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    • 2. 发明授权
    • Multi wavelength mask for multi layer printing on a process substrate
    • 用于在工艺衬底上进行多层印刷的多波长掩模
    • US07550236B2
    • 2009-06-23
    • US10953322
    • 2004-09-29
    • Duane B. BarberPhong T DoDouglas M. Horn
    • Duane B. BarberPhong T DoDouglas M. Horn
    • G03F1/00G03F1/14
    • G03F1/50
    • A mask for exposing a first layer and a second layer on a process substrate, where the first and second layers are two separate layers of an integrated circuit. The mask includes a mask substrate that is substantially completely transmissive to a first wavelength of light and a second wavelength of light. A layer of a first material is disposed on the mask substrate, where the first material is substantially opaque to the first wavelength of light. The layer of the first material is patterned for the first layer. A layer of a second material is disposed on the mask substrate, where the second material is substantially opaque to the second wavelength of light. The layer of the second material is patterned for the second layer, where the layer of the first material and the layer of the second material are aligned on the mask substrate for proper alignment of the first and second layers on the process substrate.
    • 用于在处理衬底上暴露第一层和第二层的掩模,其中第一层和第二层是集成电路的两个分开的层。 掩模包括对第一波长的光和第二波长的光完全透射的掩模基板。 第一材料层设置在掩模基板上,其中第一材料对于第一波长的光是基本上不透明的。 第一材料的层被图案化为第一层。 第二材料层设置在掩模基板上,其中第二材料对第二波长的光基本上是不透明的。 第二材料的层被图案化为第二层,其中第一材料的层和第二材料的层在掩模衬底上对准,用于正确对准处理衬底上的第一和第二层。
    • 5. 发明申请
    • SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
    • 半导体元件及其制造方法
    • US20100123193A1
    • 2010-05-20
    • US12271092
    • 2008-11-14
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • H01L27/088H01L21/28
    • H01L27/088H01L21/823487
    • A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shielding electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shielding electrodes. The gate electrodes in the trenches in the device region are connected to the gate electrodes in the trenches in the gate contact region. The shielding electrodes in the trenches in the device region are connected to the shielding electrodes in the termination region.
    • 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与它们的地板相邻的器件沟槽的部分中。 在器件区域的沟槽的侧壁上形成栅极电介质材料,并且在屏蔽电极之间形成栅电极并与屏蔽电极电绝缘。 器件区域中的沟槽中的栅电极连接到栅极接触区域中的沟槽中的栅电极。 器件区域的沟槽中的屏蔽电极与端接区域中的屏蔽电极相连。
    • 6. 发明授权
    • Variable mask field exposure
    • 可变掩模场曝光
    • US07018753B2
    • 2006-03-28
    • US10429376
    • 2003-05-05
    • David J. SturtevantDuane B. BarberAnn I. Kang
    • David J. SturtevantDuane B. BarberAnn I. Kang
    • G03F9/00G03F7/20G03F7/22
    • G03F7/70433G03F1/00G03F1/50G03F7/70466
    • A method of fabricating integrated circuits according to a first design by imaging a first layer on a substrate using a first mask having a block of first patterns in common with a second design, but without any other patterns of the first or second designs and imaging a second layer on the substrate using a second mask having a block of second patterns unique to the first design and at least one third layer pattern. The block of first patterns is repeatedly exposed in a first grid and the block of second patterns is repeatedly exposed in a second grid, each without overlap in the corresponding layer. The grids are aligned such that the integrated circuits and test structures in scribe lines between the integrated circuits are properly formed on the substrate. The first patterns can be for large fields and the second patterns can be for small fields.
    • 一种根据第一设计制造集成电路的方法,其通过使用具有与第二设计相同的第一图案块的第一掩模成像基板上的第一层,但是没有第一或第二设计和成像的任何其它图案 第二层,使用具有第一图案独特的第二图案的块和至少一个第三图案的第二掩模。 第一图案的块在第一栅格中重复曝光,并且第二图案的块在第二栅格中重复地暴露,每个在相应层中不重叠。 栅格对齐,使得在集成电路之间的划线中的集成电路和测试结构适当地形成在衬底上。 第一种模式可以用于大字段,第二种模式可以用于小字段。
    • 7. 发明授权
    • Scatter dots
    • 散点
    • US06861183B2
    • 2005-03-01
    • US10293458
    • 2002-11-13
    • Duane B. Barber
    • Duane B. Barber
    • G03C5/00G03F1/00G03F1/36G03F9/00
    • G03F1/36
    • A mask used for imaging nearly dense features in a substrate. Scatter dots are disposed on the mask in proximity to the nearly dense features, where the scatter dots adjust photon levels of the nearly dense features to a desired level. The adjustment is controlled by selective adjustment of a duty cycle and degree of stagger of the scatter dots. In this manner, the scatter dots adjust the optical properties of the nearly dense features to be very similar to the optical properties of dense features, which enables more accurate imaging of the nearly dense features on the substrate. However, because the scatter dots are discontinuous, they do not overcorrect in the same manner that a scatter bar formed at a minimum resolution might overcorrect. Further, there is a reduced likelihood that the scatter dots would actually print on the substrate.
    • 用于在基底中成像几乎致密特征的掩模。 散射点在几乎致密的特征附近设置在掩模上,其中散射点将几乎致密特征的光子水平调整到期望的水平。 通过选择性调整占空比和散点的交错程度来控制调整。 以这种方式,散射点将几乎致密特征的光学特性调整为非常类似于致密特征的光学性质,这使得能够对基底上几乎致密的特征进行更精确的成像。 然而,由于散射点是不连续的,它们不会以以最小分辨率形成的散射条可能过度校正的相同方式过度校正。 此外,散射点实际上可能在基板上打印的可能性降低。
    • 9. 发明申请
    • SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
    • 半导体元件及其制造方法
    • US20110127603A1
    • 2011-06-02
    • US13022628
    • 2011-02-07
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • H01L29/78H01L21/336
    • H01L29/66727H01L29/407H01L29/41766H01L29/42376H01L29/456H01L29/4933H01L29/66734H01L29/7809H01L29/7811H01L29/7813
    • A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shielding electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shielding electrodes. The gate electrodes in the trenches in the device region are connected to the gate electrodes in the trenches in the gate contact region. The shielding electrodes in the trenches in the device region are connected to the shielding electrodes in the termination region.
    • 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与它们的地板相邻的器件沟槽的部分中。 在器件区域中的沟槽的侧壁上形成栅极电介质材料,并且在屏蔽电极之间形成栅电极并与屏蔽电极电绝缘。 器件区域中的沟槽中的栅电极连接到栅极接触区域中的沟槽中的栅电极。 器件区域的沟槽中的屏蔽电极与端接区域中的屏蔽电极相连。