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1. 发明授权

US08183583B2 LED package module 有权
标题翻译： LED封装模块
公开(公告)号：US08183583B2
公开(公告)日：2012-05-22
申请号：US12571754
申请日：2009-10-01
申请人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。因此，防止由黄化引起的LED的发光效率的降低，从而提高发光效率并实现尺寸的减小。

2. 发明申请

US20100051985A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20100051985A1
公开(公告)日：2010-03-04
申请号：US12255469
申请日：2008-10-21
申请人： Hyung Kun KIM , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
发明人： Hyung Kun KIM , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , F21K9/00 , H01L2224/48091 , H01L2924/00014
摘要： The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.
摘要翻译：本发明提供一种LED封装体，其特征在于，包括：散热体，其在外周面设置有多个径向突出的散热片，在所述散热片之间填充空间的成型材料; 封装体，其被容纳在所述散热体的顶面上并具有空腔; 一对引线框架从散热体的上部延伸到其两侧; 以及安装在腔内的LED芯片。

3. 发明授权

US08084778B2 Light emitting diode package 失效
标题翻译：发光二极管封装
公开(公告)号：US08084778B2
公开(公告)日：2011-12-27
申请号：US12571751
申请日：2009-10-01
申请人： Ho Sun Paek , Hak Hwan Kim , Young Jin Lee , Hyung Kun Kim , Suk Ho Jung
发明人： Ho Sun Paek , Hak Hwan Kim , Young Jin Lee , Hyung Kun Kim , Suk Ho Jung
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.
摘要翻译：提供了具有高散热效率的LED封装。根据本发明的一个方面的LED封装可以包括：封装主体，包括凹入到封装体中的第一凹槽部分，并且作为安装区域设置在封装主体的顶部; 第一引线框架和第二引线框架布置在第一槽部分的下表面上，同时第一和第二引线框架的一部分被暴露; LED芯片安装在第一槽部分的下表面上并电连接到第一和第二引线框架; 以及设置在包装体的底部并由碳纳米管形成的多个散热图案。

4. 发明授权

US08076692B2 LED package 有权
标题翻译： LED封装
公开(公告)号：US08076692B2
公开(公告)日：2011-12-13
申请号：US12255469
申请日：2008-10-21
申请人： Hyung Kun Kim , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
发明人： Hyung Kun Kim , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
IPC分类号： H01L33/00 , H01L23/34
CPC分类号： H01L33/642 , F21K9/00 , H01L2224/48091 , H01L2924/00014
摘要： The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.
摘要翻译：本发明提供一种LED封装体，其特征在于，包括：散热体，其在外周面设置有多个径向突出的散热片，在所述散热片之间填充空间的成型材料; 封装体，其被容纳在所述散热体的顶面上并具有空腔; 一对引线框架从散热体的上部延伸到其两侧; 以及安装在腔内的LED芯片。

5. 发明申请

US20120211780A1 LED PACKAGE MODULE 有权
标题翻译： LED封装模块
公开(公告)号：US20120211780A1
公开(公告)日：2012-08-23
申请号：US13404924
申请日：2012-02-24
申请人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/50
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

6. 发明授权

US08278671B2 Led package module 有权
标题翻译： LED封装模块
公开(公告)号：US08278671B2
公开(公告)日：2012-10-02
申请号：US13404924
申请日：2012-02-24
申请人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

7. 发明申请

US20100171143A1 LIGHT EMITTING DIODE PACKAGE 失效
标题翻译：发光二极管封装
公开(公告)号：US20100171143A1
公开(公告)日：2010-07-08
申请号：US12571751
申请日：2009-10-01
申请人： Ho Sun PAEK , Hak Hwan Kim , Young Jin Lee , Hyung Kun Kim , Suk Ho Jung
发明人： Ho Sun PAEK , Hak Hwan Kim , Young Jin Lee , Hyung Kun Kim , Suk Ho Jung
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.
摘要翻译：提供了具有高散热效率的LED封装。根据本发明的一个方面的LED封装可以包括：封装主体，包括凹入到封装体中的第一凹槽部分，并且作为安装区域设置在封装主体的顶部; 第一引线框架和第二引线框架布置在第一槽部分的下表面上，同时第一和第二引线框架的一部分被暴露; LED芯片安装在第一槽部分的下表面上并电连接到第一和第二引线框架; 以及设置在包装体的底部并由碳纳米管形成的多个散热图案。

8. 发明申请

US20100090231A1 LED PACKAGE MODULE 有权
标题翻译： LED封装模块
公开(公告)号：US20100090231A1
公开(公告)日：2010-04-15
申请号：US12571754
申请日：2009-10-01
申请人： Suk Ho JUNG , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho JUNG , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。因此，防止由黄化引起的LED的发光效率的降低，从而提高发光效率并实现尺寸的减小。

9. 发明授权

US08203165B2 Ceramic package for headlamp and headlamp modul having the same 有权
标题翻译：用于前照灯和前照灯模块的陶瓷包装相同
公开(公告)号：US08203165B2
公开(公告)日：2012-06-19
申请号：US12343455
申请日：2008-12-23
申请人： Young Jin Lee , Hyung Kun Kim
发明人： Young Jin Lee , Hyung Kun Kim
IPC分类号： H01L31/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/641 , H01L2924/0002 , H01L2924/19107 , H01L2924/00
摘要： Provided is a ceramic package for headlamp, and a headlamp module having the same. The ceramic package for headlamp includes a body part, a pair of internal electrodes, and an electrode exposing part. The body part has a cavity formed therein. The cavity is upwardly opened to expose a light emitting diode mounted on a mounting part. The pair of internal electrodes in the body part is electrically connected to the light emitting diode. The electrode exposing part is stepped at either side of the body part to upwardly expose the internal electrode to the outside.
摘要翻译：提供了一种用于头灯的陶瓷封装件和具有该陶瓷封装件的前照灯模块。用于头灯的陶瓷封装包括主体部分，一对内部电极和电极暴露部分。主体部分具有形成在其中的空腔。空腔向上打开以暴露安装在安装部件上的发光二极管。主体部分中的一对内部电极电连接到发光二极管。电极暴露部分在主体部分的任一侧是阶梯状的，以将内部电极向外暴露于外部。

10. 发明授权

US08247980B2 LED driving circuit and light emitting diode array device 有权
标题翻译： LED驱动电路和发光二极管阵列器件
公开(公告)号：US08247980B2
公开(公告)日：2012-08-21
申请号：US12262801
申请日：2008-10-31
申请人： Young Jin Lee , Joong Kon Son , Hyung Kun Kim , Jung Ja Yang , Grigory Onushkin
发明人： Young Jin Lee , Joong Kon Son , Hyung Kun Kim , Jung Ja Yang , Grigory Onushkin
IPC分类号： F21S4/00 , H05B37/00 , F21V33/00
CPC分类号： H05B33/0821
摘要： There is provided an LED driving circuit. The LED driving circuit according to an aspect of the invention may include: at least one ladder circuit including: (n−1) number (here, n is a positive integer satisfying n≧2) of first branches provided between first and second junction points, and connected in-line with each other by n number of first middle junction points, (n−1) number of second branches arranged in parallel with the first branches, and connected in-line with each other by n number of second middle junction points between the first and second junction points, and n number of middle branches connecting m-th first and second middle junction points to each other, wherein at least one LED device is disposed on each of the first, second, and middle branches. Here, the number of LED devices included in each of the first and second branches is greater than the number of LED devices included in each of the middle branches.
摘要翻译：提供了LED驱动电路。根据本发明的一个方面的LED驱动电路可以包括：至少一个梯形电路，包括：设置在第一和第二连接点之间的第一分支的（n-1）数（这里，n是满足n≥2的正整数）并且通过与第一分支平行布置的n个第一中间连接点（n-1）个数量的第二分支彼此并联连接，并且通过n个第二中间连接线彼此直接连接第一和第二连接点之间的点，以及将第m个第一和第二中间连接点彼此连接的n个中间分支，其中至少一个LED装置设置在第一，第二和中间分支中的每一个上。这里，包括在第一和第二分支中的每个中的LED装置的数量大于包括在每个中间分支中的LED装置的数量。

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