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1. 发明授权

US5138426A Ceramic joined body 失效
标题翻译：陶瓷接合体
公开(公告)号：US5138426A
公开(公告)日：1992-08-11
申请号：US410128
申请日：1989-09-20
申请人： Yuji Umeda , Tadashi Otagiri , Go Suzuki
发明人： Yuji Umeda , Tadashi Otagiri , Go Suzuki
IPC分类号： C04B37/02 , C04B37/04 , H01L23/10 , H01L23/15
CPC分类号： H01L23/10 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152
摘要： In a ceramic joined body wherein a first metalizing layer formed on a surface of an aluminum nitride member on which semiconductor elements are installed and a second metalizing layer formed on a surface of an insulation substrate fireable at low temperatures are joined with each other via a solder used at high temperatures, an intermediate layer including a predetermined metal component and a predetermined glass component is arranged between the insulation substrate and the second metalizing layer. The glass component is melted into the insulation substrate during the firing operation, and thus a sufficient connection strength between the insulation substrate and the aluminum nitride member can be obtained. Moreover, the metal component and the glass component function to make the thermal expansion coefficient an intermediate value between the insulation substrate and the first metalizing layer, and thus heat stress generated during the brazing operation can be eliminated.
摘要翻译：在陶瓷接合体中，其中形成在其上安装半导体元件的氮化铝构件的表面上的第一金属化层和形成在可在低温下燃烧的绝缘基板的表面上的第二金属化层通过焊料彼此接合在绝缘基板和第二金属化层之间配置有包含规定的金属成分和规定的玻璃成分的中间层。在烧制操作期间，玻璃成分熔化成绝缘基板，能够获得绝缘基板与氮化铝部件之间的充分的连接强度。此外，金属成分和玻璃成分的作用是使热膨胀系数成为绝缘基板与第一金属化层之间的中间值，从而可以消除钎焊操作期间产生的热应力。

2. 发明授权

US5021287A Ceramic green sheets 失效
标题翻译：陶瓷绿板
公开(公告)号：US5021287A
公开(公告)日：1991-06-04
申请号：US285413
申请日：1988-12-16
申请人： Tadashi Otagiri , Masahiro Shirai , Minoru Ohara , Go Suzuki
发明人： Tadashi Otagiri , Masahiro Shirai , Minoru Ohara , Go Suzuki
IPC分类号： H05K1/03 , C04B41/51 , C04B41/88 , H01L23/15 , H05K1/09 , H05K3/46
CPC分类号： C04B41/009 , C04B41/5194 , C04B41/88 , H01L23/15 , H05K3/4611 , H05K3/4629 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , Y10S428/901 , Y10T428/24917 , Y10T428/24942 , Y10T428/26 , Y10T428/266 , Y10T428/31649
摘要： A ceramic green sheet comprises a green sheet as a core and a surface layer formed thereon. Such ceramic green sheets are laminated for use in IC package, printed circuit board or the like.
摘要翻译：陶瓷生片包括作为芯的生片和在其上形成的表面层。这种陶瓷生片被层叠以用于IC封装，印刷电路板等。

3. 发明授权

US4914260A Ceramic multi-layer printed circuit boards 失效
标题翻译：陶瓷多层印刷电路板
公开(公告)号：US4914260A
公开(公告)日：1990-04-03
申请号：US330761
申请日：1989-03-30
申请人： Go Suzuki , Toshiki Goto
发明人： Go Suzuki , Toshiki Goto
IPC分类号： H01L21/48 , H05K1/03 , H05K3/00 , H05K3/38 , H05K3/46
CPC分类号： H05K3/4667 , H01L21/4857 , H05K3/4661 , H05K1/0306 , H05K2201/09563 , H05K2201/096 , H05K3/0023 , H05K3/381
摘要： A ceramic multi-layer printed circuit board is manufactured by forming a wiring pattern layer on a ceramic substrate through copper plating and forming an insulating layer thereon and then repeating the steps for forming both layers.
摘要翻译：通过铜镀层在陶瓷基板上形成布线图案层并在其上形成绝缘层，然后重复形成两层的步骤来制造陶瓷多层印刷电路板。

4. 发明授权

US4604677A Ceramic structural body and a method of manufacturing the same 失效
标题翻译：陶瓷结构体及其制造方法
公开(公告)号：US4604677A
公开(公告)日：1986-08-05
申请号：US525250
申请日：1983-08-16
申请人： Go Suzuki , Kazuo Michisita
发明人： Go Suzuki , Kazuo Michisita
IPC分类号： H01L21/48 , H01L23/13 , H01L23/498 , H01L23/538 , H01L25/10 , H05K1/00 , H05K1/03 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/34 , H05K3/36
CPC分类号： H05K1/147 , H01L21/4867 , H01L23/13 , H01L23/49805 , H01L23/49861 , H01L23/5385 , H01L25/105 , H01L25/16 , H05K1/141 , H05K3/0014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1076 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/1532 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , H01L2924/3511 , H05K1/0284 , H05K1/0306 , H05K1/183 , H05K2201/045 , H05K2201/10477 , H05K2203/302 , H05K3/3442 , H05K3/368 , Y10T29/49126 , Y10T29/4913
摘要： A ceramic structural body having electronic components thereon comprises a ceramic package of a ceramic layer having substantially uniform thickness. The package comprises a ceramic element of dish-shaped or box-shaped configuration including a base portion, a sidewall portion extending from the base portion substantially at right angles thereto and a flange portion extending from the free end of the sidewall portion substantially at right angles thereto. The ceramic package is formed by press-forming a ceramic green sheet having substantially uniform thickness. A plurality of metal layers are provided on the surface of desired portions of the ceramic element.
摘要翻译：其上具有电子部件的陶瓷结构体包括具有基本均匀厚度的陶瓷层的陶瓷封装。该包装包括一种盘形或箱形结构的陶瓷元件，其包括基部，从基部大致直角延伸的侧壁部分和从侧壁部分的自由端基本直角延伸的凸缘部分到此。通过压制形成具有基本均匀厚度的陶瓷生片来形成陶瓷封装。在陶瓷元件的所需部分的表面上设置多个金属层。

5. 发明授权

US4397800A Ceramic body having a metallized layer 失效
公开(公告)号：US4397800A
公开(公告)日：1983-08-09
申请号：US242665
申请日：1981-03-11
申请人： Go Suzuki , Kazuo Michishita
发明人： Go Suzuki , Kazuo Michishita
IPC分类号： H05K3/46 , B22F7/06 , C04B41/51 , C04B41/88 , C23C24/08 , H01B1/06 , H01B1/16 , H01G4/008 , H01L23/15 , H01L23/538 , H01L25/16 , H01L27/01 , H05K1/09 , H05K3/12 , H01G1/01
CPC分类号： C04B41/88 , B22F7/06 , C04B41/009 , C04B41/51 , C23C24/085 , H01G4/0085 , H01L23/15 , H01L23/5383 , H01L25/16 , H01L27/013 , H05K1/092 , H01L2924/0002 , H01L2924/09701
摘要： A ceramic body having a metallized layer which comprises a ceramic substrate and a metallized layer fired on the substrate to be integrated or further comprises a conductive layer consisting of a noble metal or noble metal alloy to be joined onto the metallized layer, the composition of the metallized layer being one or more of a silicide of transition metals belonging to Groups V and VI of periodic table; one or more of a boride of lanthanum and a boride of transition metals belonging to Groups IV, V and VI of periodic table; or a high melting point metal or alloy unmelted at a firing temperature of the ceramic substrate and containing, based on 100 parts by weight of the metal or alloy, 0.5-25 parts by weight of niobium, 0.5-10 parts by weight of yttrium, 0.5-10 parts by weight of tantalum, 0.5-25 parts by weight of mixture of niobium and yttrium, 0.5-25 parts by weight of mixture of yttrium and tantalum, 0.5-25 parts by weight of mixture of niobium and tantalum, 0.5-25 parts by weight of mixture of niobium, yttrium and tantalum, 0.05-3 parts by weight of nickel, 0.5-4 parts by weight of chromium or 0.05-3 parts by weight of mixture of nickel and chromium, which is a useful material for various electronic and electric apparatuses.

6. 发明授权

US4959255A Ceramic substrates and method of manufacturing the same 失效
标题翻译：陶瓷基板及其制造方法
公开(公告)号：US4959255A
公开(公告)日：1990-09-25
申请号：US251700
申请日：1988-08-31
申请人： Go Suzuki
发明人： Go Suzuki
IPC分类号： C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C23C18/18 , H01L21/48 , H05K1/03 , H05K3/18 , H05K3/38
CPC分类号： C04B41/009 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C23C18/1851 , C23C18/1893 , H01L21/4807 , H05K3/38 , C04B2111/00844 , H05K1/0306 , H05K2201/2072 , H05K3/181 , Y10S428/901 , Y10T428/24355 , Y10T428/24372 , Y10T428/24388 , Y10T428/24942 , Y10T428/252 , Y10T428/256 , Y10T428/26 , Y10T428/31
摘要： Granular protruding portions are formed on a surface of a dense ceramic body to be provided at its surface with an electrolessly plated layer. A space is formed between the granular protruding portions so as to substantially widen toward the interior viewed from the surface side, whereby a part of the electrolessly plated layer to be formed is entered and solidified in the spaces to develop a strong anchor effect. This anchor effect provides a strong and stable bonding strength of the electrolessly plated layer to the ceramic substrate, so that it is particularly useful as a ceramic substrate for circuit boards of electronic parts.

7. 发明授权

US4280977A Method of working ceramic green sheet 失效
标题翻译：陶瓷生片工作方法
公开(公告)号：US4280977A
公开(公告)日：1981-07-28
申请号：US123404
申请日：1980-02-21
申请人： Go Suzuki
发明人： Go Suzuki
IPC分类号： B28B11/12 , B26D7/10 , B26F3/08 , B28B11/16 , H01L21/48 , H05K1/03 , H05K3/00 , B29C17/10
CPC分类号： H01L21/4807 , B26D7/10 , B26F3/08 , B28B11/168 , H05K1/0306 , H05K3/0044 , H05K3/0097
摘要： A method of working ceramic green sheet is disclosed. The ceramic green sheet is worked by pushing a spacer having at its edge a given profile to the surface of the sheet and then forcing a cylindrical knife heated at a given temperature and provided with an edge having a form substantially equal to the profile of the spacer along the periphery of the spacer to the surface of the sheet.
摘要翻译：公开了一种陶瓷生片的加工方法。通过将具有给定轮廓的间隔件推压到片材的表面，然后迫使在给定温度下加热的圆柱形刀片并且具有基本上等于间隔件轮廓的形状的边缘来加工陶瓷生片沿着间隔件的周边延伸到片材的表面。

8. 发明授权

US6066918A High pressure discharge lamp with an improved sealing system and method of producing the same 失效
标题翻译：具有改进的密封系统的高压放电灯及其制造方法
公开(公告)号：US6066918A
公开(公告)日：2000-05-23
申请号：US604988
申请日：1996-07-03
申请人： Go Suzuki , Norikazu Niimi , Tsutomu Kondo
发明人： Go Suzuki , Norikazu Niimi , Tsutomu Kondo
IPC分类号： H01J9/26 , H01J9/32 , H01J61/36
CPC分类号： H01J61/366 , H01J61/363 , H01J9/266 , H01J9/323 , H01J61/34 , H01J61/82
摘要： The high pressure discharge lamp comprises a ceramic discharge tube containing an ionizable luminescent material and a starting gas filled in the inner space thereof, a clogging member having through-holes, and at least a portion of which being fixed on the inner side of the end portion of the ceramic discharge tube, an electric conductor having an electrode system inserted in the through-holes of the clogging member, and a sealing material layer. Preferably, the sealing material layer 16A is made of a metallizing layer. In addition, the high pressure discharge lamp comprises the ceramic discharge tube, the clogging member, the electric conductor inserted in the through-holes of the clogging member, and a metallizing layer for sealing provided so as to join to the clogging member and the electric conductor.
摘要翻译： PCT No.PCT / IB96 / 00027 Sec。 371日期：1996年7月3日 102（e）1996年7月3日PCT PCT 1996年1月12日PCT公布。公开号WO96 / 21940 日期1996年7月18日高压放电灯包括含有可离子化发光材料和填充在其内部空间中的起始气体的陶瓷放电管，具有通孔的阻塞构件，其至少一部分固定在陶瓷放电管的端部的内侧，具有插入到堵塞构件的通孔中的电极系统的导电体和密封材料层。优选地，密封材料层16A由金属化层制成。此外，高压放电灯包括陶瓷放电管，堵塞构件，插入堵塞构件的通孔中的电导体和用于密封的金属化层，其被设置成连接到堵塞构件和电气导体。

9. 发明授权

US4445274A Method of manufacturing a ceramic structural body 失效
标题翻译：制造陶瓷结构体的方法
公开(公告)号：US4445274A
公开(公告)日：1984-05-01
申请号：US265848
申请日：1981-05-21
申请人： Go Suzuki , Kazuo Michishita
发明人： Go Suzuki , Kazuo Michishita
IPC分类号： H01L21/48 , H01L23/13 , H01L23/498 , H01L23/538 , H01L25/10 , H05K1/00 , H05K1/03 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/34 , H05K3/36 , H05K3/30
CPC分类号： H05K1/147 , H01L21/4867 , H01L23/13 , H01L23/49805 , H01L23/49861 , H01L23/5385 , H01L25/105 , H01L25/16 , H05K1/141 , H05K3/0014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1076 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/1532 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , H01L2924/3511 , H05K1/0284 , H05K1/0306 , H05K1/183 , H05K2201/045 , H05K2201/10477 , H05K2203/302 , H05K3/3442 , H05K3/368 , Y10T29/49126 , Y10T29/4913
摘要： A ceramic structural body having electronic components thereon comprises a ceramic package of a ceramic layer having substantially uniform thickness. The package comprises a ceramic element of dish-shaped or box-shaped configuration including a base portion, a sidewall portion extending from the base portion substantially at right angles thereto and a flange portion extending from the free end of the sidewall portion substantially at right angles thereto. The ceramic package is formed by press-forming a ceramic green sheet having substantially uniform thickness. A plurality of metal layers are provided on the surface of desired portions of the ceramic element.
摘要翻译：其上具有电子部件的陶瓷结构体包括具有基本均匀厚度的陶瓷层的陶瓷封装。该包装包括一种盘形或箱形结构的陶瓷元件，其包括基部，从基部大致直角延伸的侧壁部分和从侧壁部分的自由端基本直角延伸的凸缘部分到此。通过压制形成具有基本均匀厚度的陶瓷生片来形成陶瓷封装。在陶瓷元件的所需部分的表面上设置多个金属层。

10. 发明授权

US4137628A Method of manufacturing connection-type ceramic packages for integrated circuits 失效
标题翻译：制造用于集成电路的连接型陶瓷封装的方法
公开(公告)号：US4137628A
公开(公告)日：1979-02-06
申请号：US862271
申请日：1977-12-19
申请人： Go Suzuki
发明人： Go Suzuki
IPC分类号： H01L23/12 , B32B18/00 , H01L23/08 , H01L23/52 , H05K1/03 , H05K1/09 , H05K3/46 , H05K3/22 , H05K3/10
CPC分类号： H05K3/4629 , H05K3/4611 , H05K1/0306 , H05K1/092 , Y10T29/49121 , Y10T29/49147 , Y10T29/49787
摘要： A method of manufacturing connection-type ceramic packages for integrated circuits is disclosed. A plurality of green ceramic sheets are prepared and punched to form notches in each sheet and recesses defining cavities for accommodating an integrated circuit element therein at predetermined positions in given sheets. A plurality of lead array patterns each corresponding to terminal areas of the element are printed on each surface of the sheets with a metallizing ink. The printed sheets are laminated one upon another while aligning with the aid of the notches under hot pressed condition to form a laminated body. The laminated body is longitudinally cut into a plurality of green ceramic strips while providing transverse snap lines for obtaining individual ceramic package units. A pattern corresponding to the lead array pattern is printed on both sides of each of the strips with a metallizing ink. The printed strip is sintered to ceramic strip, which is then subjected to a usual plating treatment. Thereafter, lead members are attached to the plated ceramic strip to form connection-type ceramic packages capable of being divided into individual ceramic package units.
摘要翻译：公开了一种用于集成电路的连接型陶瓷封装的制造方法。制备多个绿色陶瓷片，并在每个片材中冲压以形成凹口，并且在给定片材中的预定位置处形成用于容纳集成电路元件的空腔的凹部。使用金属化油墨在片材的每个表面上印刷各自对应于元件的端子区域的多个引线阵列图案。在热压条件下，通过切口的帮助对准，将印刷的片层叠在一起，形成层叠体。层叠体纵向切割成多个绿色陶瓷条，同时提供用于获得单个陶瓷封装单元的横向捕捉线。使用金属化油墨在每个条的两面上印刷与引线阵列图案相对应的图案。将印刷的条带烧结成陶瓷条，然后进行通常的电镀处理。此后，将引线构件附接到镀覆的陶瓷条上，以形成可分成单个陶瓷封装单元的连接型陶瓷封装。

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