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    • 2. 发明申请
    • BIPOLAR DEVICE AND FABRICATION METHOD THEREOF
    • 双极器件及其制造方法
    • US20090057685A1
    • 2009-03-05
    • US12176635
    • 2008-07-21
    • Kazuhiro MOCHIZUKIHidekatsu OnoseNatsuki Yokoyama
    • Kazuhiro MOCHIZUKIHidekatsu OnoseNatsuki Yokoyama
    • H01L29/24
    • H01L29/1608H01L29/0804H01L29/66068H01L29/7322
    • In a mesa type bipolar transistor or a thyristor, since carriers injected from an emitter layer or an anode layer to a base layer or a gate layer diffuse laterally and are recombined, reduction in the size and improvement for the switching frequency is difficult.In the invention, the emitter layer or the anode layer is formed of two high-doped and low-doped layers, a semiconductor region for suppressing recombination comprising an identical semiconductor having an impurity density identical with that of the low-doped layer is present being in contact with a base layer or a gate layer and a surface passivation layer, and the width of the semiconductor region for suppressing recombination is defined equal with or longer than the diffusion length of the carrier. This provides an effect of attaining reduction in the size of the bipolar transistor or improvement of the switching frequency of the thyristor without deteriorating the performance. Further, this has an effect of greatly improving the current gain by successively stacking above the high-doped emitter layer of the bipolar transistor, a hole barrier layer, a conduction band discontinuity relaxed layer and an emitter contact layer.
    • 在台式双极晶体管或晶闸管中,由于从发射极层或阳极层向基极层或栅极层注入的载流子横向漫射并重新组合,因此难以减小开关频率的尺寸和改善。 在本发明中,发射极层或阳极层由两个高掺杂和低掺杂层形成,用于抑制复合的半导体区域包括具有与低掺杂层的杂质密度相同的杂质密度的相同半导体, 与基底层或栅极层和表面钝化层接触,并且用于抑制复合的半导体区域的宽度被限定为等于或长于载体的扩散长度。 这提供了在不降低性能的情况下实现双极晶体管的尺寸的减小或晶闸管的开关频率的提高的效果。 此外,这具有通过连续堆叠在双极晶体管,空穴阻挡层,导带不连续松弛层和发射极接触层的高掺杂发射极层上方大大改善电流增益的效果。
    • 6. 发明授权
    • Semiconductor device and electrical circuit device using thereof
    • 半导体装置及其电路装置
    • US07768066B2
    • 2010-08-03
    • US12179549
    • 2008-07-24
    • Hidekatsu OnoseHiroyuki Takazawa
    • Hidekatsu OnoseHiroyuki Takazawa
    • H01L29/94
    • H01L29/7828H01L25/18H01L29/0623H01L29/0696H01L29/1608H01L29/66068H01L29/7391H01L2924/0002H01L2924/00
    • A UMOSFET is capable of reducing a threshold voltage and producing a large saturation current. A typical UMOSFET according to the present invention includes: an N+ type SiC substrate constituting a drain layer; an N− type SiC layer that is in contact with the drain layer and constitutes a drift layer; a P type body layer formed on the drift layer and being a semiconductor layer; an N+ type SiC layer constituting a source layer; a trench extending from the source layer to a predetermined location placed in the drift layer; a P type electric field relaxation region provided around and outside a bottom portion of the trench; and a channel region extending from the N+ type source layer to the P type electric field relaxation region and having an impurity concentration higher than that of the N− type drift layer and lower than that of the P type body layer.
    • UMOSFET能够降低阈值电压并产生大的饱和电流。 根据本发明的典型的UMOSFET包括:构成漏极层的N +型SiC衬底; 与漏极层接触并构成漂移层的N型SiC层; 形成在所述漂移层上并且是半导体层的P型体层; 构成源极层的N +型SiC层; 从源极层延伸到放置在漂移层中的预定位置的沟槽; 设置在沟槽的底部周围和外侧的P型电场弛豫区域; 以及从N +型源极层向P型电场弛豫区域延伸并且杂质浓度高于N型漂移层的杂质浓度并低于P型体层的沟道区域。