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1. 发明专利

JPS5771947A Hole-in anchor 失效
标题翻译：空穴锚
公开(公告)号：JPS5771947A
公开(公告)日：1982-05-06
申请号：JP14646280
申请日：1980-10-20
申请人： Hitoshi Sakurai
发明人： SAKURAI HITOSHI
IPC分类号： E04B1/41

2. 发明专利

JPS61143201A Antiskid device for tire in running in snow 失效
标题翻译：轮胎在雪中运行的防盗装置
公开(公告)号：JPS61143201A
公开(公告)日：1986-06-30
申请号：JP26374484
申请日：1984-12-15
申请人： Hitoshi Sakurai
发明人： SAKURAI HITOSHI
IPC分类号： B60B15/04 , B60B15/26
CPC分类号： B60B15/26
摘要： PURPOSE: To obtain an antiskid device without environmental pollution by providing a snow pin in an elastic member movably provided in the tip of a radial supporting member, which pin is embedded in the member in a normal time and is projected by the movement of the elastic member in a central direction.
CONSTITUTION: A radial supporting means 4 mounted by an attaching means 1 on a wheel is rotated together with the wheel. A snow pin 8 is embedded in the supporting means 4, and an elastic body 6 is pushed out outwardly in a radial direction by means of a pressing means 5. When the elastic body 6 contacts a road surface, the pressing member 5 is compressed to move to the inside of a radial direction, and the snow pin is projected to show an antiskid function. By this constitution, it is possible to obtain an antiskid device which can be attached and detached without environmental pollution.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：为了获得无环境污染的防滑装置，通过在可移动地设置在径向支撑构件的尖端中的弹性构件中提供雪销，该销在正常时间嵌入构件中并且通过弹性体的运动而突出会员在中心方向。构成：由安装装置1安装在轮上的径向支撑装置4与轮一起转动。雪花销8嵌入支撑装置4中，并且弹性体6通过按压装置5沿径向向外推出。当弹性体6接触路面时，按压构件5被压缩到移动到径向内侧，并且雪销被投影以显示防滑功能。通过这种结构，可以获得可以在没有环境污染的情况下被安装和拆卸的防滑装置。

3. 发明申请

US20140083567A1 SOLDERING PASTE FLUX AND SOLDERING PASTE 审中-公开
标题翻译：焊膏和焊膏
公开(公告)号：US20140083567A1
公开(公告)日：2014-03-27
申请号：US14119104
申请日：2011-10-07
申请人： Teruyoshi Hamagawa , Youichi Kukimoto , Taku Hasegawa , Hitoshi Sakurai
发明人： Teruyoshi Hamagawa , Youichi Kukimoto , Taku Hasegawa , Hitoshi Sakurai
IPC分类号： B23K35/02 , B23K35/362
CPC分类号： B23K35/025 , B23K35/02 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K35/362 , C08G59/38 , C08K3/08 , C08K5/09 , C08K5/29 , C08L63/00 , C08L79/04 , C22C12/00
摘要： The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.
摘要翻译：本发明涉及一种焊膏助焊剂，焊膏助焊剂包括（A）热固性预聚物，（B）分子中具有三个以上官能团的多官能环氧单体或低聚物，（C）具有熔点为80〜170℃，（D）分子中具有2个以上氰基的氰酸酯。

4. 发明授权

US08185699B2 Cache memory controller and cache memory controlling method 有权
标题翻译：缓存内存控制器和缓存内存控制方式
公开(公告)号：US08185699B2
公开(公告)日：2012-05-22
申请号：US12222231
申请日：2008-08-05
申请人： Kumiko Endo , Hitoshi Sakurai
发明人： Kumiko Endo , Hitoshi Sakurai
IPC分类号： G06F12/00 , G06F13/00
CPC分类号： G06F12/0891 , G06F12/0804
摘要： In a separating device that separates a processor configured to perform process by using data recorded in a cache memory connected to the processor, a stopping unit, upon receiving a processor separation request, stops the processor from performing a new process; and a separation executing unit, upon completion of process being performed by the processor, separates the processor after invalidating the data recorded in the cache memory.
摘要翻译：在通过使用记录在连接到处理器的高速缓冲存储器中的数据来分离被配置为执行处理的处理器的分离装置中，停止单元在接收到处理器分离请求时停止处理器执行新处理; 以及分离执行单元，在完成由处理器执行的处理之后，在记录在高速缓冲存储器中的数据无效之后分离处理器。

5. 发明申请

US20080160331A1 SOLDER PASTE COMPOSITION, SOLDER PRECOATING METHOD AND MOUNTED SUBSTRATE 审中-公开
标题翻译：焊膏组合物，焊接预处理方法和安装基板
公开(公告)号：US20080160331A1
公开(公告)日：2008-07-03
申请号：US12038404
申请日：2008-02-27
申请人： Yoichi Kukimoto , Kazuki Ikeda , Hitoshi Sakurai
发明人： Yoichi Kukimoto , Kazuki Ikeda , Hitoshi Sakurai
IPC分类号： B23K35/36 , B22F7/00 , B22F7/02
CPC分类号： B23K35/025 , B22F1/007 , B23K35/36 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2924/00014 , H01L2924/01327 , H05K1/111 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/09381 , H05K2203/043 , Y10T428/12035 , Y10T428/12493 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. A second solder paste composition contains a deposition solder material which deposits the solder by heating and a flux, and a metallic powder comprising metallic species different from metallic species constituting a metallic component in the deposition solder material and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the metallic component in the deposition solder material. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad.
摘要翻译：本发明涉及一种用于用焊料预涂电极表面的焊膏组合物。第一焊膏组合物含有焊料粉末和焊剂，以及由构成焊料粉末的金属物质的金属物质构成的金属粉末和构成电极表面的金属物质的比例为0.1重量％以上且20重量％或更少的焊锡粉末。第二焊膏组合物包含通过加热和焊剂沉积焊料的沉积焊料材料和包含金属物质的金属粉末，所述金属粉末包含不同于沉积焊料材料中构成金属成分的金属物质和构成电极表面的金属物质的速率相对于沉积焊料的金属成分的总量为0.1重量％以上且20重量％以下。当将这些焊膏组合物均匀地涂覆到用于预涂层的电子电路基板上时，可以形成不产生任何溶胀部分的焊料，焊料缺乏部分和其高度的变化性，而与焊盘的形状无关。

6. 发明授权

US5565042A Black chromate solution 失效
标题翻译：黑色铬酸溶液
公开(公告)号：US5565042A
公开(公告)日：1996-10-15
申请号：US562149
申请日：1995-11-22
申请人： Hitoshi Sakurai , Seiji Kishikawa , Tomitaka Yamamoto , Tadahiro Itoh
发明人： Hitoshi Sakurai , Seiji Kishikawa , Tomitaka Yamamoto , Tadahiro Itoh
IPC分类号： C25D11/38 , C23C22/26 , C23C22/27
CPC分类号： C23C22/27
摘要： A chemically stable black chromate solution capable of forming an anticorrosive black chromate film on a Zn-Ni alloy plating is provided, the components being easily soluble in the solution. The black chromate solution comprises 1 to 50 g/l of hexavalent chromium; 1 to 50 g/l of sulfate ion; 0.05 to 1.0 g/l of soluble silver; 0.5 to 100 g/l of a sulfonated carboxylic acid selected from the group consisting of sulfo-aromatic carboxylic acids having 7 to 15 carbon atoms, sulfonated aliphatic dicarboxylic acids having 3 to 10 carbon atoms and salts thereof; and a balance of water, the solution having a pH of 0.5 to 2.5.
摘要翻译：提供了能够在Zn-Ni合金电镀上形成防腐黑色铬酸盐膜的化学稳定的黑色铬酸盐溶液，其组分易溶于溶液。黑色铬酸盐溶液含有1至50g / l的六价铬; 1至50克/升硫酸根离子; 0.05〜1.0g / l的可溶性银; 0.5至100g / l的磺化羧酸，其选自具有7至15个碳原子的磺基芳族羧酸，具有3至10个碳原子的磺化脂族二羧酸及其盐; 和余量的水，该溶液的pH为0.5至2.5。

7. 发明授权

US4685743A Wheel anti-skid attachment 失效
标题翻译：车轮防滑附件
公开(公告)号：US4685743A
公开(公告)日：1987-08-11
申请号：US806794
申请日：1985-12-09
申请人： Hitoshi Sakurai
发明人： Hitoshi Sakurai
IPC分类号： B60B15/04 , B60B15/26
CPC分类号： B60B15/26
摘要： A vehicle slip protector including a frame to be fixed to a vehicle wheel for rotation therewith, spokes extending radially outward from the center axis of the frame which is aligned with the axle of the wheel, so as to be radially reciprocally slidably mounted to the frame, elastic shoes attached to the outer ends of the spokes, coils on the spokes urging the shoes radially outward to contact a road surface, and spikes embedded in the shoes for projecting outwardly of the shoes into contact with the road surface in response to a predetermined radial compression of the shoes applied by the coil springs while the elastic shoes are in contact with the road surface.
摘要翻译：一种车辆滑动保护器，包括要固定到车轮上以与其一起旋转的框架，从与框架的轴对准的框架的中心轴线径向向外延伸的轮辐，以便沿径向往复滑动地安装到框架附接到辐条的外端的弹性鞋，在轮辐上盘绕着径向向外推动鞋接触路面的鞋垫，以及嵌入鞋中的鞋钉，用于响应于预定的鞋子向外突出，与鞋面接触，与路面接触当弹性鞋与路面接触时，由螺旋弹簧施加的鞋的径向压缩。

8. 发明申请

US20100270365A1 SOLDER PASTE COMPOSITION HAVING SOLDER POWDER, FLUX AND METALLIC POWDER 审中-公开
标题翻译：焊料粉末，金属粉末和金属粉末的焊膏组合物
公开(公告)号：US20100270365A1
公开(公告)日：2010-10-28
申请号：US12831667
申请日：2010-07-07
申请人： Yoichi KUKIMOTO , Kazuki Ikeda , Hitoshi Sakurai , Nobuhiro Kinoshita , Masaki Nakanishi
发明人： Yoichi KUKIMOTO , Kazuki Ikeda , Hitoshi Sakurai , Nobuhiro Kinoshita , Masaki Nakanishi
IPC分类号： B23K1/20
CPC分类号： B23K35/025 , B22F1/007 , B23K35/36 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2924/00014 , H01L2924/01327 , H05K1/111 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/09381 , H05K2203/043 , Y10T428/12035 , Y10T428/12493 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad.
摘要翻译：本发明涉及一种用于用焊料预涂电极表面的焊膏组合物。第一焊膏组合物含有焊料粉末和焊剂，以及由构成焊料粉末的金属物质的金属物质构成的金属粉末和构成电极表面的金属物质的比例为0.1重量％以上且20重量％或更少的焊锡粉末。当将这些焊膏组合物均匀地涂覆到用于预涂层的电子电路基板上时，可以形成不产生任何溶胀部分的焊料，焊料缺乏部分和其高度的变化性，而与焊盘的形状无关。

9. 发明授权

US07569164B2 Solder precoating method 有权
标题翻译：焊接预涂法
公开(公告)号：US07569164B2
公开(公告)日：2009-08-04
申请号：US11699046
申请日：2007-01-29
申请人： Hitoshi Sakurai , Yoichi Kukimoto
发明人： Hitoshi Sakurai , Yoichi Kukimoto
IPC分类号： H01B1/02 , H01B1/22
CPC分类号： H05K3/3484 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , H05K2201/0266 , Y10T428/1486
摘要： A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.
摘要翻译：一种焊料组合物，其用于通过在基板上的电极周围形成堤坝来形成焊料凸块的焊料预涂布方法，在由坝围绕的开口部内填充电极上的焊膏组合物，并加热填充的焊膏组合物，使得焊料粘附到电极的表面。焊膏组合物含有焊料粉末，其具有粒径分布的焊料粉末，其中粒径小于10μm的颗粒存在16％或更多，并且颗粒尺寸小于10um的颗粒的总和和具有 10μm以上且小于20μm的粒径为90％以上。由此，能够抑制突起缺陷的发生，通过使用该堤坝的焊料预涂法，能够以高产率形成均匀高度的焊料凸块。

10. 发明申请

US20080313409A1 Separating device and separating method 有权
标题翻译：分离装置和分离方法
公开(公告)号：US20080313409A1
公开(公告)日：2008-12-18
申请号：US12222231
申请日：2008-08-05
申请人： Kumiko Endo , Hitoshi Sakurai
发明人： Kumiko Endo , Hitoshi Sakurai
IPC分类号： G06F12/08
CPC分类号： G06F12/0891 , G06F12/0804
摘要： In a separating device that separates a processor configured to perform process by using data recorded in a cache memory connected to the processor, a stopping unit, upon receiving a processor separation request, stops the processor from performing a new process; and a separation executing unit, upon completion of process being performed by the processor, separates the processor after invalidating the data recorded in the cache memory.
摘要翻译：在通过使用记录在连接到处理器的高速缓冲存储器中的数据来分离被配置为执行处理的处理器的分离装置中，停止单元在接收到处理器分离请求时停止处理器执行新处理; 以及分离执行单元，在完成由处理器执行的处理之后，在记录在高速缓冲存储器中的数据无效之后分离处理器。

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