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    • 5. 发明授权
    • Heat-radiating substrate and manufacturing method thereof
    • 散热基板及其制造方法
    • US08338714B2
    • 2012-12-25
    • US12852323
    • 2010-08-06
    • Jung Eun KangHye Sook ShinKi Ho Seo
    • Jung Eun KangHye Sook ShinKi Ho Seo
    • H05K1/00
    • H05K3/445H01L2924/0002H05K3/4608H05K3/465H05K2201/0116H05K2203/0315H05K2203/1147Y10T29/49128H01L2924/00
    • Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.
    • 本文公开了一种散热基板。 散热基板包括:金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层,具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层,其被嵌入在所述第一绝缘层中,填充在所述多孔层的第二孔中,并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。 此外,在本实施方式的散热基板中,第一电路层部分地填充在第二孔中,第二绝缘层填充在第二孔中,以使第一绝缘层成为平面。 此外,公开了制造散热基板的方法。