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1. 发明授权

US06537914B1 Integrated circuit device isolation methods using high selectivity chemical-mechanical polishing 有权
标题翻译：集成电路器件隔离方法采用高选择性化学机械抛光
公开(公告)号：US06537914B1
公开(公告)日：2003-03-25
申请号：US09570225
申请日：2000-05-12
申请人： Tai-su Park , Moon-han Park , Kyung-won Park , Han-sin Lee , Jung-yup Kim , Chang-ki Hong , Ho-kyu Kang
发明人： Tai-su Park , Moon-han Park , Kyung-won Park , Han-sin Lee , Jung-yup Kim , Chang-ki Hong , Ho-kyu Kang
IPC分类号： H01L21302
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/31053 , H01L21/76224
摘要： Trench isolation methods for integrated circuits may reduce irregularities in the formation of an isolation layer through use of a high selectivity chemical-mechanical polishing (CMP) operation. In particular, a substrate surface is etched to form a trench. An insulation layer is then formed on the substrate surface and in the trench. The insulation layer is chemical-mechanical polished using a slurry that includes a CeO2 group abrasive to form an isolation layer in the trench. The CMP selectivity ratio of a slurry that includes a CeO2 group abrasive may be sufficient to allow the substrate surface to be used as a CMP stop. As a result, a more consistent level of polishing may be maintained over the substrate surface, which may result in a more uniform thickness in the isolation layer.
摘要翻译：用于集成电路的沟槽隔离方法可以通过使用高选择性化学机械抛光（CMP）操作来减少形成隔离层的不规则性。特别地，蚀刻衬底表面以形成沟槽。然后在衬底表面和沟槽中形成绝缘层。绝缘层使用包含CeO 2基团研磨剂的浆料进行化学机械抛光，以在沟槽中形成隔离层。包括CeO 2基研磨剂的浆料的CMP选择比可能足以使基板表面用作CMP停止。结果，可以在衬底表面上保持更一致的抛光水平，这可能导致隔离层中更均匀的厚度。

2. 发明授权

US5847424A Capacitor of semiconductor memory device and manufacturing method thereof 失效
标题翻译：半导体存储器件的电容器及其制造方法
公开(公告)号：US5847424A
公开(公告)日：1998-12-08
申请号：US589712
申请日：1996-01-24
申请人： Ho-kyu Kang
发明人： Ho-kyu Kang
IPC分类号： H01L27/04 , H01L21/822 , H01L21/8242 , H01L21/8246 , H01L27/105 , H01L27/108
CPC分类号： H01L27/10852
摘要： A capacitor structure of a DRAM device and a method thereof, including a first electrode formed in each unit memory cell to be connected to a source of a transistor, a deteriorating prevention film formed at the lowermost surface of the first electrode, exclusive of a portion where the first electrode is connected to the source of a transistor, an underlayer formed beneath the deterioration prevention film, an undercut formed between the underlayer and deterioration prevention film, a high-dielectric film formed on surfaces of the first electrode, underlayer and deterioration prevention film which is exposed by the undercut, a reaction/diffusion prevention film formed on the high-dielectric film, formed on the first electrode and underlayer, exclusive of an area around the undercut, and a second electrode formed on the entire surface of the high-dielectric film and reaction/diffusion prevention film, thereby preventing increase of leakage current amount caused by the undercut formed during the capacitor manufacturing process.
摘要翻译：一种DRAM器件的电容器结构及其方法，包括形成在每个单元存储单元中以连接到晶体管源极的第一电极，形成在第一电极的最下表面处的劣化防止膜，不包括部分其中第一电极连接到晶体管的源极，在劣化防止膜下方形成的底层，形成在底层和劣化防止膜之间的底切，形成在第一电极，底层和防止劣化的表面上的高介电膜通过底切暴露的膜，形成在第一电极和下层上的形成在高电介质膜上的反应/扩散防止膜，不包括底切周围的区域，以及形成在高电介质膜的整个表面上的第二电极 - 电介质膜和反应/扩散膜，从而防止由形成的底切造成的漏电流量的增加环形电容器制造工艺。

3. 发明申请

US20070004133A1 Capacitor for a semiconductor device and method of fabricating same 失效
公开(公告)号：US20070004133A1
公开(公告)日：2007-01-04
申请号：US11519615
申请日：2006-09-12
申请人： Hong-Ki Kim , Ho-Kyu Kang , Moon-Han Park , Myong-Geun Yoon , Seok-Jun Won , Yong-Kuk Jeong , Kyung-Hun Kim
发明人： Hong-Ki Kim , Ho-Kyu Kang , Moon-Han Park , Myong-Geun Yoon , Seok-Jun Won , Yong-Kuk Jeong , Kyung-Hun Kim
IPC分类号： H01L21/8242 , H01L21/44
CPC分类号： H01L27/10852 , H01L27/10811 , H01L27/10888 , H01L27/10894 , H01L27/10897 , H01L28/55 , H01L28/60 , H01L28/75
摘要： A capacitor includes an upper electrode formed by physical vapor deposition and chemical vapor deposition. The upper electrode of the capacitor may include a first upper electrode formed by chemical vapor deposition and a second upper electrode formed by physical vapor deposition. Alternatively, the upper electrode may include a first upper electrode formed by physical vapor deposition and a second upper electrode formed by chemical vapor deposition. The upper electrode of the capacitor is formed through two steps using chemical vapor deposition and physical vapor deposition. Therefore, the upper electrode can be thick and rapidly formed, whereby electrical characteristics of the upper electrode are not deteriorated.

4. 发明授权

US07052967B2 Method for fabricating capacitor array preventing crosstalk between adjacent capacitors in semiconductor device 失效
公开(公告)号：US07052967B2
公开(公告)日：2006-05-30
申请号：US10394139
申请日：2003-03-24
申请人： Hae-jeong Lee , Ho-kyu Kang
发明人： Hae-jeong Lee , Ho-kyu Kang
IPC分类号： H01L21/20
CPC分类号： H01L21/764 , H01L27/0805 , H01L28/90
摘要： A capacitor array of a semiconductor device including a plurality of capacitors is provided. The capacitor array includes a plurality of lower electrodes, which are formed over a semiconductor substrate. A dielectric layer formed over the lower electrodes, and an upper electrode formed over the dielectric layer. The plurality of lower electrodes are insulated from each other either by an insulating layer having pores of a low dielectric constant, or by an air gap.

5. 发明申请

US20050142706A1 Method of preventing semiconductor layers from bending and semiconductor device formed thereby 有权
公开(公告)号：US20050142706A1
公开(公告)日：2005-06-30
申请号：US11059884
申请日：2005-02-17
申请人： Dong-Ho Ahn , Ho-Kyu Kang , Geum-Jong Bae
发明人： Dong-Ho Ahn , Ho-Kyu Kang , Geum-Jong Bae
IPC分类号： H01L21/76 , H01L21/265 , H01L21/316 , H01L21/762 , H01L27/12 , H01L29/786 , H01L21/00 , H01L21/84
CPC分类号： H01L21/76235 , H01L21/02238 , H01L21/02255 , H01L21/31662 , H01L21/76264 , H01L21/76283 , H01L27/1203
摘要： Disclosed herein are various methods for preventing bending of a patterned SOI layer during trench sidewall oxidation, the methods comprising providing a patterned SOI layer having at least one trench, said patterned SOI layer disposed upon an underlying buried silicon oxide layer; and blocking diffusion of oxygen between said patterned SOI and buried silicon oxide layer.

6. 发明授权

US5966614A Silicon nitride-free isolation methods for integrated circuits 失效
标题翻译：集成电路无氮化物隔离方法
公开(公告)号：US5966614A
公开(公告)日：1999-10-12
申请号：US934241
申请日：1997-09-19
申请人： Tai-su Park , Ho-kyu Kang
发明人： Tai-su Park , Ho-kyu Kang
IPC分类号： H01L21/76 , H01L21/762
CPC分类号： H01L21/76232 , Y10S438/959
摘要： Trench isolation methods for integrated circuit substrates may be simplified by eliminating the steps of forming a silicon nitride layer, etching the silicon nitride layer and removing the silicon nitride layer. In particular, a silicon nitride-free mask pattern, such as a photoresist mask pattern, may be formed on a silicon nitride-free integrated circuit substrate. The silicon nitride-free integrated circuit substrate is etched through the silicon nitride-free mask pattern to form a trench in the substrate. An insulating layer is formed in the trench and is chemical-mechanical polished to form a trench isolating layer. By eliminating the silicon nitride layer, simplified processing and improved performance may be obtained.
摘要翻译：通过消除形成氮化硅层的步骤，蚀刻氮化硅层和去除氮化硅层，可以简化用于集成电路基板的沟槽隔离方法。特别地，不含氮化硅的掩模图案，例如光致抗蚀剂掩模图案，可以形成在无氮化硅的集成电路基板上。通过无氮化硅的掩模图案蚀刻无氮化硅的集成电路衬底，以在衬底中形成沟槽。在沟槽中形成绝缘层，并进行化学机械抛光以形成沟槽隔离层。通过消除氮化硅层，可以获得简化的处理和改进的性能。

7. 发明申请

US20050098839A1 Semiconductor devices having different gate dielectrics and methods for manufacturing the same 审中-公开
标题翻译：具有不同栅极电介质的半导体器件及其制造方法
公开(公告)号：US20050098839A1
公开(公告)日：2005-05-12
申请号：US10930943
申请日：2004-09-01
申请人： Jong-Ho Lee , Ho-Kyu Kang , Yun-Seok Kim , Seok-Joo Doh , Hyung-Suk Jung
发明人： Jong-Ho Lee , Ho-Kyu Kang , Yun-Seok Kim , Seok-Joo Doh , Hyung-Suk Jung
IPC分类号： H01L21/336 , H01L21/8238 , H01L29/94
CPC分类号： H01L21/823857
摘要： A semiconductor device includes first and second transistor devices. The first device includes a first substrate region, a first gate electrode, and a first gate dielectric. The first gate dielectric is located between the first substrate region and the first gate electrode. The second device includes a second substrate region, a second gate electrode, and a second gate dielectric. The second gate dielectric is located between the second substrate region and the second gate electrode. The first gate dielectric includes a first high-k layer having a dielectric constant of 8 or more. Likewise, the second gate dielectric includes a second high-k layer having a dielectric constant of 8 or more. The second high-k layer has a different material composition than the first high-k layer.
摘要翻译：半导体器件包括第一和第二晶体管器件。第一器件包括第一衬底区域，第一栅极电极和第一栅极电介质。第一栅极电介质位于第一衬底区域和第一栅电极之间。第二器件包括第二衬底区域，第二栅极电极和第二栅极电介质。第二栅极电介质位于第二基板区域和第二栅极电极之间。第一栅极电介质包括介电常数为8以上的第一高k层。类似地，第二栅极电介质包括介电常数为8或更大的第二高k层。第二高k层具有与第一高k层不同的材料组成。

8. 发明授权

US06482715B2 Method of forming shallow trench isolation layer in semiconductor device 有权
公开(公告)号：US06482715B2
公开(公告)日：2002-11-19
申请号：US09927340
申请日：2001-08-13
申请人： Tai-su Park , Ho-kyu Kang , Dong-ho Ahn , Moon-han Park
发明人： Tai-su Park , Ho-kyu Kang , Dong-ho Ahn , Moon-han Park
IPC分类号： H01L2176
CPC分类号： H01L21/76229
摘要： A method of forming a shallow trench isolation layer in a semiconductor device is provided, wherein a first trench and a second trench are formed in an area selected from a semiconductor substrate and a sidewall oxide layer, an anti-oxidation liner, and a mask layer are formed on the semiconductor substrate including the inner surfaces of the first and second trenches, in the same order. Using photoresist lithography, the mask layer and the anti-oxidation layer are etched in the second trench. An isolation layer is formed in the first and second trenches by depositing and then chemically and mechanically polishing the dielectric material and the layers underneath until the semiconductor substrate surface is exposed. The first trench provides isolation between N-FETs, an N-FET and a P-FET, an N-FET and other circuit devices, a P-FET and other circuit devices, and other circuit devices and the second trench provides isolation between P-FETs.

9. 发明授权

US06333251B1 Method of fabricating gate structure of semiconductor device for repairing damage to gate oxide layer 失效
标题翻译：制造半导体器件栅极结构修复对栅极氧化层损伤的方法
公开(公告)号：US06333251B1
公开(公告)日：2001-12-25
申请号：US09639122
申请日：2000-08-16
申请人： Eun-ha Lee , Byung-chan Lee , Ho-kyu Kang
发明人： Eun-ha Lee , Byung-chan Lee , Ho-kyu Kang
IPC分类号： H01L213205
CPC分类号： H01L29/66636 , H01L21/28052 , H01L21/28247
摘要： A method of fabricating a gate of a semiconductor device, by which damage to a gate oxide layer is repaired, is provided. In an aspect of the method, a gate oxide layer is formed on a semiconductor substrate. A conductive layer containing silicon is formed on the gate oxide layer. A stacked structure with a polycrystalline silicon layer and a dichlorosilane-family tungsten silicide layer can be used as the conductive layer. A gate is formed by patterning the conductive layer. A silicon source layer which covers the sidewall of the gate is formed by selective epitaxial growth of silicon. The silicon source layer is grown to a thickness of about 200 Å or less. The silicon source layer is thermally treated at an oxidation atmosphere, thus repairing damage to the gate oxide layer.
摘要翻译：提供一种制造半导体器件的栅极的方法，通过该栅极对栅极氧化物层的损坏进行修复。在该方法的一个方面中，在半导体衬底上形成栅氧化层。在栅极氧化物层上形成含有硅的导电层。可以使用具有多晶硅层和二氯硅烷族硅化钨层的堆叠结构作为导电层。通过图案化导电层形成栅极。通过硅的选择性外延生长形成覆盖栅极侧壁的硅源层。硅源层生长至大约或以下的厚度。硅源层在氧化气氛下热处理，从而修复对栅极氧化物层的损伤。

10. 发明申请

US20150041944A1 IMAGE SENSOR, FABRICATING METHOD THEREOF, AND DEVICE COMPRISING THE IMAGE SENSOR 审中-公开
标题翻译：图像传感器，其制造方法和包含图像传感器的装置
公开(公告)号：US20150041944A1
公开(公告)日：2015-02-12
申请号：US14479885
申请日：2014-09-08
申请人： Hong-ki KIM , Ho-Kyu KANG , June-taeg LEE , Jae-Hee CHOI
发明人： Hong-ki KIM , Ho-Kyu KANG , June-taeg LEE , Jae-Hee CHOI
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14636 , H01L23/564 , H01L27/14618 , H01L27/14621 , H01L27/14632 , H01L27/14638 , H01L27/1464 , H01L27/14687 , H01L2224/48095 , H01L2224/48227 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： Image sensor, fabricating method thereof, and device comprising the image sensor are provided, which comprises a substrate in which a photoelectric transformation device is formed, an interconnection structure formed on the substrate and including multiple intermetal dielectric layers and multiple metal interconnections placed in the multiple intermetal dielectric layers, the interconnection structure defining a cavity aligned corresponding to the photoelectric transformation device, a moisture absorption barrier layer conformally formed on a top of the interconnection structure and in the cavity; and a light guide unit formed on the moisture absorption barrier layer and including light transmittance material filling the cavity, wherein the moisture absorption barrier layer is formed with a uniform thickness on both sides and a bottom of the cavity and on a top surface of the multiple intermetal dielectric layer.
摘要翻译：提供了图像传感器及其制造方法以及包括图像传感器的装置，其包括形成有光电转换装置的基板，形成在基板上的互连结构，并且包括多个金属间介电层和多个金属互连金属间电介质层，所述互连结构限定对应于所述光电转换装置对准的空腔;保形地形成在所述互连结构的顶部和所述空腔中的吸湿阻挡层; 以及导光单元，其形成在吸湿阻挡层上并且包括填充空腔的透光材料，其中吸湿阻挡层在空腔的两侧和底部以及多个顶部表面上形成均匀的厚度金属间电介质层。

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