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    • 2. 发明申请
    • HEAT DISSIPATION DEVICE
    • 散热装置
    • US20100096107A1
    • 2010-04-22
    • US12391170
    • 2009-02-23
    • ZHI-SHENG LIANGEN-PING DENGCHUN-CHI CHEN
    • ZHI-SHENG LIANGEN-PING DENGCHUN-CHI CHEN
    • F28F7/00
    • F28D15/0233F28D15/0275H01L23/3672H01L23/427H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.
    • 一种用于从电子设备和电子部件移除热量的散热装置,包括与电子设备接触的基板,安装在基板上的第一散热片组和第二散热片组。 第一翅片组包括垂直布置在基板上的多个第一翅片。 第二翅片组包括附接到第一翅片组的横向侧并垂直于第一翅片和底板的多个第二翅片。 风扇安装在第一散热片组的顶部上,第二散热片设置成覆盖它们。 由风扇产生的空气流过第一和第二翅片组,以冷却安装在散热装置正交相邻侧面上的电子部件。
    • 4. 发明申请
    • HEAT DISSIPATION DEVICE FOR MEMORY MODULE
    • 用于存储器模块的散热装置
    • US20100172088A1
    • 2010-07-08
    • US12537265
    • 2009-08-07
    • ZHI-SHENG LIANGEN-PING DENGCHUN-CHI CHEN
    • ZHI-SHENG LIANGEN-PING DENGCHUN-CHI CHEN
    • G06F1/20F28D15/04F28F7/00
    • F28D15/0275G06F1/20
    • A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation.
    • 构造成消耗存储器模块的热量的散热装置包括通过枢轴枢转地组装在一起的两个翅片组件,适于布置在存储器模块的两个相对侧表面处的两个散热器和两个热管。 两个热管中的每一个包括形成在其两个相对端的蒸发部和冷凝部。 热管的冷凝部分分别安装在翅片组件上,热管的蒸发部分分别热连接到散热器上,由此,存储器模块的热量通过散热器的热管传递 到散热片组件进行散热。
    • 5. 发明申请
    • HEAT DISSIPATION DEVICE
    • 散热装置
    • US20100139892A1
    • 2010-06-10
    • US12398972
    • 2009-03-05
    • ZHI-SHENG LIANGEN-PING DENGCHUN-CHI CHEN
    • ZHI-SHENG LIANGEN-PING DENGCHUN-CHI CHEN
    • F28D15/02F28D21/00
    • F28D15/0275H01L23/3672H01L23/4006H01L23/427H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipation device includes a base, first and second fin units, two heat pipes, and a fan. The first fin unit is located on the base, and the second fin unit is located on the first fin unit. Each fin unit comprises a plurality of parallel fins with a plurality of channels defined therebetween. Each fin comprises an inlet section, an outlet section and a neck section interconnecting the inlet and outlet sections. A height of the neck section reduces gradually from the inlet section to the outlet section. Each heat pipe comprises an evaporating portion connecting with the base and a condensing portion inserting into a corresponding one of the outlet sections of the first and second fin units. The fan is located above the base and mounted onto the inlet sections of the first and second fin units.
    • 散热装置包括基座,第一和第二翅片单元,两个热管和风扇。 第一翅片单元位于基座上,第二翅片单元位于第一翅片单元上。 每个翅片单元包括多个平行翅片,其间限定有多个通道。 每个翅片包括入口部分,出口部分和将入口部分和出口部分互连的颈部部分。 颈部的高度从入口部分逐渐减小到出口部分。 每个热管包括与基座连接的蒸发部分和插入第一和第二翅片单元的相应一个出口部分的冷凝部分。 风扇位于基座上方并安装在第一和第二鳍片单元的入口部分上。
    • 9. 发明申请
    • HEAT DISSIPATION DEVICE FOR MEMORY MODULE
    • 用于存储器模块的散热装置
    • US20110051353A1
    • 2011-03-03
    • US12629899
    • 2009-12-03
    • ZHI-SHENG LIANGEN-PING DENG
    • ZHI-SHENG LIANGEN-PING DENG
    • H05K5/02
    • G06F1/20H01L23/4093H01L2924/0002H01L2924/00
    • A heat dissipation device removing heat from a memory module includes two conducting plate clipping the memory module and an elastic member. Each conducting plate includes a lower part and an upper part. The two lower parts of the two conducting plates abut against two opposite sides of the memory module, respectively. The two upper parts of the two conducting plates are pivotably connected together and located above the memory module. The elastic member is located between the two upper parts and urges the two lower parts towards the memory module. The upper part of each conducting plate is slantwise at an obtuse angle to the lower part to make the two upper parts of the two conducting plates splay upwardly.
    • 从存储模块移除热量的散热装置包括夹持存储器模块和弹性构件的两个导电板。 每个导电板包括下部和上部。 两个导电板的两个下部分别抵靠存储器模块的两个相对侧。 两个导电板的两个上部可枢转地连接在一起并位于存储器模块的上方。 弹性构件位于两个上部之间,并且将两个下部部分推向存储器模块。 每个导电板的上部与下部呈钝角倾斜,以使两个导电板的两个上部向上张开。
    • 10. 发明申请
    • HEAT DISSIPATION DEVICE
    • 散热装置
    • US20110032675A1
    • 2011-02-10
    • US12577736
    • 2009-10-13
    • ZHI-SHENG LIANGEN-PING DENG
    • ZHI-SHENG LIANGEN-PING DENG
    • H05K7/20
    • H01L23/467H01L23/4006H01L23/427H01L2924/0002H01L2924/00
    • A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.
    • 一种散热装置,用于散发由安装在印刷电路板上的发热元件产生的热量,包括一个吸热板,其底部附着在发热元件上,两个散热片,两个热管,分别连接吸热板 板和两个散热片,两个离心风扇和两个夹子。 每个离心式风扇位于相应散热器的侧面。 每个夹子包括与吸热板铆接的接合部分和从接合部分的两端延伸并锁定在印刷电路板上的两个锁定部分,从而将吸热板固定在发热部件上。