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1. 发明申请

WO2007150009A1 SYSTEM AND METHOD FOR SEMICONDUCTOR WAFER PROCESSING 审中-公开
标题翻译：用于半导体波形处理的系统和方法
公开(公告)号：WO2007150009A1
公开(公告)日：2007-12-27
申请号：PCT/US2007/071846
申请日：2007-06-22
申请人： GSI GROUP CORPORATION , PELSUE, Kurt
发明人： PELSUE, Kurt
IPC分类号： H01L21/00
CPC分类号： H01L21/67161 , H01L21/67207 , H01L21/67276
摘要： A semiconductor wafer processing system is disclosed for providing concurrent processing of wafers. The semiconductor wafer processing system includes an input station for receiving a plurality of wafers for processing, and a plurality of workstations. Each of the plurality of workstations is coupled to the input station and each includes a stage system for providing relative motion of the wafer and a laser beam, a chuck for holding a wafer to be processed, optics for directing laser illumination toward the wafer to be processed, and a wafer buffer system for providing that wafer transfer between the input station and the workstation may be asynchronous with respect to wafer processing at the respective workstation.
摘要翻译：公开了用于提供晶片的同时处理的半导体晶片处理系统。半导体晶片处理系统包括用于接收用于处理的多个晶片的输入站和多个工作站。多个工作站中的每一个耦合到输入站，并且每个工作站都包括用于提供晶片和激光束的相对运动的平台系统，用于保持要处理的晶片的卡盘，用于将激光照射指向晶片的光学器件并且用于在输入站和工作站之间提供晶片传送的晶片缓冲器系统可以相对于相应工作站处的晶片处理是异步的。

2. 发明申请

WO2007044798A3 OPTICAL METROLOGICAL SCALE AND LASER-BASED MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：WO2007044798A3
公开(公告)日：2007-04-19
申请号：PCT/US2006/039704
申请日：2006-10-11
申请人： GSI GROUP CORPORATION , PELSUE, Kurt , DODSON II, Stuart A. , HUNTER, Bradley L. , SMART, Donald V. , MABBOUX, Pierre-yves , EHRMANN, Jonathan S.
发明人： PELSUE, Kurt , DODSON II, Stuart A. , HUNTER, Bradley L. , SMART, Donald V. , MABBOUX, Pierre-yves , EHRMANN, Jonathan S.
IPC分类号： C23F1/08 , C23F4/02 , C23F17/00
摘要： A reflective metrological scale has a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of a substrate, which may be a nickel based metal alloy and may be a thin and elongated flexible tape. Each mark has a harrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled or ridged and may be darkened to provide an enhanced optical reflection ratio with respect to surrounding reflective surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark with a series of overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm2, and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location.

3. 发明申请

WO2007143408A3 METHOD AND SYSTEM FOR ADAPTIVELY CONTROLLING A LASER-BASED MATERIAL PROCESSING PROCESS AND METHOD AND SYSTEM FOR QUALIFYING SAME 审中-公开
标题翻译：用于适应性地控制基于激光的材料加工过程的方法和系统及其质量鉴定方法和系统
公开(公告)号：WO2007143408A3
公开(公告)日：2009-04-09
申请号：PCT/US2007069612
申请日：2007-05-24
申请人： GSI GROUP CORP , GRIFFITHS JOSEPH J , PELSUE KURT
发明人： GRIFFITHS JOSEPH J , PELSUE KURT
IPC分类号： B23K26/00
CPC分类号： G05B11/01 , B23K26/032 , B23K26/36 , G05B15/02 , H01L22/24 , H01L23/5258 , H01L2924/0002 , H01S5/06 , H01L2924/00
摘要： A method and system for adaptively controlling a laser-based material processing process are provided. The system includes sensing equipment to measure a process variable or condition of at least one of a laser-based material processing system and a workpiece processed by the material processing system and to provide a corresponding measurement signal. The control system also includes a signal processor for processing the measurement signal to obtain a processed signal which initiates, at least semi-automatically, an action associated with at least one of the material processing system and the workpiece. A method and system for at least semi-automatically qualifying a laser-based material processing system which delivers laser energy to locations on or adjacent a plurality of microstructures formed on a workpiece to at least partially process the microstructures are also provided.
摘要翻译：提供了一种用于自适应地控制基于激光的材料处理过程的方法和系统。该系统包括用于测量由材料处理系统处理的基于激光的材料处理系统和工件中的至少一个的过程变量或状况的感测设备，并提供对应的测量信号。控制系统还包括一个信号处理器，用于处理测量信号以获得处理的信号，该处理信号至少半自动地启动与材料处理系统和工件中的至少一个相关联的动作。还提供了一种用于至少半自动限定激光基材料处理系统的方法和系统，其将激光能量传递到在工件上形成的多个微结构上或邻近其上的位置，以至少部分地处理微结构。

4. 发明申请

WO2008091380A2 SYSTEM AND METHOD FOR EMPLOYING A RESONANT SCANNER IN AN X-Y HIGH SPEED DRILLING SYSTEM 审中-公开
标题翻译：用于在X-Y高速钻井系统中使用共振扫描器的系统和方法
公开(公告)号：WO2008091380A2
公开(公告)日：2008-07-31
申请号：PCT/US2007/074391
申请日：2007-07-26
申请人： GSI GROUP CORPORATION , PINARD, Adam, I. , PELSUE, Kurt , STUKALIN, Felix
发明人： PINARD, Adam, I. , PELSUE, Kurt , STUKALIN, Felix
CPC分类号： B23K26/0622 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2203/50 , G02B26/101 , G02B26/105
摘要： A laser processing system is disclosed for providing a relatively small velocity of a laser beam at target location while at least one scanner scans at a relatively larger velocity. The system includes a laser source, a first scanning unit, a beam expander, a second scanning unit and focusing optics. The laser source is for providing a pulsed laser output having at least one beam with a beam dimension. The first scanning unit is for scanning the laser output in a first direction along a first axis at the target location. The beam expander is for receiving the laser output and for modifying a beam diameter of the laser output and providing a modified laser output. The second scanning unit is for scanning the modified laser output from the beam expander in a second direction along the first axis at the target location. The second direction is substantially opposite to the first direction along the first axis such that a net velocity of the modified laser output along the first axis at the target location may be made to be effectively zero during a laser pulse. The focusing optics is for focusing the modified laser output toward the target location.
摘要翻译：公开了一种激光处理系统，用于在至少一个扫描仪以相对较大的速度扫描时在目标位置处提供相对小的激光束速度。该系统包括激光源，第一扫描单元，扩束器，第二扫描单元和聚焦光学器件。激光源用于提供具有至少一个具有光束尺寸的光束的脉冲激光输出。第一扫描单元用于沿着目标位置处的第一轴在第一方向上扫描激光输出。扩束器用于接收激光输出并用于修改激光输出的光束直径并提供改进的激光输出。第二扫描单元用于沿着目标位置处的第一轴线在第二方向上扫描来自扩束器的改进的激光输出。第二方向与沿着第一轴的第一方向基本上相反，使得在激光脉冲期间可以使在目标位置沿着第一轴的改进的激光输出的净速度有效地为零。聚焦光学器件用于将修改后的激光输出聚焦到目标位置。

5. 发明申请

WO2007143408A2 METHOD AND SYSTEM FOR ADAPTIVELY CONTROLLING A LASER-BASED MATERIAL PROCESSING PROCESS AND METHOD AND SYSTEM FOR QUALIFYING SAME 审中-公开
标题翻译：用于适应性地控制基于激光的材料加工过程的方法和系统及其质量鉴定方法和系统
公开(公告)号：WO2007143408A2
公开(公告)日：2007-12-13
申请号：PCT/US2007/069612
申请日：2007-05-24
申请人： GSI GROUP CORPORATION , GRIFFITHS, Joseph, J. , PELSUE, Kurt
发明人： GRIFFITHS, Joseph, J. , PELSUE, Kurt
IPC分类号： G06F19/00 , B23K26/38 , B23K26/03
CPC分类号： G05B11/01 , B23K26/032 , B23K26/36 , G05B15/02 , H01L22/24 , H01L23/5258 , H01L2924/0002 , H01S5/06 , H01L2924/00
摘要： A method and system for adaptively controlling a laser-based material processing process are provided. The system includes sensing equipment to measure a process variable or condition of at least one of a laser-based material processing system and a workpiece processed by the material processing system and to provide a corresponding measurement signal. The control system also includes a signal processor for processing the measurement signal to obtain a processed signal which initiates, at least semi-automatically, an action associated with at least one of the material processing system and the workpiece. A method and system for at least semi-automatically qualifying a laser-based material processing system which delivers laser energy to locations on or adjacent a plurality of microstructures formed on a workpiece to at least partially process the microstructures are also provided.
摘要翻译：提供了一种用于自适应地控制基于激光的材料处理过程的方法和系统。该系统包括用于测量由材料处理系统处理的基于激光的材料处理系统和工件中的至少一个的过程变量或状况的感测设备，并提供对应的测量信号。控制系统还包括一个信号处理器，用于处理测量信号以获得处理的信号，该处理信号至少半自动地启动与材料处理系统和工件中的至少一个相关联的动作。还提供了一种用于至少半自动限定激光基材料处理系统的方法和系统，其将激光能量传递到在工件上形成的多个微结构上或邻近其上的位置，以至少部分地处理微结构。

6. 发明申请

WO2003097290A1 METHOD AND SYSTEM FOR MARKING A WORKPIECE SUCH AS A SEMICONDUCTOR WAFER AND LASER MARKER FOR USE THEREIN 审中-公开
标题翻译：用于标记工作的方法和系统作为半导体波形和用于其的激光标记
公开(公告)号：WO2003097290A1
公开(公告)日：2003-11-27
申请号：PCT/US2003/015698
申请日：2003-05-16
申请人： GSI LUMONICS CORPORATION , CAHILL, Steven, P. , EHRMANN, Jonathan, S. , GILLESPIE, John, R., Jr. , LI, You, C. , NEMETS, Chris , SCHRAMM, Rainer , SULLIVAN, Kevin, E. , LESLIE, Walter, J. , WOELKI, Michael , PELSUE, Kurt , PUKMEL, Michael
发明人： CAHILL, Steven, P. , EHRMANN, Jonathan, S. , GILLESPIE, John, R., Jr. , LI, You, C. , NEMETS, Chris , SCHRAMM, Rainer , SULLIVAN, Kevin, E. , LESLIE, Walter, J. , WOELKI, Michael , PELSUE, Kurt , PUKMEL, Michael
IPC分类号： B23K26/00
CPC分类号： B23K26/04 , B23K26/042 , B23K26/043 , B23K26/0853 , B23K26/361 , B23K26/40 , B23K26/705 , B23K2201/007 , B23K2201/40 , B23K2203/50 , G06K1/126 , H01C17/242 , H01L21/67282 , H01L21/681 , H01L23/544 , H01L2223/5442 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2924/0002 , H01L2924/00
摘要： A system for semiconductor wafer (3) marking is provided. The system includes: (a) a first positioning subsystem for positioning a laser marking field relative to a wafer, the positioning along a first direction; (b) an alignment vision subsystem; (c) a laser marker including a laser for marking a location within the marking field with a laser marking beam; (d) a calibration program for calibrating at least one subsystem of the system; and (e) a controller. The marking field is substantially smaller than the wafer, and the laser marker includes a scan lens for optically maintaining a spot formed by the beam on the wafer within an acceptable range about the location within the marking field so as to avoid undesirable mark variations associated with wafer sag or other variations in depth within the field.
摘要翻译：提供了一种用于半导体晶片（3）标记的系统。该系统包括：（a）第一定位子系统，用于相对于晶片定位激光标记场，沿第一方向定位; （b）对准视觉子系统; （c）激光标记器，其包括用于用激光标记光束标记所述标记场内的位置的激光器; （d）用于校准所述系统的至少一个子系统的校准程序; 和（e）控制器。标记场基本上小于晶片，并且激光标记器包括扫描透镜，用于将晶片上的光束形成的光点保持在围绕标记场内的位置的可接受范围内，以避免与晶片下垂或其他深度变化。

7. 发明申请

WO2008091380A3 SYSTEM AND METHOD FOR EMPLOYING A RESONANT SCANNER IN AN X-Y HIGH SPEED DRILLING SYSTEM 审中-公开
标题翻译：在X-Y高速钻孔系统中使用共振扫描仪的系统和方法
公开(公告)号：WO2008091380A3
公开(公告)日：2008-10-16
申请号：PCT/US2007074391
申请日：2007-07-26
申请人： GSI GROUP CORP , PINARD ADAM I , PELSUE KURT , STUKALIN FELIX
发明人： PINARD ADAM I , PELSUE KURT , STUKALIN FELIX
IPC分类号： B23K26/38
CPC分类号： B23K26/0622 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2203/50 , G02B26/101 , G02B26/105
摘要： A laser processing system is disclosed for providing a relatively small velocity of a laser beam at target location while at least one scanner scans at a relatively larger velocity. The system includes a laser source, a first scanning unit, a beam expander, a second scanning unit and focusing optics. The laser source is for providing a pulsed laser output having at least one beam with a beam dimension. The first scanning unit is for scanning the laser output in a first direction along a first axis at the target location. The beam expander is for receiving the laser output and for modifying a beam diameter of the laser output and providing a modified laser output. The second scanning unit is for scanning the modified laser output from the beam expander in a second direction along the first axis at the target location. The second direction is substantially opposite to the first direction along the first axis such that a net velocity of the modified laser output along the first axis at the target location may be made to be effectively zero during a laser pulse. The focusing optics is for focusing the modified laser output toward the target location.
摘要翻译：公开了一种激光处理系统，用于在目标位置处提供相对较小的激光束速度，同时至少一个扫描仪以相对较大的速度扫描。该系统包括激光源，第一扫描单元，光束扩展器，第二扫描单元和聚焦光学器件。激光源用于提供具有至少一个具有光束尺寸的光束的脉冲激光输出。第一扫描单元用于在目标位置沿着第一轴沿第一方向扫描激光输出。光束扩展器用于接收激光输出并修改激光输出的光束直径并提供修改的激光输出。第二扫描单元用于在目标位置沿沿第一轴的第二方向扫描来自光束扩展器的修改的激光输出。第二方向与沿着第一轴线的第一方向基本上相反，使得在激光脉冲期间沿着第一轴线的修改的激光器输出在目标位置处的净速度可以被实质上为零。聚焦光学器件用于将修改的激光输出聚焦到目标位置。

8. 发明申请

WO2007044798A2 OPTICAL METROLOGICAL SCALE AND LASER-BASED MANUFACTURING METHOD THEREFOR 审中-公开
标题翻译：光学尺度和激光制造方法
公开(公告)号：WO2007044798A2
公开(公告)日：2007-04-19
申请号：PCT/US2006039704
申请日：2006-10-11
申请人： GSI GROUP CORP , PELSUE KURT , DODSON II STUART A , HUNTER BRADLEY L , SMART DONALD V , MABBOUX PIERRE-YVES , EHRMANN JONATHAN S
发明人： PELSUE KURT , DODSON II STUART A , HUNTER BRADLEY L , SMART DONALD V , MABBOUX PIERRE-YVES , EHRMANN JONATHAN S
IPC分类号： C08K3/32
CPC分类号： B41M5/24 , B23K26/364 , G01D5/34707
摘要： A reflective metrological scale has a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of a substrate, which may be a nickel-based metal alloy such as Invar® or Inconel® and may be a thin and elongated flexible tape. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled or ridged and may be darkened to provide an enhanced optical reflection ratio with respect to surrounding reflective surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating a surface of the substrate at a mark location with a series of overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm 2 , and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.
摘要翻译：反射计量标尺具有由基底的反射表面区域包围的细长的并排标记的刻度图形，其可以是诸如Invar或Inconel的镍基金属合金，并且可以是薄且细长的柔性带。每个标记具有沟槽的横截面并且可以具有在0.5至2微米范围内的深度。每个标记的中心区域可以是波纹或脊状的，并且可以变暗，以提供相对于周围的反射表面区域的增强的光反射率。一种制造方法包括以下重复步骤：（1）通过在来自激光的一系列重叠脉冲的标记位置处照射基板的表面来产生刻度标记，每个脉冲的能量密度小于约1焦耳/厘米＆lt; SUP＆gt; 2＆gt;和（2）通过在衬底上限定下一标记位置的位移量来改变激光和衬底的相对位置，在该衬底上将要生成刻度的下一个标记。

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