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    • 1. 发明授权
    • Industrial robot
    • 工业机器人
    • US07922439B2
    • 2011-04-12
    • US12314569
    • 2008-12-12
    • Hisaki Kato
    • Hisaki Kato
    • B25J19/00
    • B25J19/0075Y10T74/20305
    • A robot comprises a fixed member that has a lower end, a movable member, and an elastic sheet member. The movable member is supported by the fixed member to be movable between an uppermost position and a lowermost position of a movable range given to the movable member in a vertical direction relative to the fixed member. This movable member has a lower end at which an operation tool is provided The elastic sheet member has both ends. Of these ends, one end is fixed to the lower end of the fixed member and the other end is fixed to the lower end of the movable member. This sheet member droops when the movable member moves up to the uppermost position of the fixed member.
    • 机器人包括具有下端的固定构件,可动构件和弹性片构件。 可动构件由固定构件支撑,以能够相对于固定构件沿垂直方向在可移动构件的可移动范围的最上位置和最下位置之间移动。 该可动构件具有设置有操作工具的下端。弹性片构件具有两端。 在这些端部中,一端固定在固定部件的下端,另一端固定在可动部件的下端。 当可动构件向上移动到固定构件的最上位置时,该片构件下垂。
    • 2. 发明授权
    • Spectroscopic device
    • 光谱仪
    • US07623243B2
    • 2009-11-24
    • US10572369
    • 2004-09-13
    • Hisaki Kato
    • Hisaki Kato
    • G01N21/25
    • G01J3/02G01J3/021G01J3/0256G01J3/36
    • A spectroscopic device that can suppress the occurrence of cross-talk when light beams of different wavelength ranges are optically received is provided. Detected light is made incident to a dichroic minor (hereinafter referred to as “mirror”) DM1 along the perpendicular direction of a photoelectric surface 7. Accordingly, light transmitted through the mirror DM1 is made incident substantially perpendicular to the photoelectric surface 7. On the other hand, light reflected from the mirror DM1 is reflected from a main mirror surface 23. At this time, the dichroic mirror array 21 is inclined so that the mirror DM8 side having the minimum shortest wavelength is nearer to the photoelectric surface 7 than the minor DM1 side having the maximum shortest wavelength and substantially parallel to the main minor surface 23a, so that light reflected from the main mirror surface 23a is made incident to the mirror DM2 along the perpendicular direction of the photoelectric surface 7. Accordingly, light transmitted through the mirror DM2 is made incident substantially perpendicular tote photoelectric surface 7. As described above, the light transmitted through each mirror DMn is substantially vertical made incident to the photoelectric surface 7, and thus the occurrence of cross-talk can be suppressed.
    • 提供了可以抑制在不同波长范围的光束被光学接收时串扰发生的分光装置。 检测光沿光电表面7的垂直方向入射到二向色小型(以下称为“镜子”)DM1。因此,透过反射镜DM1的光基本上垂直于光电表面7入射。在 从反射镜DM1反射的光从主镜面23反射。此时,分色镜阵列21倾斜,使得具有最小最短波长的反射镜DM8侧比次要的更靠近光电表面7 DM1侧具有最大最短波长并且基本上平行于主次表面23a,使得从主镜面23a反射的光沿光电表面7的垂直方向入射到反射镜DM2。因此,透过 镜DM2被制成基本上垂直于光电表面7入射。如上所述,透光 通过每个反射镜DMn基本垂直地入射到光电表面7,从而可以抑制串扰的发生。
    • 3. 发明授权
    • Method for manufacturing a gallium nitride group compound semiconductor
    • 氮化镓基化合物半导体的制造方法
    • US06984536B2
    • 2006-01-10
    • US10052347
    • 2002-01-23
    • Katsuhide ManabeAkira MabuchiHisaki KatoMichinari SassaNorikatsu KoideShiro YamazakiMasafumi HashimotoIsamu Akasaki
    • Katsuhide ManabeAkira MabuchiHisaki KatoMichinari SassaNorikatsu KoideShiro YamazakiMasafumi HashimotoIsamu Akasaki
    • H01L21/20
    • H01L33/32H01L33/007H01L33/025
    • Disclosed herein are (1) a light-emitting semiconductor device that uses a gallium nitride compound semiconductor (AlxGa1−xN) in which the n-layer of n-type gallium nitride compound semiconductor (AlxGa1−xN) is of double-layer structure including an n-layer of low carrier concentration and an n+-layer of high carrier concentration, the former being adjacent to the i-layer of insulating gallium nitride compound semiconductor (AlxGa1−xN); (2) a light-emitting semiconductor device of similar structure as above in which the i-layer is of double-layer structure including an iL-layer of low impurity concentration containing p-type impurities in comparatively low concentration and an iH-layer of high impurity concentration containing p-type impurities in comparatively high concentration, the former being adjacent to the n-layer; (3) a light-emitting semiconductor device having both of the above-mentioned features and (4) a method of producing a layer of an n-type gallium nitride compound semiconductor (AlxGa1−xN) having a controlled conductivity from an organometallic compound by vapor phase epitaxy, by feeding a silicon-containing gas and other raw material gases together at a controlled mixing ratio.
    • 本文公开了(1)使用氮化镓化合物半导体(Al x Ga 1-x N)的发光半导体器件,其中n层n 型氮化镓化合物半导体(Al x Ga 1-x N)是包括低载流子浓度的n层和n < 高载流子浓度的+层,前者与绝缘氮化镓化合物半导体(Al x Ga 1-x N)的i层相邻, ; (2)具有上述类似结构的发光半导体器件,其中i层是双层结构,包括相对较低的含有p型杂质的低杂质浓度的i L层 低浓度和高浓度的含有p型杂质的高杂质浓度的i H +层,前者与n层相邻; (3)具有上述两个特征的发光半导体器件和(4)制造n型氮化镓系化合物半导体层的方法(Al x Ga Ga 1-x N),通过气相外延从有机金属化合物具有受控的导电性,通过以可控混合比将含硅气体和其它原料气体一起供给到一起。
    • 10. 发明授权
    • Lower vessel of RH degasser
    • RH脱气机的下部容器
    • US09170052B2
    • 2015-10-27
    • US13824733
    • 2011-10-07
    • Yoshiyuki NakamuraHisaki KatoShinya YoshimitsuHiroharu IdoHiroshi Nomura
    • Yoshiyuki NakamuraHisaki KatoShinya YoshimitsuHiroharu IdoHiroshi Nomura
    • C21C7/10F27D1/04C21C1/06
    • F27D1/04C21C1/06C21C7/10F27D1/045
    • A bottom part refractory includes a center part refractory, an arrangement refractory which is arranged contiguously with the center part refractory, and a connection refractory which is arranged at a position where at least a portion of the connection refractory overlaps with a vertically downward projection view of a side wall refractory. The connection refractory which is contiguously arranged with the arrangement refractory is constituted of two or more force transmission refractories arranged in the direction toward the arrangement refractory from the side-wall refractory. Opposedly facing surfaces between the force transmission refractories at least at a position among the force transmission refractories are inclined such that upper portions of the opposedly facing surfaces are positioned on a more inner side of a bottom portion than lower portions of the opposedly facing surfaces are positioned.
    • 底部耐火材料包括中心部分耐火材料,与中心部件耐火材料连续布置的配置耐火材料,以及连接耐火材料,其设置在连接耐火材料的至少一部分与垂直向下投影的重叠部分 侧壁耐火材料。 与排列耐火材料连续布置的连接耐火材料由从侧壁耐火材料朝向排列耐火材料的方向布置的两个或更多个力传递耐火材料构成。 至少在力传递耐火材料之间的位置处的力传递耐火材料之间的面对面的表面倾斜,使得相对面的表面的上部位于底部的比内侧相对的表面的下部更靠内侧 。