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1. 发明授权

US08154873B2 Heat dissipation device for memory module 失效
标题翻译：内存模块散热装置
公开(公告)号：US08154873B2
公开(公告)日：2012-04-10
申请号：US12629899
申请日：2009-12-03
申请人： Zhi-Sheng Lian , Gen-Ping Deng
发明人： Zhi-Sheng Lian , Gen-Ping Deng
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from a memory module includes two conducting plate clipping the memory module and an elastic member. Each conducting plate includes a lower part and an upper part. The two lower parts of the two conducting plates abut against two opposite sides of the memory module, respectively. The two upper parts of the two conducting plates are pivotably connected together and located above the memory module. The elastic member is located between the two upper parts and urges the two lower parts towards the memory module. The upper part of each conducting plate is slantwise at an obtuse angle to the lower part to make the two upper parts of the two conducting plates splay upwardly.
摘要翻译：从存储模块移除热量的散热装置包括夹持存储器模块和弹性构件的两个导电板。每个导电板包括下部和上部。两个导电板的两个下部分别抵靠存储器模块的两个相对侧。两个导电板的两个上部可枢转地连接在一起并位于存储器模块的上方。弹性构件位于两个上部之间，并且将两个下部部分推向存储器模块。每个导电板的上部与下部呈钝角倾斜，以使两个导电板的两个上部向上张开。

2. 发明授权

US08109323B2 Heat dissipation device having a clip 失效
标题翻译：具有夹子的散热装置
公开(公告)号：US08109323B2
公开(公告)日：2012-02-07
申请号：US12409502
申请日：2009-03-24
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.
摘要翻译：从印刷电路板上的发热电子装置中除去热的散热装置包括底座，安装在基座上的多个翅片以及用于将基座和翅片安装在发热电子设备上的夹子。每个翅片在其中限定了一个封闭的通孔。翅片的孔协同地限定通道。夹具包括延伸穿过翅片的通道的锁定梁和两个紧固件，其接合将基座和翅片安装到发热电子设备上的锁定梁。

3. 发明授权

US07866825B2 Blind for a projector 失效
标题翻译：盲人投影机
公开(公告)号：US07866825B2
公开(公告)日：2011-01-11
申请号：US11937406
申请日：2007-11-08
申请人： Hui Shen , Gen-Ping Deng , Yi-Qiang Wu
发明人： Hui Shen , Gen-Ping Deng , Yi-Qiang Wu
IPC分类号： G03B21/16
CPC分类号： G03B21/16
摘要： A blind (10) for a projector includes a bracket (20) mounted to the projector, and a folded fin (30) fixed on the bracket and covering a hot air vent of the projector. The folded fin includes a plurality of parallel fins (32) and a plurality of upper and lower tabs (34, 36) interconnecting the fins. Each of the fins defines an angle of 135 degrees with a plane defined by the lower tabs. Furthermore, a projection of each of the fins on the plane defined by the lower tabs overlaps a part of a corresponding adjacent fin. Thus, the blind can prevent a light leakage from the projector, while allow a heated airflow to be expelled out of the projector simultaneously.
摘要翻译：用于投影仪的盲板（10）包括安装到投影仪的托架（20）和固定在托架上并覆盖投影仪的热空气孔的折叠翅片（30）。折叠的翅片包括多个平行翅片（32）和互连翅片的多个上部和下部翼片（34,36）。每个翅片与由下部突片限定的平面限定135度的角度。此外，每个翼片在由下翼片限定的平面上的突起与相应的相邻翅片的一部分重叠。因此，盲板可以防止来自投影仪的光泄漏，同时允许加热的气流同时从投影仪中排出。

4. 发明申请

US20100263431A1 METHOD FOR MANUFACTURING COVER OF ELECTRONIC DEVICE AND COVER OBTAINED THEREBY 失效
标题翻译：制造电子设备的盖子及其所获得的盖子的方法
公开(公告)号：US20100263431A1
公开(公告)日：2010-10-21
申请号：US12495685
申请日：2009-06-30
申请人： FENG JIN , GEN-PING DENG , CHUN-CHI CHEN
发明人： FENG JIN , GEN-PING DENG , CHUN-CHI CHEN
IPC分类号： B21D22/22 , B21D22/30
CPC分类号： B21D19/08 , Y10T29/49828
摘要： A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other.
摘要翻译：一种用于制造电子设备的盖的方法，包括提供金属绿色部件的步骤，所述金属生片包括顶板，底板和互连顶板和底板侧的连接板; 提供型材成型插入件和下模具，所述型材成形插入件形成成形表面，所述下模具限定用于接收所述生坯件的端部的空腔; 将型材成型插入件放入绿色件中，成型模制插入件的成形表面朝着绿色件的端部定向; 将生坯件的端部插入下模具的腔体中并冲压下模具，使得在成型件的端部处的顶板和底板沿着型材成型件的成形表面彼此朝向彼此弯曲。

5. 发明申请

US20100000716A1 HEAT DISSIPATION DEVICE HAVING A CLIP 失效
标题翻译：具有夹子的散热装置
公开(公告)号：US20100000716A1
公开(公告)日：2010-01-07
申请号：US12409502
申请日：2009-03-24
申请人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
发明人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.
摘要翻译：从印刷电路板上的发热电子装置中除去热的散热装置包括底座，安装在基座上的多个翅片以及用于将基座和翅片安装在发热电子设备上的夹子。每个翅片在其中限定了一个封闭的通孔。翅片的孔协同地限定通道。夹具包括延伸穿过翅片的通道的锁定梁和两个紧固件，其接合将基座和翅片安装到发热电子设备上的锁定梁。

6. 发明申请

US20080239679A1 HEAT DISSIPATION DEVICE HAVING METAL DIE-CASTING COMPONENT AND METAL-EXTRUSION COMPONENT 失效
标题翻译：具有金属成型部件和金属挤出部件的散热装置
公开(公告)号：US20080239679A1
公开(公告)日：2008-10-02
申请号：US11757917
申请日：2007-06-04
申请人： Gen-Ping Deng , Yi-Qiang Wu , Chun-Chi Chen
发明人： Gen-Ping Deng , Yi-Qiang Wu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion.
摘要翻译：用于从印刷电路板上的发热部件散热的散热装置包括用于覆盖印刷电路板的盖和安装在盖上的散热器。盖子限定了与印刷电路板上的发热部件对应的多个孔。散热器包括分别延伸穿过盖的孔的多个接触部分，用于分别接触发热部件。盖和散热器由不同的制造技术制成，即铝压铸和铝挤压。

7. 发明授权

US07350561B2 Heat sink with combined fins 失效
标题翻译：带散热片的散热片
公开(公告)号：US07350561B2
公开(公告)日：2008-04-01
申请号：US11308297
申请日：2006-03-15
申请人： Gen-Ping Deng , Yi-Qiang Wu
发明人： Gen-Ping Deng , Yi-Qiang Wu
IPC分类号： F28F3/08
CPC分类号： H01L23/3672 , F28F3/02 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink (10) for removing heat from heat-generating devices includes a plurality of fins (12) interconnected together by a fastener (20) extending therethrough. Each fin comprises a main body (14) and a flange (16) bent from an edge of the body. The main body has a thickness and defines a through hole (141, 142, 143) therein. The fastener comprises a plurality of alternating bars (200) and positioned portions (212). Each positioned portion has a same thickness as the main body and is accommodated in the through hole. Each bar is sandwiched between two adjacent main bodies, for fixing the fins in position and preventing the fin from sliding along a length direction of the fastener. The bar has a width larger than a diameter of the through hole.
摘要翻译：用于从发热装置移除热量的散热器（10）包括通过其延伸穿过的紧固件（20）互连在一起的多个散热片（12）。每个翅片包括主体（14）和从主体的边缘弯曲的凸缘（16）。主体具有厚度并且在其中限定了通孔（141,142,143）。紧固件包括多个交替的杆（200）和定位部分（212）。每个定位部分具有与主体相同的厚度并且容纳在通孔中。每个杆夹在两个相邻的主体之间，用于将翅片固定在适当位置并防止翅片沿紧固件的长度方向滑动。该杆的宽度大于通孔的直径。

8. 发明授权

US08322404B2 Heat dissipation device for at least two electronic devices with two sets of fins 失效
标题翻译：用于至少两个具有两组翅片的电子设备的散热装置
公开(公告)号：US08322404B2
公开(公告)日：2012-12-04
申请号：US12391170
申请日：2009-02-23
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20 , H05K7/00 , H01L23/34
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.
摘要翻译：一种用于从电子设备和电子部件移除热量的散热装置，包括与电子设备接触的基板，安装在基板上的第一散热片组和第二散热片组。第一翅片组包括垂直布置在基板上的多个第一翅片。第二翅片组包括附接到第一翅片组的横向侧并垂直于第一翅片和底板的多个第二翅片。风扇安装在第一散热片组的顶部上，第二散热片设置成覆盖它们。由风扇产生的空气流过第一和第二翅片组，以冷却安装在散热装置正交相邻侧面上的电子部件。

9. 发明授权

US07990699B2 Heat dissipation device for memory module 有权
标题翻译：内存模块散热装置
公开(公告)号：US07990699B2
公开(公告)日：2011-08-02
申请号：US12537265
申请日：2009-08-07
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , G06F1/20
摘要： A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation.
摘要翻译：构造成消耗存储器模块的热量的散热装置包括通过枢轴枢转地组装在一起的两个翅片组件，适于布置在存储器模块的两个相对侧表面处的两个散热器和两个热管。两个热管中的每一个包括形成在其两个相对端的蒸发部和冷凝部。热管的冷凝部分分别安装在翅片组件上，热管的蒸发部分分别热连接到散热器上，由此，存储器模块的热量通过散热器的热管传递到散热片组件进行散热。

10. 发明授权

US07952878B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07952878B2
公开(公告)日：2011-05-31
申请号：US12577736
申请日：2009-10-13
申请人： Zhi-Sheng Lian , Gen-Ping Deng
发明人： Zhi-Sheng Lian , Gen-Ping Deng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.
摘要翻译：一种散热装置，用于散发由安装在印刷电路板上的发热元件产生的热量，包括一个吸热板，其底部附着在发热元件上，两个散热片，两个热管，分别连接吸热板板和两个散热片，两个离心风扇和两个夹子。每个离心式风扇位于相应散热器的侧面。每个夹子包括与吸热板铆接的接合部分和从接合部分的两端延伸并锁定在印刷电路板上的两个锁定部分，从而将吸热板固定在发热部件上。

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