专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080160331A1 SOLDER PASTE COMPOSITION, SOLDER PRECOATING METHOD AND MOUNTED SUBSTRATE 审中-公开
标题翻译：焊膏组合物，焊接预处理方法和安装基板
公开(公告)号：US20080160331A1
公开(公告)日：2008-07-03
申请号：US12038404
申请日：2008-02-27
申请人： Yoichi Kukimoto , Kazuki Ikeda , Hitoshi Sakurai
发明人： Yoichi Kukimoto , Kazuki Ikeda , Hitoshi Sakurai
IPC分类号： B23K35/36 , B22F7/00 , B22F7/02
CPC分类号： B23K35/025 , B22F1/007 , B23K35/36 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2924/00014 , H01L2924/01327 , H05K1/111 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/09381 , H05K2203/043 , Y10T428/12035 , Y10T428/12493 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. A second solder paste composition contains a deposition solder material which deposits the solder by heating and a flux, and a metallic powder comprising metallic species different from metallic species constituting a metallic component in the deposition solder material and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the metallic component in the deposition solder material. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad.
摘要翻译：本发明涉及一种用于用焊料预涂电极表面的焊膏组合物。第一焊膏组合物含有焊料粉末和焊剂，以及由构成焊料粉末的金属物质的金属物质构成的金属粉末和构成电极表面的金属物质的比例为0.1重量％以上且20重量％或更少的焊锡粉末。第二焊膏组合物包含通过加热和焊剂沉积焊料的沉积焊料材料和包含金属物质的金属粉末，所述金属粉末包含不同于沉积焊料材料中构成金属成分的金属物质和构成电极表面的金属物质的速率相对于沉积焊料的金属成分的总量为0.1重量％以上且20重量％以下。当将这些焊膏组合物均匀地涂覆到用于预涂层的电子电路基板上时，可以形成不产生任何溶胀部分的焊料，焊料缺乏部分和其高度的变化性，而与焊盘的形状无关。

2. 发明申请

US20100270365A1 SOLDER PASTE COMPOSITION HAVING SOLDER POWDER, FLUX AND METALLIC POWDER 审中-公开
标题翻译：焊料粉末，金属粉末和金属粉末的焊膏组合物
公开(公告)号：US20100270365A1
公开(公告)日：2010-10-28
申请号：US12831667
申请日：2010-07-07
申请人： Yoichi KUKIMOTO , Kazuki Ikeda , Hitoshi Sakurai , Nobuhiro Kinoshita , Masaki Nakanishi
发明人： Yoichi KUKIMOTO , Kazuki Ikeda , Hitoshi Sakurai , Nobuhiro Kinoshita , Masaki Nakanishi
IPC分类号： B23K1/20
CPC分类号： B23K35/025 , B22F1/007 , B23K35/36 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2924/00014 , H01L2924/01327 , H05K1/111 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/09381 , H05K2203/043 , Y10T428/12035 , Y10T428/12493 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad.
摘要翻译：本发明涉及一种用于用焊料预涂电极表面的焊膏组合物。第一焊膏组合物含有焊料粉末和焊剂，以及由构成焊料粉末的金属物质的金属物质构成的金属粉末和构成电极表面的金属物质的比例为0.1重量％以上且20重量％或更少的焊锡粉末。当将这些焊膏组合物均匀地涂覆到用于预涂层的电子电路基板上时，可以形成不产生任何溶胀部分的焊料，焊料缺乏部分和其高度的变化性，而与焊盘的形状无关。

3. 发明授权

US07569164B2 Solder precoating method 有权
标题翻译：焊接预涂法
公开(公告)号：US07569164B2
公开(公告)日：2009-08-04
申请号：US11699046
申请日：2007-01-29
申请人： Hitoshi Sakurai , Yoichi Kukimoto
发明人： Hitoshi Sakurai , Yoichi Kukimoto
IPC分类号： H01B1/02 , H01B1/22
CPC分类号： H05K3/3484 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , H05K2201/0266 , Y10T428/1486
摘要： A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.
摘要翻译：一种焊料组合物，其用于通过在基板上的电极周围形成堤坝来形成焊料凸块的焊料预涂布方法，在由坝围绕的开口部内填充电极上的焊膏组合物，并加热填充的焊膏组合物，使得焊料粘附到电极的表面。焊膏组合物含有焊料粉末，其具有粒径分布的焊料粉末，其中粒径小于10μm的颗粒存在16％或更多，并且颗粒尺寸小于10um的颗粒的总和和具有 10μm以上且小于20μm的粒径为90％以上。由此，能够抑制突起缺陷的发生，通过使用该堤坝的焊料预涂法，能够以高产率形成均匀高度的焊料凸块。

4. 发明申请

US20080179383A1 Solder paste composition and solder precoating method 有权
标题翻译：焊膏组合物和焊料预涂法
公开(公告)号：US20080179383A1
公开(公告)日：2008-07-31
申请号：US11699046
申请日：2007-01-29
申请人： Hitoshi Sakurai , Yoichi Kukimoto
发明人： Hitoshi Sakurai , Yoichi Kukimoto
IPC分类号： B23K31/02 , B23K35/363
CPC分类号： H05K3/3484 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , H05K2201/0266 , Y10T428/1486
摘要： A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.
摘要翻译：一种焊料组合物，其用于通过在基板上的电极周围形成堤坝来形成焊料凸块的焊料预涂布方法，在由坝围绕的开口部内填充电极上的焊膏组合物，并加热填充的焊膏组合物，使得焊料粘附到电极的表面。该焊膏组合物含有焊料粉末，该焊料粉末的粒径分布为粒径小于10μm的粒子的含量为16％以上，粒径为10μm以下的粒子的总和为 10μm以上且小于20μm的粒径为90％以上。由此，能够抑制突起缺陷的发生，通过使用该堤坝的焊料预涂法，能够以高产率形成均匀高度的焊料凸块。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式