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1. 发明申请

WO2013181288A1 OUTPUTTING A DROPLET OF LIQUID MEDIUM FROM A DEVICE FOR PROCESSING MICRO-OBJECTS IN THE MEDIUM 审中-公开
标题翻译：从用于在介质中处理微型物体的装置输出液体液滴
公开(公告)号：WO2013181288A1
公开(公告)日：2013-12-05
申请号：PCT/US2013/043174
申请日：2013-05-29
申请人： BERKELEY LIGHTS, INC. , KHANDROS, Igor, Y. , MATHIEU, Gaetan, L. , NEVILL, J., Tannier , WU, Ming,. G.
发明人： KHANDROS, Igor, Y. , MATHIEU, Gaetan, L. , NEVILL, J., Tannier , WU, Ming,. G.
IPC分类号： G01N35/08 , G01N15/14 , G01N1/10
CPC分类号： B81B1/00 , B01L3/0268 , B01L3/502761 , B01L2200/0668 , B01L2300/0816 , B01L2300/0864 , B01L2300/0874 , B01L2400/0439 , B01L2400/0454 , B01L2400/0481 , B03C5/005 , B03C5/022 , B03C5/026 , B03C2201/26
摘要： A micro-fluidic device can include a processing mechanism for processing micro-objects in a liquid medium and an outputting mechanism for expressing from the device a droplet of the medium containing one or more of the micro-objects. The outputting mechanism can include an expressing mechanism having a reservoir for holding a quantity of the liquid medium and a striking mechanism for striking and compressing the expressing mechanism to express a droplet of the medium from the expressing mechanism.
摘要翻译：微流体装置可以包括用于处理液体介质中的微物体的处理机构和用于从装置表达包含一个或多个微物体的介质的液滴的输出机构。输出机构可以包括具有用于保持一定量的液体介质的储存器的表达机构和用于敲击和压缩表达机构以从表达机构表达介质液滴的打击机构。

2. 发明申请

WO2007124050A3 PROBE STRUCTURES WITH ELECTRONIC COMPONENTS 审中-公开
标题翻译：具有电子元件的探测结构
公开(公告)号：WO2007124050A3
公开(公告)日：2008-03-27
申请号：PCT/US2007009660
申请日：2007-04-19
申请人： FORMFACTOR INC , KHANDROS IGOR K , GRITTERS JOHN K
发明人： KHANDROS IGOR K , GRITTERS JOHN K
IPC分类号： G01R31/02
CPC分类号： G01R31/312 , G01R1/06727 , G01R1/06744 , G01R1/07342 , G01R3/00
摘要： A probe apparatus can include a substrate, a contact structure attached to the substrate, and an electronic component electrically connected to the contact structure. The electronic component can be attached to the contact structure.
摘要翻译：探针装置可以包括衬底，附接到衬底的接触结构和电连接到接触结构的电子部件。电子部件可以附接到接触结构。

3. 发明申请

WO2006037056A2 STACKED DIE MODULE 审中-公开
标题翻译：堆叠模块
公开(公告)号：WO2006037056A2
公开(公告)日：2006-04-06
申请号：PCT/US2005/034861
申请日：2005-09-26
申请人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , MILLER, Charles, A. , BARBARA, Bruce, J. , VASQUEZ, Barbara
发明人： KHANDROS, Igor, Y. , MILLER, Charles, A. , BARBARA, Bruce, J. , VASQUEZ, Barbara
IPC分类号： H01L23/02 , H01L23/52
CPC分类号： H01L24/48 , H01L23/13 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/05554 , H01L2224/05599 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/48465 , H01L2224/4911 , H01L2224/73215 , H01L2224/73265 , H01L2224/85186 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01031 , H01L2924/01033 , H01L2924/01082 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： Semiconductor dies are stacked offset from one another so that terminals located along two edges of each die are exposed. The two edges of the dies having terminals may be oriented in the same direction. Electrical connections may connect terminals on one die with terminals on another die, and the stack may be disposed on a wiring substrate to which the terminals of the dies may be electrically connected.
摘要翻译：半导体管芯彼此堆叠地堆叠，使得沿着每个管芯的两个边缘定位的端子被暴露。具有端子的模具的两个边缘可以沿相同的方向定向。电连接可以将一个管芯上的端子与另一个管芯上的端子连接，并且堆叠可以布置在可以电连接管芯的端子的布线基板上。

4. 发明申请

WO2005081001A1 PROBING A DEVICE 审中-公开
标题翻译：探索一个设备
公开(公告)号：WO2005081001A1
公开(公告)日：2005-09-01
申请号：PCT/US2005/005087
申请日：2005-02-15
申请人： FORMFACTOR, INC. , COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
发明人： COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。然后电子设备水平或对角地移动，使得端子接触探针。然后通过探头将测试数据传送到电子设备和从电子设备传送。

5. 发明申请

WO2005055369A2 METHODS FOR MAKING VERTICAL ELECTRICAL FEED THROUGH STRUCTURES 审中-公开
标题翻译：通过结构制作垂直电气进给的方法
公开(公告)号：WO2005055369A2
公开(公告)日：2005-06-16
申请号：PCT/US2004/039394
申请日：2004-11-22
申请人： FORMFACTOR, INC. , MATHIEU, Gaetan, L. , KHANDROS, Igor, K. , REYNOLDS, Carl, V.
发明人： MATHIEU, Gaetan, L. , KHANDROS, Igor, K. , REYNOLDS, Carl, V.
IPC分类号： H01R
CPC分类号： H05K3/42 , G01R1/06711 , G01R1/07307 , G01R3/00 , H05K3/308 , H05K2201/09836 , H05K2203/0338
摘要： Methods are provided for making vertical feed through electrical connection structures in a substrate or tile. The vertical feed throughs can be configured to make plated through holes usable for inserting and attaching connector probes. . Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires. Vertical feed throughs can also be configured to make tiles attachable and detachable as a layer between other substrates. The vertical feed through paths are formed with one end of each feed through hole permanently encapsulating a first electrical contact, and a second end supporting another pluggable and unpluggable electrical probe contact. Decoupling capacitors can be further plugged into holes formed in close proximity to the vertical feed through holes to increase performance of the decoupling capacitor.
摘要翻译：提供了用于通过基底或瓦片中的电连接结构进行垂直馈送的方法。垂直进料通道可以配置为制造可用于插入和连接连接器探头的电镀通孔。。探针可以附着到电镀通孔或连接孔，以产生弹性弹簧触点，以形成晶片探针卡组件。通过将涂覆有电镀材料的扭转牺牲线支撑在基板中，并且随后蚀刻掉线来形成扭曲管镀通孔结构。垂直进料通道也可以被配置成使得瓦片可附着和分离成其它基底之间的层。垂直进料通道形成有每个进料通孔的一端，其永久地密封第一电接触，第二端支撑另一可插拔和可拔出的电探针接触。去耦电容器可以进一步插入靠近垂直馈通孔形成的孔中，以提高去耦电容的性能。

6. 发明申请

WO2007124050A2 PROBE STRUCTURES WITH ELECTRONIC COMPONENTS 审中-公开
标题翻译：具有电子元件的探测结构
公开(公告)号：WO2007124050A2
公开(公告)日：2007-11-01
申请号：PCT/US2007/009660
申请日：2007-04-19
申请人： FORMFACTOR, INC. , KHANDROS, Igor, K. , GRITTERS, John K.
发明人： KHANDROS, Igor, K. , GRITTERS, John K.
IPC分类号： G01R31/02
CPC分类号： G01R31/312 , G01R1/06727 , G01R1/06744 , G01R1/07342 , G01R3/00
摘要： A probe apparatus can include a substrate, a contact structure attached to the substrate, and an electronic component electrically connected to the contact structure. The electronic component can be attached to the contact structure.
摘要翻译：探针装置可以包括衬底，附接到衬底的接触结构和电连接到接触结构的电子部件。电子部件可以附接到接触结构。

7. 发明申请

WO2006068939A3 REMOTE TEST FACILITY WITH WIRELESS INTERFACE TO LOCAL TEST FACILITIES 审中-公开
标题翻译：远程测试设施与无线接口到本地测试设备
公开(公告)号：WO2006068939A3
公开(公告)日：2006-12-28
申请号：PCT/US2005045611
申请日：2005-12-15
申请人： FORMFACTOR INC , KHANDROS IGOR Y , ELDRIDGE BENJAMIN N
发明人： KHANDROS IGOR Y , ELDRIDGE BENJAMIN N
IPC分类号： G01R31/26 , G01R31/28
CPC分类号： G01R31/2884 , G01R31/3025 , G01R31/31907
摘要： A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.
摘要翻译：中央测试设备将无线测试数据传输到本地测试设备，该设备使用测试数据测试电子设备。本地测试设施将由电子设备生成的无线响应数据发送回中央测试设施，中央测试设施分析响应数据以确定哪些电子设备通过了测试。中央测试设施可以将测试结果提供给其他实体，例如设计电子设备的设计设施或制造电子设备的制造设施。中央测试设施可以接受来自多个本地测试设施中的任何一个的测试资源的请求，调度对应于每个测试请求的测试时间，并且在预定的测试时间，将测试数据无线传输到相应的本地测试设施。

8. 发明申请

WO2005055369A3 METHODS FOR MAKING VERTICAL ELECTRICAL FEED THROUGH STRUCTURES 审中-公开
标题翻译：通过结构制作垂直电气进给的方法
公开(公告)号：WO2005055369A3
公开(公告)日：2005-11-24
申请号：PCT/US2004039394
申请日：2004-11-22
申请人： FORMFACTOR INC , MATHIEU GAETAN L , KHANDROS IGOR K , REYNOLDS CARL V
发明人： MATHIEU GAETAN L , KHANDROS IGOR K , REYNOLDS CARL V
IPC分类号： G01R1/067 , G01R1/073 , G01R3/00 , H05K3/30 , H05K3/42 , H01K3/10
CPC分类号： H05K3/42 , G01R1/06711 , G01R1/07307 , G01R3/00 , H05K3/308 , H05K2201/09836 , H05K2203/0338
摘要： Methods are provide for making vertical feed through electrical connections structure in a substrate or tile. The vertical feed through (Fig. 2, 10) can be configured to make plated through holes usable for inserting and attaching connector probes ( Fig. 2, 12). Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure (Fig. 9D, 74) is formed by supporting twisted sacrificial wire coated with the plating material in a substrate (Fig. 9D, 79), and later etching away the wires (Fig. 9A, 74).
摘要翻译：提供了通过基板或瓦片中的电连接结构进行垂直馈送的方法。垂直馈送（图2,10）可以被配置为制造可用于插入和连接连接器探头的电镀通孔（图2,12）。探针可以附着到电镀通孔或连接孔，以产生弹性弹簧触点，以形成晶片探针卡组件。通过将涂覆有电镀材料的扭转牺牲线支撑在基板（图9D，79）中，并且随后蚀刻掉导线（图9A，74），形成通过电镀的通孔结构（图9D，74）。

9. 发明申请

WO9900844A3 SOCKETS FOR SEMICONDUCTOR DEVICES WITH SPRING CONTACT ELEMENTS 审中-公开
标题翻译：具有弹簧触点元件的半导体器件插座
公开(公告)号：WO9900844A3
公开(公告)日：1999-04-29
申请号：PCT/US9813692
申请日：1998-06-30
申请人： FORMFACTOR INC , DOZIER THOMAS H II , ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MATHIEU GAETAN L , PEDERSEN DAVID V , STADT MICHAEL A
发明人： DOZIER THOMAS H II , ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MATHIEU GAETAN L , PEDERSEN DAVID V , STADT MICHAEL A
IPC分类号： G01R1/04 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/48 , H01L23/538 , H05K3/30 , H05K3/32
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
摘要翻译：通过迫使电子元件，因此弹簧接触元件的端部竖直地抵靠互连基板的端子，或者通过水平地推动互连基板的端子来形成从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接抵靠弹簧接触元件的端部。公开了各种终端配置。

10. 发明申请

WO1996037332A1 FABRICATING INTERCONNECTS AND TIPS USING SACRIFICIAL SUBSTRATES 审中-公开
标题翻译：制造互连和使用基板的提示
公开(公告)号：WO1996037332A1
公开(公告)日：1996-11-28
申请号：PCT/US1996008107
申请日：1996-05-24
申请人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetean, L.
发明人： FORMFACTOR, INC.
IPC分类号： B23K31/02
CPC分类号： H05K3/4015 , B23K20/004 , B23K2101/40 , C23C18/1605 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/06711 , G01R1/06727 , G01R1/07357 , G01R3/00 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L23/66 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/05644 , H01L2224/05647 , H01L2224/06136 , H01L2224/11003 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48644 , H01L2224/48647 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2224/48744 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754 , H01L2224/05599
摘要： Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784). In this manner, the electronic components (784) are not "at risk" during the fabrication process. The sacrificial substrate (702) establishes a predetermined spatial relationship between the interconnection elements (752) which may be composite interconnection elements (752) having a relatively soft elongate element (752) as a core and a relatively hard (springy material) overcoat (754). Interconnection elements (752) may be fabricated upon tip structures (770), or may first be mounted to the electronic component (784) and the tip structures (770) joined to the free-ends of the interconnection elements (752). Tip structures (770) formed as cantilever beams are described.
摘要翻译：用于互连元件（752）的互连元件（752）和/或尖端结构（770）可首先制造在牺牲基板（702）上，以便随后安装到电子部件（784）。以这种方式，电子部件（784）在制造过程中不“处于危险中”。牺牲衬底（702）在互连元件（752）之间建立预定的空间关系，其可以是具有作为芯的相对柔软的细长元件（752）和相对硬（弹性材料）外涂层（754）的复合互连元件（752））。互连元件（752）可以制造在尖端结构（770）上，或者可以首先安装到电子部件（784），并且尖端结构（770）连接到互连元件（752）的自由端。描述形成为悬臂梁的尖端结构（770）。

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