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    • 1. 发明授权
    • Semiconductor component and method of manufacture
    • 半导体元件及制造方法
    • US08685822B2
    • 2014-04-01
    • US13022628
    • 2011-02-07
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • H01L21/336
    • H01L29/66727H01L29/407H01L29/41766H01L29/42376H01L29/456H01L29/4933H01L29/66734H01L29/7809H01L29/7811H01L29/7813
    • A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shielding electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shielding electrodes. The gate electrodes in the trenches in the device region are connected to the gate electrodes in the trenches in the gate contact region. The shielding electrodes in the trenches in the device region are connected to the shielding electrodes in the termination region.
    • 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与它们的地板相邻的器件沟槽的部分中。 在器件区域中的沟槽的侧壁上形成栅极电介质材料,并且在屏蔽电极之间形成栅电极并与屏蔽电极电绝缘。 器件区域中的沟槽中的栅电极连接到栅极接触区域中的沟槽中的栅电极。 器件区域的沟槽中的屏蔽电极与端接区域中的屏蔽电极相连。
    • 2. 发明授权
    • Method of manufacturing semiconductor component with gate and shield electrodes in trenches
    • 在沟槽中制造具有栅极和屏蔽电极的半导体部件的方法
    • US07897462B2
    • 2011-03-01
    • US12271083
    • 2008-11-14
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • H01L21/336
    • H01L29/66727H01L29/407H01L29/41766H01L29/42376H01L29/456H01L29/4933H01L29/66734H01L29/7809H01L29/7811H01L29/7813
    • A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shielding electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shielding electrodes. The gate electrodes in the trenches in the device region are connected to the gate electrodes in the trenches in the gate contact region. The shielding electrodes in the trenches in the device region are connected to the shielding electrodes in the termination region.
    • 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与它们的地板相邻的器件沟槽的部分中。 在器件区域中的沟槽的侧壁上形成栅极电介质材料,并且在屏蔽电极之间形成栅电极并与屏蔽电极电绝缘。 器件区域中的沟槽中的栅电极连接到栅极接触区域中的沟槽中的栅电极。 器件区域的沟槽中的屏蔽电极与端接区域中的屏蔽电极相连。
    • 6. 发明申请
    • SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
    • 半导体元件及其制造方法
    • US20110127603A1
    • 2011-06-02
    • US13022628
    • 2011-02-07
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • H01L29/78H01L21/336
    • H01L29/66727H01L29/407H01L29/41766H01L29/42376H01L29/456H01L29/4933H01L29/66734H01L29/7809H01L29/7811H01L29/7813
    • A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shielding electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shielding electrodes. The gate electrodes in the trenches in the device region are connected to the gate electrodes in the trenches in the gate contact region. The shielding electrodes in the trenches in the device region are connected to the shielding electrodes in the termination region.
    • 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与它们的地板相邻的器件沟槽的部分中。 在器件区域中的沟槽的侧壁上形成栅极电介质材料,并且在屏蔽电极之间形成栅电极并与屏蔽电极电绝缘。 器件区域中的沟槽中的栅电极连接到栅极接触区域中的沟槽中的栅电极。 器件区域的沟槽中的屏蔽电极与端接区域中的屏蔽电极相连。
    • 10. 发明申请
    • SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
    • 半导体元件及其制造方法
    • US20100123193A1
    • 2010-05-20
    • US12271092
    • 2008-11-14
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • H01L27/088H01L21/28
    • H01L27/088H01L21/823487
    • A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shielding electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shielding electrodes. The gate electrodes in the trenches in the device region are connected to the gate electrodes in the trenches in the gate contact region. The shielding electrodes in the trenches in the device region are connected to the shielding electrodes in the termination region.
    • 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与它们的地板相邻的器件沟槽的部分中。 在器件区域的沟槽的侧壁上形成栅极电介质材料,并且在屏蔽电极之间形成栅电极并与屏蔽电极电绝缘。 器件区域中的沟槽中的栅电极连接到栅极接触区域中的沟槽中的栅电极。 器件区域的沟槽中的屏蔽电极与端接区域中的屏蔽电极相连。