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    • 4. 发明授权
    • Three-dimensional light-emitting devices and method for fabricating the same
    • 三维发光装置及其制造方法
    • US08476652B2
    • 2013-07-02
    • US12848053
    • 2010-07-30
    • Chunhui YanJianping ZhangYing LiuFanghai ZhaoKevin Ma
    • Chunhui YanJianping ZhangYing LiuFanghai ZhaoKevin Ma
    • H01L33/00
    • H01L33/08H01L27/153H01L33/007H01L33/20H01L33/24H01L33/32
    • A three-dimensional LED structure with vertically displaced active-region includes at least two groups of vertically displaced surfaces on a non-planar substrate. The first group of surfaces are separated from the second group of surfaces by a vertical distance in the growth direction of the LED structure. The first group of surfaces are connected to the second group of surfaces by sidewalls, respectively. The sidewalls can be inclined or vertical and have a sufficient height so that a layer such as an n-type layer, an active-region, or a p-type layer in a first LED structure deposited on the first group of surfaces and a corresponding layer such as an n-type layer, an active-region, or a p-type layer in a second LED structure deposited on the second group of surfaces are separated by the sidewalls. The two groups of surfaces may be vertically displaced from each other in certain areas of an LED chip, while merge into an integral surface in other areas. A method for fabricating the three-dimensional LED structure is also provided.
    • 具有垂直位移的有源区的三维LED结构在非平面衬底上包括至少两组垂直移位的表面。 第一组表面在LED结构的生长方向上与第二组表面分离一个垂直距离。 第一组表面分别通过侧壁连接到第二组表面。 侧壁可以是倾斜的或垂直的并且具有足够的高度,使得在第一组表面上沉积的第一LED结构中的诸如n型层,有源区或p型层的层和相应的 在第二组表面上沉积的第二LED结构中的诸如n型层,有源区或p型层的层被侧壁隔开。 两组表面可以在LED芯片的某些区域中彼此垂直位移,同时在其他区域中合并成一个整体表面。 还提供了一种用于制造三维LED结构的方法。
    • 5. 发明申请
    • THREE-DIMENSIONAL LIGHT-EMITTING DEVICES AND METHOD FOR FABRICATING THE SAME
    • 三维发光装置及其制造方法
    • US20120025230A1
    • 2012-02-02
    • US12848053
    • 2010-07-30
    • CHUNHUI YANJIANPING ZHANGYING LIUFANGHAI ZHAOKEVIN MA
    • CHUNHUI YANJIANPING ZHANGYING LIUFANGHAI ZHAOKEVIN MA
    • H01L33/08H01L33/02H01L33/00
    • H01L33/08H01L27/153H01L33/007H01L33/20H01L33/24H01L33/32
    • A three-dimensional LED structure with vertically displaced active-region includes at least two groups of vertically displaced surfaces on a non-planar substrate. The first group of surfaces are separated from the second group of surfaces by a vertical distance in the growth direction of the LED structure. The first group of surfaces are connected to the second group of surfaces by sidewalls, respectively. The sidewalls can be inclined or vertical and have a sufficient height so that a layer such as an n-type layer, an active-region, or a p-type layer in a first LED structure deposited on the first group of surfaces and a corresponding layer such as an n-type layer, an active-region, or a p-type layer in a second LED structure deposited on the second group of surfaces are separated by the sidewalls. The two groups of surfaces may be vertically displaced from each other in certain areas of an LED chip, while merge into an integral surface in other areas. A method for fabricating the three-dimensional LED structure is also provided.
    • 具有垂直位移的有源区的三维LED结构在非平面衬底上包括至少两组垂直移位的表面。 第一组表面在LED结构的生长方向上与第二组表面分离一个垂直距离。 第一组表面分别通过侧壁连接到第二组表面。 侧壁可以是倾斜的或垂直的并且具有足够的高度,使得在第一组表面上沉积的第一LED结构中的诸如n型层,有源区或p型层的层和相应的 在第二组表面上沉积的第二LED结构中的诸如n型层,有源区或p型层的层被侧壁隔开。 两组表面可以在LED芯片的某些区域中彼此垂直位移,同时在其他区域中合并成一个整体表面。 还提供了一种用于制造三维LED结构的方法。