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1. 外观设计

USD694934S1 Light emitting diode lamp 有权
公开(公告)号：USD694934S1
公开(公告)日：2013-12-03
申请号：US29436155
申请日：2012-11-01
申请人： Shi-Song Zheng , Jin-Biao Liu , Chin-Chung Chen
设计人： Shi-Song Zheng , Jin-Biao Liu , Chin-Chung Chen

2. 发明申请

US20110017430A1 THERMAL MODULE 审中-公开
标题翻译：热模块
公开(公告)号：US20110017430A1
公开(公告)日：2011-01-27
申请号：US12566693
申请日：2009-09-25
申请人： ZHI-SHENG LIAN , JIN-BIAO LIU , GEN-PING DENG
发明人： ZHI-SHENG LIAN , JIN-BIAO LIU , GEN-PING DENG
IPC分类号： F28D15/04 , G06F1/20 , F28F7/00
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a mounting plate, a centrifugal fan with a fin assembly arranged at an air outlet thereof, and a heat pipe connected the fin assembly with the heat mounting plate. The centrifugal fan includes a fan housing and an impeller rotatably received in the fan housing. The fan housing is disposed immediately neighboring to the mounting plate and mounted to a lateral side of the mounting plate via a securing structure formed between the fan housing and the mounting plate. The fan housing consists of a base and a cover. The base is made of a plastic material.
摘要翻译：热模块包括安装板，具有布置在其空气出口处的翅片组件的离心风扇和将翅片组件与热安装板连接的热管。离心风扇包括风扇壳体和可旋转地容纳在风扇壳体中的叶轮。所述风扇壳体与所述安装板紧邻配置，并经由所述风扇壳体与所述安装板之间形成的固定结构安装在所述安装板的侧面。风扇外壳由底座和盖组成。基座由塑料制成。

3. 发明授权

US07613001B1 Heat dissipation device with heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07613001B1
公开(公告)日：2009-11-03
申请号：US12118757
申请日：2008-05-12
申请人： Jin-Biao Liu , Hong-Cheng Yang , Chun-Chi Chen
发明人： Jin-Biao Liu , Hong-Cheng Yang , Chun-Chi Chen
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H05K7/20336
摘要： A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.
摘要翻译：散热装置用于从计算机外壳中的至少两个相邻的第一和第二电子装置移除热量。散热装置包括安装在第一电子装置上的第一散热器和安装在第二电子装置上的第二散热器。第一散热器包括底座，安装在基座上的第一翅片单元和从底座向外延伸的两根热管。第二和第三鳍单元分别与两根热管接合。第一，第二和第三鳍单元分别位于计算机机箱的第一，第二和第三开口附近。第二散热器位于第一散热器的第一，第二和第三散热片之间。

4. 发明授权

US07606028B2 Heat dissipation device having a fan holder for attachment of a fan 有权
标题翻译：具有用于安装风扇的风扇支架的散热装置
公开(公告)号：US07606028B2
公开(公告)日：2009-10-20
申请号：US11961375
申请日：2007-12-20
申请人： Jin-Biao Liu
发明人： Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder includes two opposite first beams and another two opposite second beams. Each of the first beams has a latching leg extending downwardly therefrom and two locking tabs extending upwardly therefrom. The two latching legs are engaged into the two slots of the heat sink. The locking tabs are fastened to two lateral sides of the fan.
摘要翻译：散热装置包括散热器，风扇和将风扇锁定在散热器上的风扇架。散热片在其两个相对的侧面限定了两个槽。风扇架包括两个相对的第一梁和另外两个相对的第二梁。每个第一梁具有从其向下延伸的闩锁腿和从其向上延伸的两个锁定突舌。两个锁定腿接合到散热器的两个槽中。锁定片固定在风扇的两侧。

5. 发明授权

US07289322B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07289322B2
公开(公告)日：2007-10-30
申请号：US11163573
申请日：2005-10-24
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , F28F3/02 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin plates cooperatively form a scraggy surface when the fin plates are assembled together. Airflow produced by the fan directly impinges on the scraggy surface thereby enhancing heat transferring between the fin plates and the airflow.
摘要翻译：散热器包括包括多个翅片板（22）和安装在翅片组件上的风扇（30）的翅片组件（20）。每个鳍板包括限定在其一个边缘上的多个切口（226），并且当翅片板组装在一起时，翅片板的切口协同地形成刮屑表面。由风扇产生的气流直接撞击在肮脏的表面上，从而增强翅片与气流之间的热传递。

6. 发明申请

US20070144705A1 HEAT SINK 失效
标题翻译：散热器
公开(公告)号：US20070144705A1
公开(公告)日：2007-06-28
申请号：US11306423
申请日：2005-12-28
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F3/048 , F28F3/06 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular to the first fins, a heat pipe connecting the base and the conducting member to transfer heat from the base to the conducting member.
摘要翻译：用于从电子元件散热的散热器包括：底座，其具有从其向上延伸的多个第一鳍片;导电构件，其与所述底座热接触;以及多个第二翅片，所述多个第二鳍片从所述导电构件的两个相对侧面向不同方向延伸，垂直于第一散热片的热管，连接基座和导电构件以将热量从基座传导到导电构件的热管。

7. 发明授权

US07869217B2 Toolless locking device 失效
标题翻译：无工具锁定装置
公开(公告)号：US07869217B2
公开(公告)日：2011-01-11
申请号：US12202391
申请日：2008-09-01
申请人： Chun-Chi Chen , Hong-Cheng Yang , Jin-Biao Liu , He-Ping Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , Jin-Biao Liu , He-Ping Liu
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending towards the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.
摘要翻译：锁定装置用于将散热器固定到安装在限定第一孔的印刷电路板的第一面上的电子装置上。散热片在其中限定第二个孔。锁定装置具有紧固件，该紧固件包括位于散热器的头部的部分，位于印刷电路板的第二面的脚部以及延伸穿过散热器和印刷电路板的孔的主体部分，头部和脚部。脚部包括抵靠印刷电路板的第二面的压曲部，以及朝向头部延伸到屈曲部上方的位置的定位部。当屈曲部分抵靠印刷电路板时，定位部分的一部分进入第一孔。

8. 发明申请

US20100246127A1 HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热装置及其制造方法
公开(公告)号：US20100246127A1
公开(公告)日：2010-09-30
申请号：US12500615
申请日：2009-07-10
申请人： XIN-LEI LIU , JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
发明人： XIN-LEI LIU , JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
IPC分类号： H05K7/20 , B23P11/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.
摘要翻译：一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，邻近翅片单元的离心风扇，附着在电子部件上的导热板，以及热连接翅片单元和电子部件。接合部从导热板的顶面向上突出。热管具有延伸穿过接合部分并且固定到导热板的顶面的蒸发部分和连接到散热片单元的冷凝部分。

9. 发明授权

US07782623B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07782623B2
公开(公告)日：2010-08-24
申请号：US12392082
申请日：2009-02-24
申请人： Jin-Biao Liu
发明人： Jin-Biao Liu
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H01L23/4006 , F28F3/06 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat generated by an electronic device on a printed circuit board includes a heat sink and a plurality of mounting devices. A plurality of retaining pillars are secured on the printed circuit board at positions around the electronic device. Each of the mounting devices includes a fixing portion connecting with the heat sink, a mounting portion extending from the fixing portion and a locating portion extending from the mounting portion to a position below the mounting portion. The retaining pillars on the printed circuit board extend through the locating portions and abut against bottoms of the mounting portions to accurately position the heat dissipation device on the electronic device on the circuit board before fasteners are brought to extend through the mounting portions to screw in the retaining pillars.
摘要翻译：用于散发印刷电路板上的电子装置产生的热量的散热装置包括散热器和多个安装装置。多个保持柱在电子设备周围的位置固定在印刷电路板上。每个安装装置包括与散热器连接的固定部分，从固定部分延伸的安装部分和从安装部分延伸到安装部分下方的位置。印刷电路板上的保持柱延伸穿过定位部分并抵靠安装部分的底部，以在将紧固件延伸穿过安装部分之前将散热装置精确地定位在电路板上的电子装置上，以将其拧入留柱。

10. 发明申请

US20090279251A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 失效
标题翻译：热管散热装置
公开(公告)号：US20090279251A1
公开(公告)日：2009-11-12
申请号：US12118757
申请日：2008-05-12
申请人： JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
发明人： JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20336
摘要： A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.
摘要翻译：散热装置用于从计算机外壳中的至少两个相邻的第一和第二电子装置移除热量。散热装置包括安装在第一电子装置上的第一散热器和安装在第二电子装置上的第二散热器。第一散热器包括底座，安装在基座上的第一翅片单元和从底座向外延伸的两根热管。第二和第三鳍单元分别与两根热管接合。第一，第二和第三鳍单元分别位于计算机机箱的第一，第二和第三开口附近。第二散热器位于第一散热器的第一，第二和第三散热片之间。

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