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1. 发明申请

WO0187534A2 METHOD AND SYSTEM FOR PRECISELY POSITIONING A WAIST OF A MATERIAL-PROCESSING LASER BEAM TO PROCESS MICROSTRUCTURES WITHIN A LASER-PROCESSING SITE 审中-公开
标题翻译：用于精确定位材料加工激光束以在激光加工站中处理微结构的方法和系统
公开(公告)号：WO0187534A2
公开(公告)日：2001-11-22
申请号：PCT/US0115552
申请日：2001-05-15
申请人： GEN SCANNING INC , HUNTER BRADLEY L , CAHILL STEVEN P , EHRMANN JONATHAN S , PLOTKIN MICHAEL
发明人： HUNTER BRADLEY L , CAHILL STEVEN P , EHRMANN JONATHAN S , PLOTKIN MICHAEL
IPC分类号： B23K26/04 , B23K26/08 , B23K101/40 , G03F7/20 , H01L21/82 , B23K26/00
CPC分类号： B23K26/046 , B23K26/02 , B23K26/04 , B23K26/043 , B23K26/0853 , B23K2201/40 , G03F7/70041 , G03F7/70725
摘要： A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis. The system also includes a first controller for controlling the x-y stage based on reference data which represents 3-D locations of microstrucutures to be processed within the site, a second controller, and a first voice coil coupled to the second controller for positioning the first air bearing sled along the optical axis also based on the reference data. The reference data is generated by the system which includes a modulator for reducing power of the material-processing laser beam to obtain a probe laser beam to measure height of the semiconductor wafer at a plurality of locations about the site to obtain reference height data. A computer computes a reference surface based on the reference height data. A trajectory planner generates trajectories for the wafer and the waist of the laser beam based on the reference surface. The x-y stage and the first air bearing sled controllably move the wafer and the focusing lens subsystem, respectively, to precisely position the waist of the laser beam so that the waist substantially coincides with the 3-D locations of the microstructures within the site. The system also includes a spot size lens subsystem for controlling size of the waist of the laser beam, a second air bearing sled for moving the spot size lens subsystem along the optical axis, a third controller for controlling the second air bearing sled, and a second voice coil coupled to the third controller for positioning the second air bearing sled along the optical axis.
摘要翻译：提供了一种用于精确定位材料处理激光束的腰部以动态地补偿位于激光加工部位内间隔开的多个物体上的微结构的局部高度变化的高速方法和系统。在优选实施例中，微结构是形成在半导体晶片的多个存储芯片上的多条导线。该系统包括聚焦透镜子系统，用于沿着基本上垂直于平面的光轴聚焦激光束，用于在平面中移动晶片的x-y级，以及用于沿着光轴移动聚焦透镜子系统的第一空气轴承滑座。该系统还包括第一控制器，用于基于参考数据来控制xy阶段，所述参考数据表示在站点内处理的微结构的3-D位置，第二控制器和耦合到第二控制器的第一音圈，用于将第一空气沿着光轴的轴承座也基于参考数据。参考数据由包括用于降低材料处理激光束的功率的调制器的系统产生，以获得探针激光束，以测量位于该位置的多个位置处的半导体晶片的高度，以获得参考高度数据。计算机根据参考高度数据计算参考曲面。轨迹计划器基于参考表面产生晶片和激光束的腰部的轨迹。 x-y台和第一空气轴承滑轨分别可控地移动晶片和聚焦透镜子系统，以精确地定位激光束的腰部，使得腰部基本上与位置内的微结构的3-D位置重合。该系统还包括用于控制激光束腰部尺寸的光斑尺寸透镜子系统，用于沿光轴移动光斑尺寸透镜子系统的第二空气轴承滑动件，用于控制第二空气轴承滑轨的第三控制器，以及第二音圈耦合到第三控制器，用于沿着光轴定位第二空气轴承滑轨。

2. 发明申请

WO2009039184A3 LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION 审中-公开
标题翻译：具有高速光束偏转的链接处理
公开(公告)号：WO2009039184A3
公开(公告)日：2010-05-27
申请号：PCT/US2008076694
申请日：2008-09-17
申请人： GSI GROUP CORP , EHRMANN JONATHAN S , GRIFFITHS JOSEPH J , CORDINGLEY JAMES J , SVETKOFF DONALD J , JOHNSON SHEPARD D , PLOTKIN MICHAEL
发明人： EHRMANN JONATHAN S , GRIFFITHS JOSEPH J , CORDINGLEY JAMES J , SVETKOFF DONALD J , JOHNSON SHEPARD D , PLOTKIN MICHAEL
IPC分类号： B23K26/06 , B23K26/08
CPC分类号： B23K26/0869 , B23K26/0344 , B23K26/06 , B23K26/0624 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/0853 , B23K26/361 , B23K26/40 , B23K2201/40 , B23K2203/16 , B23K2203/50 , H01L21/76894 , H01L23/5258 , H01L27/10844 , H01L2924/0002 , Y10T29/49156 , H01L2924/00
摘要： The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
摘要翻译：本发明涉及激光加工方法和系统的领域，具体涉及用于激光加工多材料装置的激光加工方法和系统。系统和方法可以利用高速偏转器来改善处理能量窗口和/或提高处理速度。在一些实施例中，偏转器用于束斑的非正交扫描。在一些实施例中，偏转器用于实现目标结构的非同步处理。

3. 发明申请

WO2012116226A2 PREDICTIVE LINK PROCESSING 审中-公开
标题翻译：预测链接处理
公开(公告)号：WO2012116226A2
公开(公告)日：2012-08-30
申请号：PCT/US2012026386
申请日：2012-02-23
申请人： GSI GROUP CORP , MALTSEV DIMITRY , ROMASHKO DMITRY N , PLOTKIN MICHAEL , EHRMANN JONATHAN S , CORDINGLEY JAMES J
发明人： MALTSEV DIMITRY , ROMASHKO DMITRY N , PLOTKIN MICHAEL , EHRMANN JONATHAN S , CORDINGLEY JAMES J
CPC分类号： B23K26/0732 , B23K26/042 , B23K26/0619 , B23K26/0622 , B23K26/082 , H01L21/76892 , H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A method of processing material of device elements by laser interaction is disclosed. According to one aspect, the method includes generating a pulsed laser processing output along a laser beam axis, the output including a plurality of laser pulses triggered sequentially at times determined by a pulse repetition rate. A trajectory relative to locations of device elements to be processed is generated. A position of one or more designated device elements relative to an intercept point position on the trajectory at one or more laser pulse times is determined, and a laser beam is deflected based on the predicted position within a predetermined deflection range. According to some aspects, the predetermined deflection range may correspond to a compass rose or cruciform field shape. As a result, a deflection accuracy for laser processing may be improved.
摘要翻译：公开了一种通过激光相互作用处理器件元件材料的方法。根据一个方面，所述方法包括沿着激光束轴产生脉冲激光处理输出，所述输出包括在由脉冲重复率确定的时间顺序触发的多个激光脉冲。产生相对于要处理的设备元件的位置的轨迹。确定一个或多个指定装置元件相对于在一个或多个激光脉冲时间的轨迹上的截点位置的位置，并且激光束基于在预定偏转范围内的预测位置偏转。根据一些方面，预定的偏转范围可以对应于罗盘玫瑰或十字形场的形状。结果，可以提高激光加工的偏转精度。

4. 发明申请

WO2011082065A3 LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION 审中-公开
标题翻译：具有高速光束偏转的链接处理
公开(公告)号：WO2011082065A3
公开(公告)日：2011-11-24
申请号：PCT/US2010061797
申请日：2010-12-22
申请人： GSI GROUP CORP , ROMASHKO DMITRY N , PLOTKIN MICHAEL , EHRMANN JONATHAN S , CORDINGLEY JAMES J , JOHNSON SHEPARD D
发明人： ROMASHKO DMITRY N , PLOTKIN MICHAEL , EHRMANN JONATHAN S , CORDINGLEY JAMES J , JOHNSON SHEPARD D
IPC分类号： B23K26/08 , H01L21/00 , H01S3/10
CPC分类号： H01L23/5258 , B23K26/042 , B23K26/0732 , B23K26/082 , H01L21/76892 , H01L2924/0002 , H01L2924/00
摘要： Link processing systems and methods use controlled two dimensional deflection of a beam along an optical axis trajectory to process links positioned along and transverse to the trajectory during a pass of the optical axis along the trajectory. Predictive position calculations allow link blowing accuracy during constant velocity and accelerating trajectories.
摘要翻译：链路处理系统和方法使用沿着光轴轨迹的光束的受控二维偏转，以在沿着轨迹的光轴的通过期间处理沿着和横向于轨迹定位的链接。预测位置计算允许在恒定速度和加速轨迹期间的链接吹风精度。

5. 发明公开

EP1101260A4 CONTROLLING LASER POLARIZATION 有权
标题翻译： CONTROL LASER极化过程
公开(公告)号：EP1101260A4
公开(公告)日：2004-12-22
申请号：EP99930474
申请日：1999-06-22
申请人： GEN SCANNING INC
发明人： CORDINGLEY JAMES J , SMART DONALD V , PLOTKIN MICHAEL , LAUER WILLIAM
IPC分类号： G02B5/30 , B23K26/00 , B23K26/06 , B23K26/073 , B23K101/40 , G02B27/28 , G02F1/13 , H01S3/10 , H01S3/11 , H01S3/115
CPC分类号： B23K26/0736 , B23K26/0624 , B23K26/0643 , B23K26/0665 , B23K2201/38 , B23K2203/12
摘要： A laser polarization control apparatus includes a polarization modifying device (24), such as a liquid crystal variable retarder, and a controller (18). The polarization modifying device receives a laser beam (12) and modifies the polarization of the beam. The controller adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the modified laser beam onto a workpiece that includes the structure to be processed by the laser beam.

6. 发明专利

DE69933224D1 未知
公开(公告)号：DE69933224D1
公开(公告)日：2006-10-26
申请号：DE69933224
申请日：1999-06-22
申请人： GEN SCANNING INC
发明人： CORDINGLEY J , SMART V , PLOTKIN MICHAEL , LAUER WILLIAM
IPC分类号： G02B5/30 , H01S3/10 , B23K26/00 , B23K26/06 , B23K26/073 , B23K101/40 , G02B27/28 , G02F1/13 , H01S3/11 , H01S3/115
摘要： A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam. An analyzer tool receives the laser beam modified by the polarization modification device and measures the modification of the polarization of the laser beam by the polarization modification device.

7. 发明专利

AU6157601A Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site 未知
公开(公告)号：AU6157601A
公开(公告)日：2001-11-26
申请号：AU6157601
申请日：2001-05-15
申请人： GEN SCANNING INC
发明人： HUNTER BRADLEY L , CAHILL STEVEN P , EHRMANN JONATHAN S , PLOTKIN MICHAEL
IPC分类号： B23K26/04 , B23K26/08 , B23K101/40 , G03F7/20 , H01L21/82 , B23K26/00
摘要： A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

8. 发明专利

AU2363800A Laser processing 未知
公开(公告)号：AU2363800A
公开(公告)日：2000-07-03
申请号：AU2363800
申请日：1999-12-16
申请人： GEN SCANNING INC
发明人： LAUER WILLIAM , TREPANIER PIERRE , SMART DONALD VICTOR , CORDINGLEY JAMES , PLOTKIN MICHAEL
IPC分类号： H01L21/3205 , B23K26/02 , B23K26/06 , B23K26/08 , B23K26/10 , B23K26/36 , B23K26/40 , H01L21/304 , H01L21/768 , H01L23/52 , H01L23/525 , H01L27/10 , H01S3/00 , B23K26/00
摘要： The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate. The laser output is directed at the target structure on the substrate at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate, in order to vaporize the target structure.

9. 发明专利

AU4700999A Controlling laser polarization 未知
公开(公告)号：AU4700999A
公开(公告)日：2000-01-24
申请号：AU4700999
申请日：1999-06-22
申请人： GEN SCANNING INC
发明人： CORDINGLEY JAMES J , SMART DONALD V , PLOTKIN MICHAEL , LAUER WILLIAM
IPC分类号： G02B5/30 , B23K26/00 , B23K26/06 , B23K26/073 , B23K101/40 , G02B27/28 , G02F1/13 , H01S3/10 , H01S3/11 , H01S3/115
摘要： A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam. An analyzer tool receives the laser beam modified by the polarization modification device and measures the modification of the polarization of the laser beam by the polarization modification device.

10. 发明申请

WO2005076053A9 SCANNER SYSTEMS 审中-公开
标题翻译：扫描仪系统
公开(公告)号：WO2005076053A9
公开(公告)日：2005-10-20
申请号：PCT/EP2005050514
申请日：2005-02-07
申请人： TOWNER DAVID K , PLOTKIN MICHAEL , LIVNE HAIM , HEWLETT PACKARD INDIGO BV
发明人： TOWNER DAVID K , PLOTKIN MICHAEL , LIVNE HAIM
IPC分类号： G02B26/12 , H04N1/024
CPC分类号： H04N1/024 , G02B26/123
摘要： A scanner system including a photoreceptor, a plurality of laser beams, a scanning reflecting surface that receives the plurality of beams and directs them as scanning beams toward the photoreceptor and an aperture adjacent to the reflecting surface. As a single beam scans along the photoreceptor surface, a focal surface of the beam has a given deviation as a function of the scan position. The positions of the various beams at the reflecting surface are different due to a placement of the aperture and additional deviation of the plurality of beams in the focal surface caused by said placement is less than the given deviation.
摘要翻译：一种扫描仪系统，包括感光体，多个激光束，接收多个光束并将它们作为扫描光束引导到感光体的扫描反射表面和与反射表面相邻的孔。当单个光束沿感光体表面扫描时，光束的焦面具有作为扫描位置的函数的给定偏差。反射面处的各种光束的位置由于孔的位置而不同，并且由所述放置引起的焦点面中的多个光束的附加偏差小于给定的偏差。

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