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    • 3. 发明申请
    • LIGHT EMITTING DIODE, PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • 发光二极管,封装结构及其制造方法
    • US20100072487A1
    • 2010-03-25
    • US12419299
    • 2009-04-07
    • Yao-Jun TsaiJinn-Kong SheuHsi-Hsuan YenHung-Lieh Hu
    • Yao-Jun TsaiJinn-Kong SheuHsi-Hsuan YenHung-Lieh Hu
    • H01L33/00H01L21/02
    • H01L33/14H01L33/38H01L33/382
    • A light emitting diode (LED), a fabricating method thereof, and a package structure thereof are provided. The LED includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, a current distribution modifying pattern, a first electrode and a second electrode. The active layer and the second semiconductor layer form a mesa structure and expose a part of the first semiconductor layer. The current distribution modifying pattern is disposed on the second semiconductor layer. The first electrode is disposed on and electrically connected to the first semiconductor layer exposed by the mesa structure. The second electrode is disposed on the current distribution modifying pattern and is electrically connected to the second semiconductor layer. The LED has superior light emitting efficiency.
    • 提供一种发光二极管(LED)及其制造方法及其封装结构。 LED包括基板,设置在基板上的第一半导体层,设置在第一半导体层上的有源层,设置在有源层上的第二半导体层,电流分布修改图案,第一电极和第二电极。 有源层和第二半导体层形成台面结构并暴露第一半导体层的一部分。 电流分布修改图案设置在第二半导体层上。 第一电极设置在由台面结构暴露的第一半导体层上并与其电连接。 第二电极设置在电流分布修改图案上并且电连接到第二半导体层。 LED具有出色的发光效率。
    • 4. 发明申请
    • LIGHT-EMITTING DIODE PACKAGE STRUCTURE
    • 发光二极管封装结构
    • US20070165414A1
    • 2007-07-19
    • US11682165
    • 2007-03-05
    • Shih-Chang SheiJinn-Kong Sheu
    • Shih-Chang SheiJinn-Kong Sheu
    • F21V15/00
    • H01L33/62H01L25/167H01L33/60H01L2224/05568H01L2224/05573H01L2224/16H01L2924/00014H01L2924/01004H01L2924/01079H01L2924/12041H01L2924/3025H01L2224/05599
    • A light-emitting diode package structure is provided. The light-emitting diode package comprises an insulating sub-mount, a first patterned conductive-reflective film, a second patterned conductive-reflective film and a light-emitting diode chip. The insulating sub-mount has a first surface and a cavity therein. The first and the second patterned conductive-reflective film are set over a portion of the first surface, a portion of the sidewalls of the cavity and a portion of the bottom surface of the cavity. The light-emitting diode chip is set up inside the cavity of the insulating sub-mount. The light-emitting diode has a pair of electrodes. The electrodes are electrically connected to the first and the second patterned conductive-reflective film respectively. Since the light-emitting diode structure of this invention incorporates the patterned conductive-reflective films, efficiency of the light-emitting diode is increased.
    • 提供了一种发光二极管封装结构。 发光二极管封装包括绝缘子安装座,第一图案化导电反射膜,第二图案化导电反射膜和发光二极管芯片。 绝缘子安装座在其中具有第一表面和空腔。 第一和第二图案化的导电反射膜设置在第一表面的一部分,空腔的侧壁的一部分和空腔的底表面的一部分上。 发光二极管芯片设置在绝缘子安装座的腔内。 发光二极管具有一对电极。 电极分别电连接到第一和第二图案化导电反射膜。 由于本发明的发光二极管结构具有图案化的导电反射膜,所以发光二极管的效率提高。
    • 5. 发明授权
    • Light-emitting diode structure with electrostatic discharge protection
    • 发光二极管结构具有静电放电保护功能
    • US07151281B2
    • 2006-12-19
    • US10711531
    • 2004-09-24
    • Shih-Chang SheiJinn-Kong Sheu
    • Shih-Chang SheiJinn-Kong Sheu
    • H01L27/15H01L29/16
    • H01L27/15H01L23/62H01L25/167H01L2924/0002H01L2924/00
    • A light-emitting diode (LED) structure with electrostatic discharge (ESD) protection is described. The LED includes a substrate, a patterned semiconductor layer, a first electrode and a second electrode. The patterned semiconductor layer is disposed over the substrate, and is divided into at least a first island structure and a second island structure. The first electrode and the second electrode are connected between the first island structure and the second island structure. A shunt diode is formed by the first electrode, the second electrode and the second island structure. The shunt diode is connected in parallel to the LED with an inverse voltage compared to the LED. In the LED structure of the invention, the first island structure and the second island structure are manufactured simultaneously by the epitaxy procedure. Therefore, the LED could be protected from damage due to electrostatic discharge (ESD).
    • 描述了具有静电放电(ESD)保护的发光二极管(LED)结构。 LED包括衬底,图案化半导体层,第一电极和第二电极。 图案化半导体层设置在衬底上,并且被划分为至少第一岛结构和第二岛结构。 第一电极和第二电极连接在第一岛结构和第二岛结构之间。 并联二极管由第一电极,第二电极和第二岛结构形成。 与LED相比,并联二极管与LED并联连接,反向电压。 在本发明的LED结构中,通过外延法同时制造第一岛结构和第二岛结构。 因此,可以防止LED由于静电放电(ESD)而受到损坏。
    • 6. 发明申请
    • LIGHT-EMITTING DIODE STRUCTURE WITH ELECTROSTATIC DISCHARGE PROTECTION
    • 具有静电放电保护功能的发光二极管结构
    • US20050167680A1
    • 2005-08-04
    • US10711531
    • 2004-09-24
    • Shih-Chang SheiJinn-Kong Sheu
    • Shih-Chang SheiJinn-Kong Sheu
    • H01L25/16H01L27/15H01L33/00
    • H01L27/15H01L23/62H01L25/167H01L2924/0002H01L2924/00
    • A light-emitting diode (LED) structure with electrostatic discharge (ESD) protection is described. The LED includes a substrate, a patterned semiconductor layer, a first electrode and a second electrode. The patterned semiconductor layer is disposed over the substrate, and is divided into at least a first island structure and a second island structure. The first electrode and the second electrode are connected between the first island structure and the second island structure. A shunt diode is formed by the first electrode, the second electrode and the second island structure. The shunt diode is connected in parallel to the LED with an inverse voltage compared to the LED. In the LED structure of the invention, the first island structure and the second island structure are manufactured simultaneously by the epitaxy procedure. Therefore, the LED could be protected from damage due to electrostatic discharge (ESD).
    • 描述了具有静电放电(ESD)保护的发光二极管(LED)结构。 LED包括衬底,图案化半导体层,第一电极和第二电极。 图案化半导体层设置在衬底上,并且被划分为至少第一岛结构和第二岛结构。 第一电极和第二电极连接在第一岛结构和第二岛结构之间。 并联二极管由第一电极,第二电极和第二岛结构形成。 与LED相比,并联二极管与LED并联连接,反向电压。 在本发明的LED结构中,通过外延法同时制造第一岛结构和第二岛结构。 因此,可以防止LED由于静电放电(ESD)而受到损坏。
    • 7. 发明授权
    • Light emitting diode
    • 发光二极管
    • US06686610B2
    • 2004-02-03
    • US10063053
    • 2002-03-15
    • Jinn-Kong Sheu
    • Jinn-Kong Sheu
    • H01L2906
    • H01L33/32H01L33/04H01L33/14
    • A light emitting diode structure is formed on a substrate. A nucleation layer at low temperature is formed on the substrate. A buffer layer is formed on the nucleation layer for easing the subsequent formation of crystal growth. N active layer is disposed between an upper confinement layer and a lower confinement layer. The active layer include the semiconductor material doped with III-N elements. A contact layer is disposed on the upper confinement layer. A reversed tunneling layer is form on the contact layer, wherein the conductive types for both are different. A transparent layer is formed on the reversed tunneling layer. A cathode electrode contacts with the conductive buffer layer and is separated from the active layer and the transparent electrode.
    • 在基板上形成发光二极管结构。 在基板上形成低温成核层。 在成核层上形成缓冲层,以缓和随后的晶体生长形成。 N活性层设置在上约束层和下约束层之间。 有源层包括掺杂III-N元素的半导体材料。 接触层设置在上限制层上。 在接触层上形成反向的隧道层,其中两者的导电类型不同。 在反向隧穿层上形成透明层。 阴极与导电缓冲层接触并与有源层和透明电极分离。
    • 8. 发明授权
    • Group III-V element-based LED having ESD protection capacity
    • 具有ESD保护能力的III-V族元件LED
    • US06593597B2
    • 2003-07-15
    • US10091941
    • 2002-03-05
    • Jinn-Kong Sheu
    • Jinn-Kong Sheu
    • H01L29201
    • H01L25/167H01L27/15H01L2224/05568H01L2224/05573H01L2224/056H01L2224/16H01L2924/09701H01L2924/00014
    • A group III-V element-based flip-chip assembled light-emitting diode structure with electrostatic protection capacity. A first conductive buffer layer and a second conductive buffer layer are formed over a transparent substrate. An active layer structure, a contact layer, an electrode is formed over the first conductive buffer layer. The active layer structure, the contact layer and the electrode together form a light-emitting diode structure. A metallic electrode is formed over the second conductive buffer layer to form a Schottky diode. Alternatively, a doped region is formed within the second conductive buffer layer to form a homo-junction diode structure. The anode and cathode of the diode above the second conductive buffer layer are electrically connected to the cathode and anode of the light-emitting diode, respectively.
    • 具有静电保护能力的III-V族元件倒装芯片组合发光二极管结构。 在透明基板上形成第一导电缓冲层和第二导电缓冲层。 在第一导电缓冲层上形成有源层结构,接触层,电极。 有源层结构,接触层和电极一起形成发光二极管结构。 金属电极形成在第二导电缓冲层之上以形成肖特基二极管。 或者,在第二导电缓冲层内形成掺杂区以形成均聚二极管结构。 在第二导电缓冲层之上的二极管的阳极和阴极分别电连接到发光二极管的阴极和阳极。
    • 9. 发明授权
    • Light emitting diode, package structure and manufacturing method thereof
    • 发光二极管,封装结构及其制造方法
    • US08138518B2
    • 2012-03-20
    • US12419299
    • 2009-04-07
    • Yao-Jun TsaiJinn-Kong SheuHsi-Hsuan YenHung-Lieh Hu
    • Yao-Jun TsaiJinn-Kong SheuHsi-Hsuan YenHung-Lieh Hu
    • H01L33/00
    • H01L33/14H01L33/38H01L33/382
    • A light emitting diode (LED), a fabricating method thereof, and a package structure thereof are provided. The LED includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, a current distribution modifying layer, a first electrode and a second electrode. The active layer and the second semiconductor layer form a mesa structure and expose a part of the first semiconductor layer. The current distribution modifying layer is disposed on the second semiconductor layer. The first electrode is disposed on and electrically connected to the first semiconductor layer exposed by the mesa structure. The second electrode is disposed on the current distribution modifying layer and is electrically connected to the second semiconductor layer. The LED has superior light emitting efficiency.
    • 提供一种发光二极管(LED)及其制造方法及其封装结构。 LED包括基板,设置在基板上的第一半导体层,设置在第一半导体层上的有源层,设置在有源层上的第二半导体层,电流分布修改层,第一电极和第二电极。 有源层和第二半导体层形成台面结构并暴露第一半导体层的一部分。 电流分布修改层设置在第二半导体层上。 第一电极设置在由台面结构暴露的第一半导体层上并与其电连接。 第二电极设置在电流分布改性层上并与第二半导体层电连接。 LED具有出色的发光效率。