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1. 发明申请

WO2010123711A2 SUBSTRATE COOL DOWN CONTROL 审中-公开
标题翻译：基板冷却控制
公开(公告)号：WO2010123711A2
公开(公告)日：2010-10-28
申请号：PCT/US2010/030741
申请日：2010-04-12
申请人： APPLIED MATERIALS, INC. , NEWMAN, Jacob , KANAWADE, Dinesh , BARANDICA, Henry , MERRY, Nir
发明人： NEWMAN, Jacob , KANAWADE, Dinesh , BARANDICA, Henry , MERRY, Nir
IPC分类号： H01L21/02
CPC分类号： G01K13/00 , G01J5/0003 , G01J5/0007 , G01J5/02 , G01J5/0255 , G01K11/18 , H01L21/67103 , H01L21/67248
摘要： Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.
摘要翻译：提供了精确的基板冷却控制的方法和装置。用于测量衬底温度的装置可包括用于支撑衬底的冷却板; 传感器，当设置在所述冷却板上时，提供对应于所述基板的温度的数据; 以及耦合到所述传感器的计算机，以从所述传感器数据确定所述基板的温度。用于测量衬底的温度的方法可以包括将待冷却的衬底设置到设置有冷却板的腔室，传感器以提供对应于衬底的温度的数据和耦合到传感器的计算机; 在经过预定的第一时间间隔之后感测衬底的第一温度; 将第一温度与预定温度进行比较; 以及确定所述第一温度是否大于，等于或小于所述预定温度。

2. 发明申请

WO2010054206A2 IMPROVED PROCESS EQUIPMENT ARCHITECTURE 审中-公开
标题翻译：改进的过程设备结构
公开(公告)号：WO2010054206A2
公开(公告)日：2010-05-14
申请号：PCT/US2009/063568
申请日：2009-11-06
申请人： APPLIED MATERIALS, INC. , NEWMAN, Jacob , KANAWADE, Dinesh , SCHWARTZ, Miriam , MERRY, Nir , HAAG, Michael Thomas
发明人： NEWMAN, Jacob , KANAWADE, Dinesh , SCHWARTZ, Miriam , MERRY, Nir , HAAG, Michael Thomas
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： H01L21/6719
摘要： Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication facility floor space requirements. Prior art systems require significant floor space around all sides to allow for adequate installation and servicing. Embodiments of the present invention provide platforms that allow for servicing the chambers and supporting systems via a front and rear of the platform allowing multiple, side-by-side platform placement within a fabrication facility, while providing improved serviceability of the platform components.
摘要翻译：本发明的实施例涉及用于最小化制造设施地面空间要求的单基板，多室处理平台架构的改进。现有技术的系统在所有侧面周围需要大量的地面空间以允许适当的安装和维修。本发明的实施例提供了平台，其允许经由平台的前部和后部维修腔室和支撑系统，从而允许在制造设施内多个并排平台布置，同时提供平台部件的改进的可维修性。 p>

3. 发明申请

WO2010123711A3 SUBSTRATE COOL DOWN CONTROL 审中-公开
标题翻译：基板冷却控制
公开(公告)号：WO2010123711A3
公开(公告)日：2011-01-20
申请号：PCT/US2010030741
申请日：2010-04-12
申请人： APPLIED MATERIALS INC , NEWMAN JACOB , KANAWADE DINESH , BARANDICA HENRY , MERRY NIR
发明人： NEWMAN JACOB , KANAWADE DINESH , BARANDICA HENRY , MERRY NIR
IPC分类号： H01L21/02
CPC分类号： G01K13/00 , G01J5/0003 , G01J5/0007 , G01J5/02 , G01J5/0255 , G01K11/18 , H01L21/67103 , H01L21/67248
摘要： Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.
摘要翻译：提供了精确的基板冷却控制的方法和装置。用于测量衬底温度的装置可包括用于支撑衬底的冷却板; 传感器，当设置在所述冷却板上时，提供对应于所述基板的温度的数据; 以及耦合到所述传感器的计算机，以从所述传感器数据确定所述基板的温度。用于测量衬底的温度的方法可以包括将待冷却的衬底设置到设置有冷却板的腔室，传感器以提供对应于衬底的温度的数据和耦合到传感器的计算机; 在经过预定的第一时间间隔之后感测衬底的第一温度; 将第一温度与预定温度进行比较; 以及确定所述第一温度是否大于，等于或小于所述预定温度。

4. 发明申请

WO2010054206A3 IMPROVED PROCESS EQUIPMENT ARCHITECTURE 审中-公开
标题翻译：改进工艺设备建筑
公开(公告)号：WO2010054206A3
公开(公告)日：2010-07-22
申请号：PCT/US2009063568
申请日：2009-11-06
申请人： APPLIED MATERIALS INC , NEWMAN JACOB , KANAWADE DINESH , SCHWARTZ MIRIAM , MERRY NIR , HAAG MICHAEL THOMAS
发明人： NEWMAN JACOB , KANAWADE DINESH , SCHWARTZ MIRIAM , MERRY NIR , HAAG MICHAEL THOMAS
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： H01L21/6719
摘要： Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication facility floor space requirements. Prior art systems require significant floor space around all sides to allow for adequate installation and servicing. Embodiments of the present invention provide platforms that allow for servicing the chambers and supporting systems via a front and rear of the platform allowing multiple, side-by-side platform placement within a fabrication facility, while providing improved serviceability of the platform components.
摘要翻译：本发明的实施例涉及对用于最小化制造设备占地面积要求的单基板多室处理平台架构的改进。现有技术的系统需要围绕所有侧面的显着的地板空间以允许适当的安装和维修。本发明的实施例提供了平台，其允许经由平台的前部和后部维护腔室和支撑系统，从而允许在制造设备内多个并排平台放置，同时提供平台组件的改进的可维护性。

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