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    • 5. 发明授权
    • Light-emitting device with low forward voltage and method for fabricating the same
    • 具有低正向电压的发光装置及其制造方法
    • US08785904B2
    • 2014-07-22
    • US13090899
    • 2011-04-20
    • Jianping ZhangHongmei WangChunhui Yan
    • Jianping ZhangHongmei WangChunhui Yan
    • H01L29/06
    • H01L33/04H01L33/14H01L33/32H01L33/385
    • A light emitting device with reduced forward voltage Vf by utilizing the excellent lateral conduction of two-dimensional electron gas (2DEG) and two-dimensional hole gas (2DHG) structure and, more specifically, by improving the vertical conduction of 2DEG and 2DHG structure by means of vertical conductive passages formed in 2DEG and 2DHG structure. The conductive passages are formed via discontinuities in 2DEG and 2DHG structure. The discontinuities can be in the form of openings by etching 2DEG or 2DHG structure, or in the form of voids by growing 2DEG or 2DHG structure on a rough surface via epitaxy facet control. The discontinuities can be formed by vertical displacement of 2DEG structure. A method is provided for manufacturing a light emitting device with reduced forward voltage same.
    • 通过利用二维电子气(2DEG)和二维空穴气体(2DHG)结构优异的横向导通,具有降低的正向电压Vf的发光器件,更具体地,通过改进2DEG和2DHG结构的垂直传导 以2DEG和2DHG结构形成的垂直导电通道的装置。 导电通道是通过2DEG和2DHG结构的不连续形成的。 通过蚀刻2DEG或2DHG结构,或通过在粗糙表面上通过外延小面控制生长2DEG或2DHG结构,以空隙的形式,不连续性可以是开口的形式。 可以通过2DEG结构的垂直位移形成不连续性。 提供了一种用于制造具有相同的正向电压降低的发光器件的方法。
    • 6. 发明授权
    • Light-emitting devices with substrate coated with optically denser material
    • 具有涂覆有光密度较高的材料的基底的发光器件
    • US08723201B2
    • 2014-05-13
    • US12860206
    • 2010-08-20
    • Chunhui YanJianping Zhang
    • Chunhui YanJianping Zhang
    • H01L33/58
    • H01L33/44H01L2224/48091H01L2224/48247H01L2224/48257H01L2224/49107H01L2933/0091H01L2924/00014
    • A light-emitting device includes a transparent substrate with a light emitting structure formed on one side of the substrate and a transparent layer formed on the opposing side of the substrate. The refractive index of the transparent layer is greater than the refractive index of the substrate. A light-emitting device includes a package cup having a reflective sidewall and a light emission surface and a light emitting diode (LED) embedded in the package cup. The LED comprises a transparent substrate and a transparent layer formed on the substrate. The reflective sidewall has a first portion in a central area of the package cup and a second portion in a peripheral area of the package cup, the first portion reflects light emitted from the transparent layer to the second portion and, then, the second portion further reflects the light received from the first portion to the light emission surface of the package cup.
    • 发光装置包括具有形成在基板的一侧上的发光结构的透明基板和形成在基板的相对侧上的透明层。 透明层的折射率大于基板的折射率。 发光装置包括具有反射侧壁和发光表面的封装杯和嵌入在封装杯中的发光二极管(LED)。 LED包括透明基板和形成在基板上的透明层。 反射侧壁具有在封装杯的中心区域中的第一部分和封装杯的外围区域中的第二部分,第一部分将从透明层发射的光反射到第二部分,然后将第二部分进一步反射 将从第一部分接收的光反射到封装杯的发光表面。
    • 8. 发明授权
    • Method for fabricating vertical light emitting devices and substrate assembly for the same
    • 制造垂直发光器件的方法及其基片组件
    • US08154034B1
    • 2012-04-10
    • US12953290
    • 2010-11-23
    • Jianping ZhangChunhui Yan
    • Jianping ZhangChunhui Yan
    • H01L29/201
    • H01L33/0079H01L33/007H01L33/20H01L33/22H01L33/42
    • In a method for fabricating a vertical light emitting device, the separation or lift-off of the substrate from the light emitting diode structure formed thereon is facilitated by forming voids at the interface between the substrate and the light emitting diode structure where the separation or lift-off occurs. A substrate assembly contains a substrate and an epitaxial layer, and voids are formed at the interface between the substrate and the epitaxial layer in a controlled manner. A light emitting diode structure is then formed on the epitaxial layer, followed by attaching the light emitting diode structure to a superstrate, separating the substrate from the epitaxial layer, and forming a conductive layer and a contact pad in place of the substrate, so as to form a vertical light emitting device.
    • 在制造垂直发光器件的方法中,通过在衬底和发光二极管结构之间的界面处形成空隙来促进衬底与其上形成的发光二极管结构的分离或剥离,其中分离或升高 - 发生。 衬底组件包含衬底和外延层,并且以受控的方式在衬底和外延层之间的界面处形成空隙。 然后在外延层上形成发光二极管结构,然后将发光二极管结构连接到衬底,将衬底与外延层分离,并形成导电层和接触焊盘代替衬底,以便 以形成垂直发光装置。
    • 9. 发明授权
    • Method for fabricating light-emitting devices with vertical light-extraction mechanism
    • 用垂直光提取机构制造发光器件的方法
    • US08137998B2
    • 2012-03-20
    • US12860698
    • 2010-08-20
    • Chunhui YanJianping Zhang
    • Chunhui YanJianping Zhang
    • H01L21/00
    • H01L33/24H01L33/08
    • A light-emitting device comprises a lattice structure to minimize the horizontal waveguide effect by reducing light traveling distance in the light-absorption medium of the light-emitting devices, and to enhance light extraction from the light-emitting layer. The lattice structure includes sidewalls and/or rods embedded in the light-absorption medium and dividing the light-absorption medium into a plurality of area units. The area units are completely isolated or partially separated from each other by the sidewalls. Also provided is a method of fabricating a light-emitting device that comprises a lattice structure, which lattice structure includes sidewalls and/or rods embedded in the light-absorption medium and dividing the light-absorption medium into a plurality of area units.
    • 发光器件包括通过减少发光器件的光吸收介质中的光行进距离来最小化水平波导效应的晶格结构,并且增强从发光层的光提取。 晶格结构包括嵌入光吸收介质中的侧壁和/或棒,并将光吸收介质分成多个区域单元。 区域单元被侧壁完全隔离或部分地分开。 还提供了一种制造包括晶格结构的发光器件的方法,该晶格结构包括嵌入光吸收介质中的侧壁和/或棒,并将光吸收介质分成多个区域单元。