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1. 发明申请

WO2006057519A1 GAME METHOD AND GAME SYSTEM FOR RECRUITING AND ENTERING A SCHOOL OF HIGHER GRADE 审中-公开
标题翻译：用于招收和进入高等学校的游戏方法和游戏系统
公开(公告)号：WO2006057519A1
公开(公告)日：2006-06-01
申请号：PCT/KR2005/003983
申请日：2005-11-24
申请人： JEON, Joong-yang
发明人： JEON, Joong-yang
IPC分类号： G06Q30/00
CPC分类号： G06Q10/10 , G09B7/00
摘要： Provided are a method and a system for playing a game helping get a job and a method and a system for playing a game helping entering into a university or a school of higher grade. The present invention, through the game, provides an advantage of enabling a job applicant to get a basic understanding of a culture of a company which he/her actually wants to enter into and to get in advance familiar with a style of a written examination and an interview required by the company. More specifically, the job applicant may be in advance familiar with employment requirements provided by the company and he/she, through the game, may be motivated to study for the examination and the interview in an interesting way. Also, the company, through the game, may employ a competent person with a good grounding required of its employees. Also, the present invention, through the game, provides another advantage of enabling an applicant who wants to enter into a university or a school of higher grade to grasp his/her aptitude and select his/her major suitable for his/her learning ability judged through evaluation of a result of briefly studying a plurality of subjects according to his/her grasped aptitude. More specifically, the applicant may be motivated to have interest in studying for entrance into a university or a school of high grade and may obtain a substantial guidance on the entrance into a university or a school of higher grade, thus increasing his/her learning efficiency.
摘要翻译：提供了一种玩游戏帮助获得工作的方法和系统，以及用于玩游戏的方法和系统，帮助进入高校的大学或学校。本发明通过游戏提供了使求职者能够对他/她实际想要进入并预先熟悉书面样式的公司的文化的基本了解的优点，公司需要采访。更具体地说，求职者可以事先熟悉公司提供的就业要求，他/她可以通过游戏有兴趣以有趣的方式学习考试和面试。此外，该公司通过游戏，可以聘请合格的人员，其员工需要良好的基础。此外，本发明通过游戏提供了另一个优点，即使想要进入大学或高年级学校的申请人能够掌握他/她的能力并选择适合他/她的学习能力的他/她的主修通过评估根据他/她掌握的能力简要研究多个主题的结果。更具体地说，申请人可能有兴趣有兴趣入读大学或高年级学校，并可以在大学或高年级学校入学时获得实质的指导，从而提高他/她的学习效率。

2. 发明申请

US20140029201A1 POWER PACKAGE MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电源封装模块及其制造方法
公开(公告)号：US20140029201A1
公开(公告)日：2014-01-30
申请号：US13620608
申请日：2012-09-14
申请人： Si Joong YANG , Do Jae Yoo , Joon Seok Chae
发明人： Si Joong YANG , Do Jae Yoo , Joon Seok Chae
IPC分类号： H05K7/14 , H05K3/30 , H05K7/20
CPC分类号： H05K7/209 , H01L23/36 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L24/19 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H05K3/107 , H05K3/4053 , Y10T29/4913 , H01L2924/00
摘要： There is provided a power package module, including: a lead frame; at least one first electronic component mounted on the lead frame; and an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component.
摘要翻译：提供了一种功率封装模块，包括：引线框架; 安装在所述引线框架上的至少一个第一电子部件; 以及设置在所述第一电子部件的第一表面上并且具有连接到所述第一电子部件的通孔电极的绝缘部件。

3. 发明申请

US20110012220A1 Wafer-level image sensor module, method of manufacturing the same and camera module 审中-公开
标题翻译：晶圆级图像传感器模块，其制造方法和相机模块
公开(公告)号：US20110012220A1
公开(公告)日：2011-01-20
申请号：US12923454
申请日：2010-09-22
申请人： Seung Wook Park , Jing Li Yuan , Ju Pyo Hong , Si Joong Yang
发明人： Seung Wook Park , Jing Li Yuan , Ju Pyo Hong , Si Joong Yang
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/02372 , H01L2224/05001 , H01L2224/05009 , H01L2224/05024 , H01L2224/05548 , H01L2224/13 , H01L2924/00014 , H01L2224/05599
摘要： A wafer-level image sensor module including: a wafer having an image sensor and a plurality of upper pads provided thereon, the wafer having an inclined surface on either side thereof; a transparent member installed above the top surface of the wafer so as to seal the image sensor; a plurality of lead portions having one ends connected to the respective upper pads, the lead portions being formed to extend to the bottom surface of the wafer along the inclined surface of the wafer; an encapsulation portion formed on the top surface of the wafer so as to be positioned outside the transparent member; and a plurality of external connection members that are electrically connected to the other ends of the respective lead portions
摘要翻译：一种晶片级图像传感器模块，包括：具有图像传感器和设置在其上的多个上焊盘的晶片，所述晶片在其两侧具有倾斜表面; 透明构件安装在晶片的顶表面上方，以密封图像传感器; 多个引线部分，其一端连接到相应的上焊盘，引线部分形成为沿着晶片的倾斜表面延伸到晶片的底表面; 形成在所述晶片的上表面上以便位于所述透明构件外部的封装部; 以及多个外部连接构件，其电连接到各个引线部分的另一端

4. 发明申请

US20070269786A1 Game Method And Game System For Recruiting And Entering A School Of Higher Grade 审中-公开
标题翻译：招聘进入高等学校的游戏方法和游戏系统
公开(公告)号：US20070269786A1
公开(公告)日：2007-11-22
申请号：US11667659
申请日：2005-11-24
申请人： Joong-Yang Jeon
发明人： Joong-Yang Jeon
IPC分类号： G06Q30/00
CPC分类号： G06Q10/10 , G09B7/00
摘要： Provided are a method and a system for playing a game helping get a job and a method and a system for playing a game helping entering into a university or a school of higher grade. The present invention, through the game, provides an advantage of enabling a job applicant to get a basic understanding of a culture of a company which he/her actually wants to enter into and to get in advance familiar with a style of a written examination and an interview required by the company. More specifically, the job applicant may be in advance familiar with employment requirements provided by the company and he/she, through the game, may be motivated to study for the examination and the interview in an interesting way. Also, the company, through the game, may employ a competent person with a good grounding required of its employees. Also, the present invention, through the game, provides another advantage of enabling an applicant who wants to enter into a university or a school of higher grade to grasp his/her aptitude and select his/her major suitable for his/her learning ability judged through evaluation of a result of briefly studying a plurality of subjects according to his/her grasped aptitude. More specifically, the applicant may be motivated to have interest in studying for entrance into a university or a school of high grade and may obtain a substantial guidance on the entrance into a university or a school of higher grade, thus increasing his/her learning efficiency.
摘要翻译：提供了一种玩游戏帮助获得工作的方法和系统，以及用于玩游戏的方法和系统，帮助进入高校的大学或学校。本发明通过游戏提供了使求职者能够对他/她实际想要进入并预先熟悉书面样式的公司的文化的基本了解的优点，公司需要采访。更具体地说，求职者可以事先熟悉公司提供的就业要求，他/她可以通过游戏有兴趣以有趣的方式学习考试和面试。此外，该公司通过游戏，可以聘请合格的人员，其员工需要良好的基础。此外，本发明通过游戏提供了另一个优点，即使想要进入大学或高年级学校的申请人能够掌握他/她的能力并选择适合他/她的学习能力的他/她的主修通过评估根据他/她掌握的能力简要研究多个主题的结果。更具体地说，申请人可能有兴趣有兴趣入读大学或高年级学校，并可以在大学或高年级学校入学时获得实质的指导，从而提高他/她的学习效率。

5. 发明申请

US20050271898A1 Organic electroluminescent device 有权
标题翻译：有机电致发光器件
公开(公告)号：US20050271898A1
公开(公告)日：2005-12-08
申请号：US11140736
申请日：2005-06-01
申请人： Myung Kim , Hyoung Oh , Jae Lee , Sung Kim , Jong Yoon , Seong Kim , Hong Kim , Joong Yang
发明人： Myung Kim , Hyoung Oh , Jae Lee , Sung Kim , Jong Yoon , Seong Kim , Hong Kim , Joong Yang
IPC分类号： H05B33/22 , C09K11/06 , H01L51/00 , H01L51/30 , H01L51/50 , H05B33/10 , H05B33/12
CPC分类号： H01L51/5088 , H01L51/002 , H01L51/0052 , H01L51/0059 , H01L51/0062 , H01L51/0078 , H01L51/0081 , Y10S428/917 , Y10T428/26
摘要： An organic electroluminescence (EL) device capable of digital driving, and a method for manufacturing the same are disclosed herein. The organic EL device comprises a substrate, an anode formed on the substrate, an organic EL layer formed on the anode and constructed as a multilayer structure including a hole injection layer and a hole transport layer, a cathode formed on the organic EL layer, and an interface deterioration preventing layer formed between the anode and the organic EL layer.
摘要翻译：本文公开了能够进行数字驱动的有机电致发光（EL）装置及其制造方法。有机EL器件包括基板，形成在基板上的阳极，形成在阳极上并被构造为包括空穴注入层和空穴传输层的多层结构的有机EL层，形成在有机EL层上的阴极，以及形成在阳极和有机EL层之间的界面劣化防止层。

6. 发明申请

US20120125096A1 INERTIAL SENSOR 审中-公开
标题翻译：惯性传感器
公开(公告)号：US20120125096A1
公开(公告)日：2012-05-24
申请号：US13283517
申请日：2011-10-27
申请人： Heung Woo Park , Won Kyu Jeung , Hyun Kee Lee , Si Joong Yang
发明人： Heung Woo Park , Won Kyu Jeung , Hyun Kee Lee , Si Joong Yang
IPC分类号： G01C19/56
CPC分类号： G01C19/5783
摘要： Disclosed herein is an inertial sensor which includes a sensing unit including a mass mounted to be displaced on a flexible substrate part, a driving unit moving the mass, and a displacement detecting unit detecting a displacement of the mass, the inertial sensor comprising: a top cap covering a top of the flexible substrate part; and a bottom cap covering a bottom of the mass. Thereby, the inertial sensor can be implemented in an economic EMC molding package shape, while protecting the mass and the piezo-electric element. Further, the inertial sensor optimizes a thickness of the cap covering the mass and the piezo-electric element and an interval between the mass and the piezo-electric element to have improved freedom in design of space utilization as well as improved driving characteristics and Q values.
摘要翻译：本文公开了一种惯性传感器，其包括感测单元，该感测单元包括安装成在柔性基板部件上移位的质量，移动该质量块的驱动单元和检测该质量块的位移的位移检测单元，该惯性传感器包括：顶部帽盖覆盖柔性基板部分的顶部; 以及覆盖该质量块底部的底盖。因此，惯性传感器可以以经济的EMC成型包装形式实现，同时保护质量和压电元件。此外，惯性传感器优化覆盖质量块和压电元件的盖的厚度以及质量块和压电元件之间的间隔，以提高空间利用设计的自由度以及改善的驱动特性和Q值。

7. 发明授权

US07696004B2 Wafer level package fabrication method 有权
标题翻译：晶圆级封装制造方法
公开(公告)号：US07696004B2
公开(公告)日：2010-04-13
申请号：US12155317
申请日：2008-06-02
申请人： Jingli Yuan , Jae Cheon Doh , Si Joong Yang , In Goo Kang , Seung Wook Park
发明人： Jingli Yuan , Jae Cheon Doh , Si Joong Yang , In Goo Kang , Seung Wook Park
IPC分类号： H01L21/00
CPC分类号： H01L23/10 , H01L21/76898 , H01L2924/0002 , H03H9/105 , H03H9/1092 , H01L2924/00
摘要： Provided is a wafer level package fabrication method. The method includes providing a device substrate wafer including one or more devices on an upper surface thereof, and a bonding pad electrically connected to the device, providing a bonding seal surrounding the device along the bonding pad, bonding a cap substrate wafer to the device substrate wafer through the bonding seal, the cap substrate wafer having a via formed in a region corresponding to the bonding pad, forming an external terminal on the cap substrate wafer, the external terminal being electrically connected to the bonding pad, and cutting the cap substrate wafer and the device substrate wafer along a cutting line to individually separate a plurality of wafer level packages. The method is conducive to reducing product size for miniaturization, is capable of performing a bonding process without wafer deformation or damage, and increases freedom in wafer material selection.
摘要翻译：提供了晶片级封装制造方法。该方法包括提供在其上表面上包括一个或多个器件的器件衬底晶片和电连接到该器件的焊盘，提供围绕该焊盘的器件的接合密封，将盖衬底晶片接合到器件衬底晶片通过接合密封，所述盖基板晶片具有形成在与所述接合焊盘相对应的区域中的通孔，在所述盖基板晶片上形成外部端子，所述外部端子电连接到所述接合焊盘，以及切割所述盖基板晶片以及沿着切割线的装置基板晶片，以单独分离多个晶片级封装。该方法有利于减小产品尺寸以实现小型化，能够进行没有晶片变形或损坏的接合工艺，并增加晶片材料选择的自由度。

8. 发明申请

US20080299706A1 Wafer level package fabrication method 有权
标题翻译：晶圆级封装制造方法
公开(公告)号：US20080299706A1
公开(公告)日：2008-12-04
申请号：US12155317
申请日：2008-06-02
申请人： Jingli Yuan , Jae Cheon Doh , Si Joong Yang , In Goo Kang , Seung Wook Park
发明人： Jingli Yuan , Jae Cheon Doh , Si Joong Yang , In Goo Kang , Seung Wook Park
IPC分类号： H01L21/50
CPC分类号： H01L23/10 , H01L21/76898 , H01L2924/0002 , H03H9/105 , H03H9/1092 , H01L2924/00
摘要： Provided is a wafer level package fabrication method. The method includes providing a device substrate wafer including one or more devices on an upper surface thereof, and a bonding pad electrically connected to the device, providing a bonding seal surrounding the device along the bonding pad, bonding a cap substrate wafer to the device substrate wafer through the bonding seal, the cap substrate wafer having a via formed in a region corresponding to the bonding pad, forming an external terminal on the cap substrate wafer, the external terminal being electrically connected to the bonding pad, and cutting the cap substrate wafer and the device substrate wafer along a cutting line to individually separate a plurality of wafer level packages. The method is conducive to reducing product size for miniaturization, is capable of performing a bonding process without wafer deformation or damage, and increases freedom in wafer material selection.
摘要翻译：提供了晶片级封装制造方法。该方法包括提供在其上表面上包括一个或多个器件的器件衬底晶片和电连接到该器件的焊盘，提供围绕该焊盘的器件的接合密封，将盖衬底晶片接合到器件衬底晶片通过接合密封，所述盖基板晶片具有形成在与所述接合焊盘相对应的区域中的通孔，在所述盖基板晶片上形成外部端子，所述外部端子电连接到所述接合焊盘，以及切割所述盖基板晶片以及沿着切割线的装置基板晶片，以单独分离多个晶片级封装。该方法有利于减小产品尺寸以实现小型化，能够进行没有晶片变形或损坏的接合工艺，并增加晶片材料选择的自由度。

9. 发明申请

US20080286904A1 Method for manufacturing semiconductor package 有权
标题翻译：制造半导体封装的方法
公开(公告)号：US20080286904A1
公开(公告)日：2008-11-20
申请号：US12153378
申请日：2008-05-16
申请人： Jing Li Yuan , Jae Cheon Doh , Tae Hoon Kim , Si Joong Yang , Seung Wook Park
发明人： Jing Li Yuan , Jae Cheon Doh , Tae Hoon Kim , Si Joong Yang , Seung Wook Park
IPC分类号： H01L21/60
CPC分类号： H03H9/1092 , H01L23/10 , H01L24/14 , H01L24/17 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/0401 , H01L2224/0557 , H01L2224/13023 , H01L2224/131 , H01L2224/1319 , H01L2224/14051 , H01L2224/14505 , H01L2224/17515 , H01L2224/29011 , H01L2224/2919 , H01L2224/301 , H01L2224/73104 , H01L2224/81193 , H01L2224/81805 , H01L2224/81815 , H01L2224/81907 , H01L2224/83193 , H01L2224/83986 , H01L2224/9205 , H01L2224/9221 , H01L2224/94 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/16235 , H01L2924/19041 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2924/3512 , H01L2224/05552
摘要： Provided is a method for manufacturing a semiconductor package. In the method, a wafer for a cap substrate is provided. The wafer for the cap substrate includes a plurality of vias and via electrodes on a lower surface. A wafer for a device substrate is provided. The wafer for the device substrate includes a circuit unit and a connection electrode on an upper surface. The wafer for the cap substrate and the wafer for the device substrate are primarily bonded by a medium of a primary adhesive. A trench is formed to expose the upper surface of the wafer for the device substrate to an outside along an outer edge of the primary adhesive. A secondary bonding operation is performed by a medium of a secondary adhesive to electrically connect the via electrode and the connection electrode. The wafer for the device substrate is diced along a virtual cut line.
摘要翻译：提供一种半导体封装的制造方法。在该方法中，设置用于盖基板的晶片。用于盖基板的晶片在下表面上包括多个通孔和通孔电极。提供了用于器件衬底的晶片。用于器件衬底的晶片包括上表面上的电路单元和连接电极。用于盖衬底的晶片和用于器件衬底的晶片主要通过主要粘合剂的介质粘合。形成沟槽，以将器件基板的晶片的上表面沿初级粘合剂的外边缘暴露于外部。通过二次粘合剂的介质进行二次接合操作，以电连接通孔电极和连接电极。用于器件衬底的晶片沿虚拟切割线切割。

10. 发明申请

US20050116659A1 Organic electroluminescent device and driving apparatus 有权
标题翻译：有机电致发光器件和驱动装置
公开(公告)号：US20050116659A1
公开(公告)日：2005-06-02
申请号：US11000009
申请日：2004-12-01
申请人： Myung Kim , Jae Lee , Jae Kyung , Sung Kim , Young Han , Hong Kim , Jong Yoon , Joong Yang
发明人： Myung Kim , Jae Lee , Jae Kyung , Sung Kim , Young Han , Hong Kim , Jong Yoon , Joong Yang
IPC分类号： H05B33/12 , B32B9/00 , G09F9/30 , G09F9/40 , G09G3/20 , G09G3/30 , H01L27/00 , H01L27/32 , H01L51/00 , H01L51/30 , H01L51/50 , H05B33/00 , H05B33/02 , H05B33/14 , H05B33/22
CPC分类号： H01L27/3267 , H01L25/048 , H01L27/3286 , H01L51/0052 , H01L51/0059 , H01L51/0078 , H01L51/0081 , H01L51/5234 , H01L2251/5315 , H01L2924/0002 , H01L2924/00
摘要： Provided is an organic EL device having a lower power consumption and high performance and enabling to display separate pictures on bidirectional screens as well as to display the same picture on the bidirectional screens, and a driving apparatus thereof. The organic EL device includes: a first organic EL panel for a unidirectional display; and a second organic EL panel for a unidirectional display, each of the first and second organic EL panels having a substrate, a first electrode, an emitting layer and a second electrode, wherein the first organic EL panel and the second organic EL panel are coupled so as to display pictures in bidirections. According to the present invention, a sufficient brightness can be obtained even under a low power. Also, since an opaque cathode is used, performance and transmittance are enhanced compared with the related art organic EL device using a transparent cathode.
摘要翻译：提供了一种具有较低功耗和高性能的有机EL器件，并且能够在双向屏幕上显示分离的图像以及在双向屏幕上显示相同的图像及其驱动装置。有机EL器件包括：用于单向显示的第一有机EL面板; 以及用于单向显示的第二有机EL面板，所述第一和第二有机EL面板中的每一个具有基板，第一电极，发光层和第二电极，其中所述第一有机EL面板和所述第二有机EL面板被耦合以便以双向方式显示图像。根据本发明，即使在低功率下也能获得足够的亮度。此外，由于使用不透明阴极，与使用透明阴极的现有技术有机EL器件相比，性能和透射率得到提高。

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