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    • 5. 发明授权
    • Method and structure for isolating substrate noise
    • 隔离衬底噪声的方法和结构
    • US07537982B2
    • 2009-05-26
    • US11972482
    • 2008-01-10
    • Wai-Yi LienDenny Duan-lee Tang
    • Wai-Yi LienDenny Duan-lee Tang
    • H01L21/00H01L21/76
    • H01L21/263H01L21/761
    • An integrated circuit structure for isolating substrate noise and a method of forming the same are provided. In the preferred embodiment of the present invention, a semi-insulating region is formed using proton bombardment in a substrate between a first circuit region and a second circuit region. Two guard rings are formed along the semi-insulating region, each on a side. A backside semi-insulating region is formed through proton bombardment from the back surface of the substrate into the substrate. The backside semi-insulating region is preferably connected with the semi-insulating region. A grounded guard layer is preferably formed on the backside semi-insulating region.
    • 提供了用于隔离衬底噪声的集成电路结构及其形成方法。 在本发明的优选实施例中,使用质子轰击在第一电路区域和第二电路区域之间的衬底中形成半绝缘区域。 沿着半绝缘区域形成两个保护环,每个在一侧。 通过从衬底的背面进入衬底的质子轰击形成背面半绝缘区域。 背面半绝缘区域优选与半绝缘区域连接。 优选地,在背面半绝缘区域上形成接地保护层。
    • 6. 发明授权
    • Isolating substrate noise by forming semi-insulating regions
    • 通过形成半绝缘区域隔离衬底噪声
    • US07492018B2
    • 2009-02-17
    • US11089186
    • 2005-03-24
    • Wai-Yi LienDenny Duan-lee Tang
    • Wai-Yi LienDenny Duan-lee Tang
    • H01L29/76H01L29/47
    • H01L21/263H01L21/761
    • An integrated circuit structure for isolating substrate noise and a method of forming the same are provided. In the preferred embodiment of the present invention, a semi-insulating region is formed using proton bombardment in a substrate between a first circuit region and a second circuit region. Two guard rings are formed along the semi-insulating region, each on a side. A backside semi-insulating region is formed through proton bombardment from the back surface of the substrate into the substrate. The backside semi-insulating region is preferably connected with the semi-insulating region. A grounded guard layer is preferably formed on the backside semi-insulating region.
    • 提供了用于隔离衬底噪声的集成电路结构及其形成方法。 在本发明的优选实施例中,使用质子轰击在第一电路区域和第二电路区域之间的衬底中形成半绝缘区域。 沿着半绝缘区域形成两个保护环,每个在一侧。 通过从衬底的背面进入衬底的质子轰击形成背面半绝缘区域。 背面半绝缘区域优选与半绝缘区域连接。 优选地,在背面半绝缘区域上形成接地保护层。
    • 10. 发明授权
    • Buried channel quasi-unipolar transistor
    • 埋地通道准单极晶体管
    • US06245607B1
    • 2001-06-12
    • US09222270
    • 1998-12-28
    • Denny Duan-Lee TangHu Herbert Chao
    • Denny Duan-Lee TangHu Herbert Chao
    • H01L2976
    • H01L29/783H01L29/7391H01L29/7838
    • A buried channel lateral quasi-unipolar transistor having low flicker or 1/f noise has a bulk region that forms the base of the buried quasi-unipolar transistor. A drain region is implanted into the bulk region to form a drain/collector. A source region is placed at a distance from the drain region and is implanted in the bulk region to form a source/emitter. A channel layer is implanted in the bulk region between the source region and the drain region to provide a low resistivity conduction channel between the drain/collector and the source/emitter. A gate oxide is placed on the surface of the semiconductor substrate immediately above the channel layer. Then a gate electrode of a conductive material such as polycrystalline silicon doped to with a material having a conductivity opposite that of the source/drain deposited on the gate oxide above the channel region. A biasing voltage source connected between the gate electrode and the bulk region to lower a built-in voltage of the quasi-unipolar transistor. The buried channel lateral quasi-unipolar transistor further may have an overlayer implanted between the channel layer and the surface of the semiconductor substrate to form the buried channel layer rather than at the surface of the semiconductor substrate. The buried channel lateral quasi-unipolar transistor may be placed in a diffusion well into which a bulk region is implanted.
    • 具有低闪烁或1 / f噪声的掩埋沟道横向准单极晶体管具有形成埋入的准单极晶体管的基极的体区。 将漏极区域注入到本体区域中以形成漏极/集电极。 源极区域被放置在与漏极区一定距离处并且被植入体区域中以形成源极/发射极。 在源极区域和漏极区域之间的体区域中注入沟道层,以在漏极/集电极和源极/发射极之间提供低电阻率导电沟道。 栅极氧化物放置在沟道层正上方的半导体衬底的表面上。 然后是导电材料的栅电极,例如掺杂有导电性的材料的多晶硅,该导电性与沉积在沟道区上方的栅极氧化物上的源极/漏极的导电性相反。 连接在栅电极和体区之间的偏置电压源,以降低准单极晶体管的内置电压。 掩埋沟道横向准单极晶体管还可以在沟道层和半导体衬底的表面之间具有覆盖层,以形成掩埋沟道层而不是在半导体衬底的表面。 掩埋沟道横向准单极晶体管可以放置在扩散阱中,植入体区域。