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1. 发明申请

US20120085574A1 Heat radiating substrate and method of manufacturing the same 审中-公开
标题翻译：散热基板及其制造方法
公开(公告)号：US20120085574A1
公开(公告)日：2012-04-12
申请号：US13064364
申请日：2011-03-21
申请人： Ji Hyun Park , Tae Hoon Kim , Sang Hyun Shin , Ki Ho Seo , Cheol Ho Heo , Young Ki Lee
发明人： Ji Hyun Park , Tae Hoon Kim , Sang Hyun Shin , Ki Ho Seo , Cheol Ho Heo , Young Ki Lee
IPC分类号： H05K1/14 , H05K3/42
CPC分类号： H05K3/44 , H05K1/0203 , H05K1/053 , H05K3/202 , H05K3/4053 , H05K2201/0355 , H05K2201/0394 , H05K2203/0315 , Y10T29/49165
摘要： Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.
摘要翻译：提供一种散热基板及其制造方法。散热基板包括具有通孔的基板，通过阳极氧化处理形成在具有通孔的基板的整个表面上的阳极氧化层，形成在基板上的阳极氧化物层为阳极氧化层以及形成在通孔的下部以连接到通孔的第二电路图案。因此，通过在制造散热基板时不使用常规的粘合层和金属种子，通过施加金属阳极接合工艺来简化电路形成工艺并容易地制造散热基板。

2. 发明申请

US20120043875A1 RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEAT SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIANT HEAT SUBSTRATE 失效
标题翻译：辐射热基板和制造辐射热基板的方法以及具有辐射热基板的发光元件封装
公开(公告)号：US20120043875A1
公开(公告)日：2012-02-23
申请号：US12964285
申请日：2010-12-09
申请人： Ki Ho Seo , Tae Hoon Kim , Sang Hyun Shin , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park
发明人： Ki Ho Seo , Tae Hoon Kim , Sang Hyun Shin , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park
IPC分类号： H01J7/24 , H01R43/00
CPC分类号： H01L33/641 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L33/642 , H01L2224/48227 , H01L2224/73265 , H01L2933/0075 , H01S5/02276 , H01S5/02476 , Y10T29/49117
摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.
摘要翻译：本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

3. 发明申请

US20110316035A1 HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：散热基板及其制造方法
公开(公告)号：US20110316035A1
公开(公告)日：2011-12-29
申请号：US12897936
申请日：2010-10-05
申请人： Sang Hyun Shin , Tae Hoon Kim , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park , Ki Ho Seo
发明人： Sang Hyun Shin , Tae Hoon Kim , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park , Ki Ho Seo
IPC分类号： H01L33/48 , H01L33/64
CPC分类号： H05K3/0061 , H01L23/4006 , H01L33/641 , H01L33/642 , H01L2023/4062 , H01L2224/16225 , H01L2224/16227 , H01L2924/01087 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K1/05 , H05K2201/0209 , H05K2201/10106 , H05K2201/10409 , H05K2203/0315 , H01L2924/00
摘要： Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided.
摘要翻译：本发明公开了一种散热基板，其特征在于，具备包括金属层的基底基板，在所述金属层的一个面上形成的绝缘层，以及在所述绝缘层上形成的电路层，形成在所述绝缘层的另一面的散热层所述金属层，用于将所述基底基板和所述散热层彼此连接的连接器，形成在所述基底基板的厚度方向上并且所述连接器被插入的开口的开口以及形成在所述基底基板中的任一个或两者上的阳极氧化层金属层的另一表面和侧表面，并且其中金属层和散热层通过阳极氧化层彼此绝缘，从而防止静电或电压冲击向金属层传递。还提供了制造散热基板的方法。

4. 发明申请

US20110198112A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110198112A1
公开(公告)日：2011-08-18
申请号：US12874013
申请日：2010-09-01
申请人： Kwang Soo KIM , Ki Ho SEO
发明人： Kwang Soo KIM , Ki Ho SEO
IPC分类号： H05K1/09 , H01B13/00
CPC分类号： H05K1/053 , H05K3/06 , H05K3/062 , H05K2201/09745 , H05K2203/0315 , H05K2203/0369
摘要： Disclosed herein is a method for manufacturing a printed circuit board, including: (A) preparing an aluminum substrate; (B) patterning and etching an etching resist on the aluminum substrate; (C) forming an insulating layer by performing an anodizing treatment on the patterned aluminum substrate; and (D) forming a metal wiring layer by removing the etching resist. The aluminum wiring and the insulating layer are simultaneously formed on the surface of the aluminum patterned by etching through an anodizing method, thereby simplifying the manufacturing process of the substrate and improving adhesion between the metal wiring layer and the insulating layer. In addition, the thickness of the insulating layer and the thickness of the metal wiring layer can be controlled by controlling the anodizing treatment time, thereby providing a method for manufacturing a printed circuit board that can be manufactured to fit for use purpose.
摘要翻译：本发明公开了一种印刷电路板的制造方法，包括：（A）制备铝基板; （B）在铝基板上图案化和蚀刻抗蚀剂; （C）通过对图案化的铝基板进行阳极氧化处理来形成绝缘层; 和（D）通过除去抗蚀剂形成金属布线层。通过阳极氧化法通过蚀刻同时形成铝布线和绝缘层，从而简化了基板的制造工艺，提高了金属布线层与绝缘层之间的密合性。此外，可以通过控制阳极化处理时间来控制绝缘层的厚度和金属布线层的厚度，从而提供可以制造成适合用途的印刷电路板的制造方法。

5. 发明授权

US08368291B2 Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate 失效
标题翻译：辐射热基板和辐射热基板的制造方法以及具有辐射热基板的发光元件封装
公开(公告)号：US08368291B2
公开(公告)日：2013-02-05
申请号：US12964285
申请日：2010-12-09
申请人： Ki Ho Seo , Tae Hoon Kim , Sang Hyun Shin , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park
发明人： Ki Ho Seo , Tae Hoon Kim , Sang Hyun Shin , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park
IPC分类号： H01L33/64 , H01L33/48
CPC分类号： H01L33/641 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L33/642 , H01L2224/48227 , H01L2224/73265 , H01L2933/0075 , H01S5/02276 , H01S5/02476 , Y10T29/49117
摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.
摘要翻译：本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

6. 发明申请

US20120001544A1 LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：发光模块及其制造方法
公开(公告)号：US20120001544A1
公开(公告)日：2012-01-05
申请号：US12904512
申请日：2010-10-14
申请人： Tae Hoon KIM , Sang Hyun SHIN , Cheol Ho HEO , Young Ki LEE , Ji Hyun PARK , Ki Ho SEO
发明人： Tae Hoon KIM , Sang Hyun SHIN , Cheol Ho HEO , Young Ki LEE , Ji Hyun PARK , Ki Ho SEO
IPC分类号： H01J7/44 , H01J9/00
CPC分类号： H01L25/167 , H01L27/3276 , H01L27/3288 , H01L33/641 , H01L51/529 , H01L2924/0002 , H05K1/0203 , H05K3/445 , H05K2201/10106 , H05K2201/10128 , H05K2203/0315 , H01L2924/00
摘要： Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component.
摘要翻译：公开了发光模块和制造发光模块的方法。发光模块包括：散热基板，其包括具有通孔的金属基板，沿着通孔的内壁形成的内部绝缘层，以及覆盖金属基板的所有外表面的外部绝缘层; 设置在散热基板的上表面上的发光部件单元; 驱动电路单元，其电连接到所述发光部件单元，并且安装在所述散热基板上以向所述发光部件单元施加驱动信号; 无源部件，其被安装在散热基板上并电连接到驱动电路单元; 以及电路布线层，其分别设置在散热基板的顶部和底部，并且通过形成在通孔上的通孔与散热基板的内部绝缘层相互连接，并且起到电互连的作用驱动电路单元和发光部件单元，或者驱动电路单元和无源部件。

7. 发明申请

US20110240346A1 HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：加热基板及其制造方法
公开(公告)号：US20110240346A1
公开(公告)日：2011-10-06
申请号：US12852323
申请日：2010-08-06
申请人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
发明人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
IPC分类号： H05K1/09 , H01B13/16
CPC分类号： H05K3/445 , H01L2924/0002 , H05K3/4608 , H05K3/465 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T29/49128 , H01L2924/00
摘要： Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer.Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer.In addition, disclosed is a method of manufacturing the heat-radiating substrate.
摘要翻译：本文公开了一种散热基板。散热基板包括：金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层，具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层，其被嵌入在所述第一绝缘层中，填充在所述多孔层的第二孔中，并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。此外，在本实施方式的散热基板中，第一电路层部分地填充在第二孔中，第二绝缘层填充在第二孔中，以使第一绝缘层成为平面。此外，公开了制造散热基板的方法。

8. 发明授权

US08338714B2 Heat-radiating substrate and manufacturing method thereof 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US08338714B2
公开(公告)日：2012-12-25
申请号：US12852323
申请日：2010-08-06
申请人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
发明人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
IPC分类号： H05K1/00
CPC分类号： H05K3/445 , H01L2924/0002 , H05K3/4608 , H05K3/465 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T29/49128 , H01L2924/00
摘要： Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.
摘要翻译：本文公开了一种散热基板。散热基板包括：金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层，具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层，其被嵌入在所述第一绝缘层中，填充在所述多孔层的第二孔中，并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。此外，在本实施方式的散热基板中，第一电路层部分地填充在第二孔中，第二绝缘层填充在第二孔中，以使第一绝缘层成为平面。此外，公开了制造散热基板的方法。

9. 发明授权

US08773076B2 Battery management system, method of removing polarization voltage of battery, and estimating state of charge of battery 失效
标题翻译：电池管理系统，去除电池极化电压的方法，以及电池充电状态的估计
公开(公告)号：US08773076B2
公开(公告)日：2014-07-08
申请号：US13244407
申请日：2011-09-24
申请人： Loo-Ney Choi , Ki-Ho Seo , Yusai Murakami
发明人： Loo-Ney Choi , Ki-Ho Seo , Yusai Murakami
IPC分类号： H01M10/44 , H01M10/46 , H02J7/00
CPC分类号： H02J7/00 , H02J3/32 , H02J3/382 , H02J3/385 , H02J3/386 , H02J2007/005 , Y02E10/58 , Y02E10/763 , Y02E70/30
摘要： A battery management system according to an exemplary embodiment of the present invention includes: a current measuring unit for sampling a charge current and a discharge current of a battery; a charge and discharge amount calculator for calculating a charge and discharge amount corresponding to a difference between the sampled charge current and the sampled discharge current; a polarization voltage calculator for calculating a polarization voltage corresponding to the charge and discharge amount and a temperature of the battery; and a pulse generator for applying a polarization voltage reset pulse for the battery to remove the polarization voltage.
摘要翻译：根据本发明的示例性实施例的电池管理系统包括：电流测量单元，用于对电池的充电电流和放电电流进行采样; 用于计算与采样的充电电流和采样的放电电流之间的差相对应的充电和放电量的充放电量计算器; 极化电压计算器，用于计算对应于充放电量和电池温度的极化电压; 以及用于对电池施加偏振电压复位脉冲以消除极化电压的脉冲发生器。

10. 发明申请

US20120200264A1 BATTERY MANAGEMENT SYSTEM, METHOD OF REMOVING POLARIZATION VOLTAGE OF BATTERY, AND ESTIMATING STATE OF CHARGE OF BATTERY 失效
标题翻译：电池管理系统，移除电池极化电压的方法和电池充电状态估算
公开(公告)号：US20120200264A1
公开(公告)日：2012-08-09
申请号：US13244407
申请日：2011-09-24
申请人： Loo-Ney Choi , Ki-Ho Seo , Yusai Murakami
发明人： Loo-Ney Choi , Ki-Ho Seo , Yusai Murakami
IPC分类号： H02J7/00
CPC分类号： H02J7/00 , H02J3/32 , H02J3/382 , H02J3/385 , H02J3/386 , H02J2007/005 , Y02E10/58 , Y02E10/763 , Y02E70/30
摘要： A battery management system according to an exemplary embodiment of the present invention includes: a current measuring unit for sampling a charge current and a discharge current of a battery; a charge and discharge amount calculator for calculating a charge and discharge amount corresponding to a difference between the sampled charge current and the sampled discharge current; a polarization voltage calculator for calculating a polarization voltage corresponding to the charge and discharge amount and a temperature of the battery; and a pulse generator for applying a polarization voltage reset pulse for the battery to remove the polarization voltage.
摘要翻译：根据本发明的示例性实施例的电池管理系统包括：电流测量单元，用于对电池的充电电流和放电电流进行采样; 用于计算与采样的充电电流和采样的放电电流之间的差相对应的充电和放电量的充放电量计算器; 极化电压计算器，用于计算对应于充放电量和电池温度的极化电压; 以及用于对电池施加偏振电压复位脉冲以消除极化电压的脉冲发生器。

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