会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • OPTICAL METROLOGICAL SCALE AND LASER-BASED MANUFACTURING METHOD THEREFOR
    • 光学尺度和激光制造方法
    • WO2007044798A2
    • 2007-04-19
    • PCT/US2006039704
    • 2006-10-11
    • GSI GROUP CORPPELSUE KURTDODSON II STUART AHUNTER BRADLEY LSMART DONALD VMABBOUX PIERRE-YVESEHRMANN JONATHAN S
    • PELSUE KURTDODSON II STUART AHUNTER BRADLEY LSMART DONALD VMABBOUX PIERRE-YVESEHRMANN JONATHAN S
    • C08K3/32
    • B41M5/24B23K26/364G01D5/34707
    • A reflective metrological scale has a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of a substrate, which may be a nickel-based metal alloy such as Invar® or Inconel® and may be a thin and elongated flexible tape. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled or ridged and may be darkened to provide an enhanced optical reflection ratio with respect to surrounding reflective surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating a surface of the substrate at a mark location with a series of overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm 2 , and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.
    • 反射计量标尺具有由基底的反射表面区域包围的细长的并排标记的刻度图形,其可以是诸如Invar或Inconel的镍基金属合金,并且可以是薄且细长的柔性带 。 每个标记具有沟槽的横截面并且可以具有在0.5至2微米范围内的深度。 每个标记的中心区域可以是波纹或脊状的,并且可以变暗,以提供相对于周围的反射表面区域的增强的光反射率。 一种制造方法包括以下重复步骤:(1)通过在来自激光的一系列重叠脉冲的标记位置处照射基板的表面来产生刻度标记,每个脉冲的能量密度小于约1焦耳/厘米 < SUP> 2>和(2)通过在衬底上限定下一标记位置的位移量来改变激光和衬底的相对位置,在该衬底上将要生成刻度的下一个标记。
    • 3. 发明申请
    • METHOD AND SYSTEM FOR PRECISELY POSITIONING A WAIST OF A MATERIAL-PROCESSING LASER BEAM TO PROCESS MICROSTRUCTURES WITHIN A LASER-PROCESSING SITE
    • 用于精确定位材料加工激光束以在激光加工站中处理微结构的方法和系统
    • WO0187534A2
    • 2001-11-22
    • PCT/US0115552
    • 2001-05-15
    • GEN SCANNING INCHUNTER BRADLEY LCAHILL STEVEN PEHRMANN JONATHAN SPLOTKIN MICHAEL
    • HUNTER BRADLEY LCAHILL STEVEN PEHRMANN JONATHAN SPLOTKIN MICHAEL
    • B23K26/04B23K26/08B23K101/40G03F7/20H01L21/82B23K26/00
    • B23K26/046B23K26/02B23K26/04B23K26/043B23K26/0853B23K2201/40G03F7/70041G03F7/70725
    • A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis. The system also includes a first controller for controlling the x-y stage based on reference data which represents 3-D locations of microstrucutures to be processed within the site, a second controller, and a first voice coil coupled to the second controller for positioning the first air bearing sled along the optical axis also based on the reference data. The reference data is generated by the system which includes a modulator for reducing power of the material-processing laser beam to obtain a probe laser beam to measure height of the semiconductor wafer at a plurality of locations about the site to obtain reference height data. A computer computes a reference surface based on the reference height data. A trajectory planner generates trajectories for the wafer and the waist of the laser beam based on the reference surface. The x-y stage and the first air bearing sled controllably move the wafer and the focusing lens subsystem, respectively, to precisely position the waist of the laser beam so that the waist substantially coincides with the 3-D locations of the microstructures within the site. The system also includes a spot size lens subsystem for controlling size of the waist of the laser beam, a second air bearing sled for moving the spot size lens subsystem along the optical axis, a third controller for controlling the second air bearing sled, and a second voice coil coupled to the third controller for positioning the second air bearing sled along the optical axis.
    • 提供了一种用于精确定位材料处理激光束的腰部以动态地补偿位于激光加工部位内间隔开的多个物体上的微结构的局部高度变化的高速方法和系统。 在优选实施例中,微结构是形成在半导体晶片的多个存储芯片上的多条导线。 该系统包括聚焦透镜子系统,用于沿着基本上垂直于平面的光轴聚焦激光束,用于在平面中移动晶片的x-y级,以及用于沿着光轴移动聚焦透镜子系统的第一空气轴承滑座。 该系统还包括第一控制器,用于基于参考数据来控制xy阶段,所述参考数据表示在站点内处理的微结构的3-D位置,第二控制器和耦合到第二控制器的第一音圈,用于将第一空气 沿着光轴的轴承座也基于参考数据。 参考数据由包括用于降低材料处理激光束的功率的调制器的系统产生,以获得探针激光束,以测量位于该位置的多个位置处的半导体晶片的高度,以获得参考高度数据。 计算机根据参考高度数据计算参考曲面。 轨迹计划器基于参考表面产生晶片和激光束的腰部的轨迹。 x-y台和第一空气轴承滑轨分别可控地移动晶片和聚焦透镜子系统,以精确地定位激光束的腰部,使得腰部基本上与位置内的微结构的3-D位置重合。 该系统还包括用于控制激光束腰部尺寸的光斑尺寸透镜子系统,用于沿光轴移动光斑尺寸透镜子系统的第二空气轴承滑动件,用于控制第二空气轴承滑轨的第三控制器,以及 第二音圈耦合到第三控制器,用于沿着光轴定位第二空气轴承滑轨。
    • 5. 发明申请
    • METHOD AND SUBSYSTEM FOR DETERMINING A SEQUENCE IN WHICH MICROSTRUCTURES ARE TO BE PROCESSED
    • 用于确定微结构要处理的序列的方法和子系统
    • WO0188638A3
    • 2002-06-13
    • PCT/US0115553
    • 2001-05-15
    • GEN SCANNING INCHUNTER BRADLEY LANDREI PAUL
    • HUNTER BRADLEY LANDREI PAUL
    • G05B13/02G06Q10/00B23K26/08
    • G06Q10/04G05B13/024
    • Method and subsystem are provided for determining a sequence in which microstructures are to be processed at a laser-processing site by taking into account microstructures located near travel limits of a motor-driven stage. The method includes receiving reference data which represent locations of microstructures to be processed at the site and coalescing adjacent groups of microstructures into clusters of microstructures including edge clusters which contain the microstructures located near the travel limits of the motor-driven stage which moves the microstructures relative to a laser beam at the site. The method also includes dividing a cluster fragment from each edge cluster. The cluster fragments contain the microstructures located near the travel limits. The method then includes sorting the clusters and cluster fragments to obtain data which represent a substantially optimum sequence in which the microstructures are to be processed to increase throughput at the site.
    • 提供了方法和子系统,用于通过考虑位于电机驱动级的行程极限附近的微结构来确定在激光加工部位处理微结构的序列。 该方法包括接收参考数据,该参考数据表示在该位置处要处理的微结构的位置,并将相邻的微结构组聚结成微观结构的簇,包括边缘簇,其包含位于电动机驱动级的行进极限附近的微结构,所述微结构移动微结构相对 到现场的激光束。 该方法还包括从每个边缘集群划分集群片段。 簇碎片包含位于行程极限附近的微结构。 该方法然后包括对簇和簇片段进行排序以获得代表基本上最佳序列的数据,其中微结构将被处理以增加位点处的产量。