitting element between the light-emitting element and the light-receiving element.
摘要翻译：在双向光传输装置中，发光元件和光接收元件安装在基材的一侧，并用光学透光树脂部分密封。树脂部分包括发光侧树脂部分和光接收侧树脂部分，并且在这些树脂部分之间设置狭缝。该装置还包括具有爪的遮光容器，并且插座的爪设置在发光侧树脂部和光接收侧树脂部之间的狭缝中。容器的爪子防止发光元件和光接收元件之间的发光元件的光的泄漏。

4. 发明授权

US07425727B2 Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment 失效
标题翻译：光半导体装置及其制造方法，引线框架和电子设备
公开(公告)号：US07425727B2
公开(公告)日：2008-09-16
申请号：US11226434
申请日：2005-09-15
申请人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
发明人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
IPC分类号： H01L21/00
CPC分类号： H01L25/167 , H01L21/565 , H01L23/3135 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48599 , H01L2224/73265 , H01L2224/85051 , H01L2224/8592 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01055 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/351 , H01L2224/85186 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.
摘要翻译：将光学半导体元件2安装在引线框架1上，用具有透光性的第一层的模制树脂部分14封装光学半导体元件2，并且用模具封装第一层的模制树脂部分14 具有透光性的第二层的树脂部分15。然后，使第一层的模制树脂部分14的线膨胀系数小于第二层的模制树脂部分15的线性膨胀系数。

5. 发明申请

US20050091842A1 Manufacturing method of lead frame for optical coupling device as well as optical coupling device using this lead frame 有权
标题翻译：用于光耦合器件的引线框架的制造方法以及使用该引线框架的光耦合器件
公开(公告)号：US20050091842A1
公开(公告)日：2005-05-05
申请号：US10974910
申请日：2004-10-28
申请人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
发明人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
IPC分类号： H01L23/50 , H01L21/48 , H01L23/495 , H01L25/16 , H01L31/12 , H01L31/18 , H01R43/00
CPC分类号： H01L23/49565 , H01L21/4842 , H01L24/45 , H01L24/48 , H01L25/167 , H01L31/12 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/01038 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/3025 , Y10T29/49117 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/5111 , H01L2924/00014 , H01L2924/00012
摘要： In a manufacturing method of a lead frame for an optical coupling device, the method includes the steps of preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames. Herein, the elongated lead frame is cut in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.
摘要翻译：在一种用于光耦合装置的引线框架的制造方法中，该方法包括以下步骤：制备细长的引线框架，多个连接杆放置在彼此相互平行的一对侧轨之间，从而以正交方式穿过杆，其中多个引线端子以交错的形式被放置成正交地穿过连接杆，并横向切割细长引线框架以制备多个带状引线框架。这里，细长引线框架以这样的方式被切割，使得每个侧栏的每个侧轨的切割端的突出长度比每个连接条的引线端子的突出长度长酒吧。

6. 发明申请

US20090196545A1 OPTICAL-ELECTRICAL COMPOSITE TRANSMISSION DEVICE AND ELECTRONIC EQUIPMENT 有权
标题翻译：光电复合传输设备和电子设备
公开(公告)号：US20090196545A1
公开(公告)日：2009-08-06
申请号：US12349635
申请日：2009-01-07
申请人： Hideya TAKAKURA
发明人： Hideya TAKAKURA
IPC分类号： G02B6/12 , G02B6/44
CPC分类号： G02B6/4416 , G02B6/43
摘要： An optical-electrical composite cable as an example of an optical-electrical composite transmission device has a flexible board as an electrical signal transmission member having an electric wiring section, and an optical fiber as an optical signal transmission member. The optical fiber is passed through a plurality of holes formed in a resin base section of the flexible board so as to thread through the resin base section. The flexible board and the optical fiber are integrated so as not to be separated from each other, so that even when the characteristics (tensile strength, thermal expansion coefficient) of the transmission lines respectively embodied by the flexible board and the optical fiber are different, the optical-electrical composite cable has stable flexibility as a whole.
摘要翻译：作为光电复合传输装置的实例的光电复合电缆具有作为具有电布线部分的电信号传输部件的柔性板，以及作为光信号传输部件的光纤。光纤穿过形成在柔性板的树脂基部中的多个孔，以便穿过树脂基部。柔性基板和光纤被集成为不会彼此分离，使得即使分别由柔性板和光纤实现的传输线的特性（拉伸强度，热膨胀系数）不同，光电复合电缆整体上具有稳定的柔性。

7. 发明申请

US20060060882A1 Optical semiconductor device, optical communication device, and electronic equipment 失效
标题翻译：光学半导体器件，光通信设备和电子设备
公开(公告)号：US20060060882A1
公开(公告)日：2006-03-23
申请号：US11230822
申请日：2005-09-21
申请人： Nobuyuki Ohe , Kazuhito Nagura , Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
发明人： Nobuyuki Ohe , Kazuhito Nagura , Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
IPC分类号： H01L33/00
CPC分类号： H01L31/0203 , G02B6/4212 , H01L33/56 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00011 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/01049
摘要： An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., −40° C.−+85° C.)
摘要翻译：光学半导体器件具有诸如LED或PD的光学半导体元件（2）和封装光学半导体元件的透光树脂（4）。透光树脂含有基础树脂和填料。透光性树脂（4）具有其工作温度范围（例如-40℃〜+ 85℃）内的温度上升的透过率的特性，

8. 发明申请

US20060054901A1 Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment 失效
标题翻译：光半导体装置及其制造方法，引线框架和电子设备
公开(公告)号：US20060054901A1
公开(公告)日：2006-03-16
申请号：US11226434
申请日：2005-09-15
申请人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
发明人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L25/167 , H01L21/565 , H01L23/3135 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48599 , H01L2224/73265 , H01L2224/85051 , H01L2224/8592 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01055 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/351 , H01L2224/85186 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.
摘要翻译：将光学半导体元件2安装在引线框架1上，用具有透光性的第一层的模制树脂部分14封装光学半导体元件2，并且用模具封装第一层的模制树脂部分14 具有透光性的第二层的树脂部分15。然后，使第一层的模制树脂部分14的线膨胀系数小于第二层的模制树脂部分15的线性膨胀系数。

9. 发明申请

US20100101626A1 SOLAR BATTERY APPARATUS, PORTABLE ELECTRONIC DEVICE, AND GLOBAL POSITIONING SYSTEM APPARATUS 审中-公开
标题翻译：太阳能电池设备，便携式电子设备和全球定位系统设备
公开(公告)号：US20100101626A1
公开(公告)日：2010-04-29
申请号：US12603926
申请日：2009-10-22
申请人： Yoshihide Iwazaki , Hiroyuki Nakanishi , Kohji Miyata , Masahiro Okita , Hideya Takakura
发明人： Yoshihide Iwazaki , Hiroyuki Nakanishi , Kohji Miyata , Masahiro Okita , Hideya Takakura
IPC分类号： H02N6/00
CPC分类号： H04M19/08 , G03B17/02 , H01L31/02008 , H01L31/022433 , H01L31/0504 , Y02D70/122 , Y02D70/164 , Y02E10/50
摘要： A solar battery apparatus 10 has a plurality of solar battery cells 3 and electrode terminals 4, other than common electrode terminals, for making an electrical connection (i) between each of the solar battery cells 3 and another or (ii) between the solar battery cell 3 and an external apparatus, the solar battery apparatus 10 including: metal wires 5 for making an electrical connection between the solar battery cell 3 and the electrode terminals 4 in a plurality of places on the solar battery cell 3, whereby a decrease in power generation capacity of the solar battery cell 3 is prevented even if the solar battery cell 3 is ruptured by a physical force. This makes it possible to provide a solar battery apparatus in which a decrease in power generation capacity of a solar battery cell can be prevented even if the solar battery cell is ruptured by a physical force.
摘要翻译：太阳能电池装置10具有多个太阳能电池单元3和除公共电极端子之外的电极端子4，用于在每个太阳能电池单元3与另一个之间进行电连接（i），或者（ii）太阳能电池电池3和外部装置，太阳能电池装置10包括：用于在太阳能电池单元3的多个位置中在太阳能电池单元3和电极端子4之间进行电连接的金属线5，由此功率的降低即使太阳能电池单元3被物理力破坏，太阳能电池单元3的发电能力也被防止。这使得可以提供太阳能电池装置，其中即使太阳能电池单元被物理力破坏，也能够防止太阳能电池单元的发电量的降低。

10. 发明授权

US07410305B2 Optical semiconductor device, optical communication device, and electronic equipment 失效
标题翻译：光学半导体器件，光通信设备和电子设备
公开(公告)号：US07410305B2
公开(公告)日：2008-08-12
申请号：US11230822
申请日：2005-09-21
申请人： Nobuyuki Ohe , Kazuhito Nagura , Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
发明人： Nobuyuki Ohe , Kazuhito Nagura , Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
IPC分类号： G02B6/36
CPC分类号： H01L31/0203 , G02B6/4212 , H01L33/56 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00011 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/01049
摘要： An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., −40° C.−+85° C.).
摘要翻译：光学半导体器件具有诸如LED或PD的光学半导体元件（2）和封装光学半导体元件的透光树脂（4）。透光树脂含有基础树脂和填料。透光性树脂（4）具有其工作温度范围（例如-40℃〜+ 85℃）内的温度上升的透过率的特性。

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