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1. 发明申请

US20070165374A1 ELECTRONIC COOLING SYSTEM HAVING A VENTILATING DUCT 失效
标题翻译：具有通风管的电子冷却系统
公开(公告)号：US20070165374A1
公开(公告)日：2007-07-19
申请号：US11307011
申请日：2006-01-19
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.
摘要翻译：计算机外壳中的散热装置包括安装在CPU（12）上的散热器（20），第一散热器（30），耦合到第一散热器的冷却风扇（40），第二散热器（50）），安装在散热器上并热连接第一散热器和第二散热器的热管（80），附接到第二散热器的系统风扇（60）和在冷却风扇和第二个散热器。系统风扇位于计算机外壳的百叶窗附近。由冷却风扇和系统风扇产生的气流流过第一散热器，然后流过风扇导管，第二散热器，最后通风百叶窗离开电脑外壳。

2. 发明申请

US20070091568A1 HEAT SINK 失效
标题翻译：散热器
公开(公告)号：US20070091568A1
公开(公告)日：2007-04-26
申请号：US11163573
申请日：2005-10-24
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , F28F3/02 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin plates cooperatively form a scraggy surface when the fin plates are assembled together. Airflow produced by the fan directly impinges on the scraggy surface thereby enhancing heat transferring between the fin plates and the airflow.
摘要翻译：散热器包括包括多个翅片板（22）和安装在翅片组件上的风扇（30）的翅片组件（20）。每个鳍板包括限定在其一个边缘上的多个切口（226），并且当翅片板组装在一起时，翅片板的切口协同地形成刮屑表面。由风扇产生的气流直接撞击在肮脏的表面上，从而增强翅片与气流之间的热传递。

3. 发明授权

US07414841B2 Electronic cooling system having a ventilating duct 失效
标题翻译：具有通风管的电子冷却系统
公开(公告)号：US07414841B2
公开(公告)日：2008-08-19
申请号：US11307011
申请日：2006-01-19
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20 , H05K5/00 , F28D15/00
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.
摘要翻译：计算机外壳中的散热装置包括安装在CPU（12）上的散热器（20），第一散热器（30），耦合到第一散热器的冷却风扇（40），第二散热器（50）），安装在所述散热器上并热连接所述第一散热器和所述第二散热器的热管（80），附接到所述第二散热器的系统风扇（60）和在所述冷却风扇和第二个散热器。系统风扇位于计算机外壳的百叶窗附近。由冷却风扇和系统风扇产生的气流流过第一散热器，然后流过风扇导管，第二散热器，最后通风百叶窗离开电脑外壳。

4. 发明申请

US20070263355A1 HEAT DISSIPATION SYSTEM 审中-公开
标题翻译：散热系统
公开(公告)号：US20070263355A1
公开(公告)日：2007-11-15
申请号：US11309837
申请日：2006-10-09
申请人： Guang Yu , Da-Yuan Zhou , Shih-Hsun Wung , Chun-Chi Chen
发明人： Guang Yu , Da-Yuan Zhou , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation system is used for dissipating heat generated by an electronic device. The heat dissipation system includes a computer enclosure containing the electronic device therein. The computer enclosure has a heat dissipating member formed thereon. A base contacts the electronic device in the computer enclosure. At least a heat pipe includes a first end thermally engaged in at least a groove defined in the base and a second end thermally contacting the computer enclosure. A heat sink is mounted on the base and thermally connects with the base and the first end of the at least a heat pipe.
摘要翻译：散热系统用于散发由电子设备产生的热量。散热系统包括其中包含电子设备的计算机外壳。计算机外壳具有形成在其上的散热构件。基座接触电脑机箱中的电子设备。至少热管包括热接合在限定在基部中的至少一个凹槽中的第一端和与该计算机外壳热接触的第二端。散热器安装在基座上并与基座和至少一个热管的第一端热连接。

5. 发明申请

US20060273137A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 失效
标题翻译：带热管的散热装置
公开(公告)号：US20060273137A1
公开(公告)日：2006-12-07
申请号：US11308383
申请日：2006-03-20
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： A47J36/02
CPC分类号： H01L23/4006 , H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.
摘要翻译：散热装置包括用于从发热装置吸收热量的座。至少一个热管具有与座椅热结合的第一部分，并且其第二部分从第一部分延伸并远离座椅。多个散热片位于座椅上。多个散热器中的每一个具有基部和从基部一体地延伸并由铝挤压制成的多个翅片。散热器的基部将其中的至少一个热管的两个第二部分热夹心。散热器的至少一个基座成角度或垂直于座椅。

6. 发明授权

US07414839B2 Heat dissipation device having a fan holder for attachment of a fan 失效
标题翻译：散热装置具有用于安装风扇的风扇支架
公开(公告)号：US07414839B2
公开(公告)日：2008-08-19
申请号：US11564260
申请日：2006-11-28
申请人： Guang Yu , Da-Yuan Zhou , Shih-Hsun Wung , Chun-Chi Chen
发明人： Guang Yu , Da-Yuan Zhou , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , Y10T29/49245 , Y10T29/49327 , H01L2924/00
摘要： A heat dissipation device comprises a heat sink, a fan, and a fan holder. The heat sink includes a base and a plurality of fins arranged on the base. The fan includes a frame having an engaging flange at each corner thereof. The fan holder configured for attaching the fan to the heat sink includes a main body having two opposite sidewalls extending upwardly from two opposite sides of the main body, a peg extending through the sidewall and movable in a direction perpendicular to the sidewall, and a handle capable of operating the peg. At least one of the engaging flanges of the fan is depressed by the peg towards the main body, thereby securing the fan on the fan holder.
摘要翻译：散热装置包括散热器，风扇和风扇架。散热器包括基部和布置在基部上的多个翅片。风扇包括在其每个拐角处具有接合凸缘的框架。构造成用于将风扇附接到散热器的风扇保持器包括：主体，其具有从主体的两个相对侧向上延伸的两个相对的侧壁，延伸穿过侧壁并可沿垂直于侧壁的方向移动的钉，能够操作栓钉。风扇的接合凸缘中的至少一个被销钉朝向主体压下，从而将风扇固定在风扇架上。

7. 发明申请

US20080041561A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20080041561A1
公开(公告)日：2008-02-21
申请号：US11309534
申请日：2006-08-18
申请人： Da-Yuan Zhou , Guang Yu , Chun-Chi Chen , Shih-Hsun Wung
发明人： Da-Yuan Zhou , Guang Yu , Chun-Chi Chen , Shih-Hsun Wung
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F1/24 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for a heat-generating electronic component includes a heat sink (10) and a fan (20) mounted on a lateral side of the heat sink. The heat sink defines a plurality of channels (162) therein. A fan holder (30) is rotatably mounted on the heat sink. The fan is fixedly mounted on the fan holder and faces towards the channels of the heat sink. An airflow generated by the fan flows through the channels of the fan. When the fan holder rotates with respect to the heat sink, an airflow direction of the fan is changed accordingly.
摘要翻译：一种用于发热电子部件的散热装置包括散热器（10）和安装在散热器的侧面上的风扇（20）。散热器在其中限定多个通道（162）。风扇架（30）可旋转地安装在散热器上。风扇固定安装在风扇支架上，面向散热片的通道。风扇产生的气流流过风扇的通道。当风扇架相对于散热器旋转时，风扇的风向相应地改变。

8. 发明申请

US20070215335A1 HEAT SINK 审中-公开
标题翻译：散热器
公开(公告)号：US20070215335A1
公开(公告)日：2007-09-20
申请号：US11308239
申请日：2006-03-14
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/3677 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a base and a plurality of column-shaped fins. The base defines an array of blind holes therein. The fins threadedly engage in the base at the blind holes by self-tapping so that the fins are interferentially and intimately engaged with the base. The fins each include a head for facilitating to turn the fins, a terminated cone received in the blind holes and a spiral thread between the head and the terminated cone.
摘要翻译：散热器包括基部和多个柱状翅片。基座中限定了盲孔阵列。翅片通过自攻螺纹地接合在盲孔处的底座中，使得翼片与底座相互紧密地接合。翅片各自包括用于便于转动翅片的头部，容纳在盲孔中的端接锥体和头部与终止锥体之间的螺旋线。

9. 发明授权

US07690418B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07690418B2
公开(公告)日：2010-04-06
申请号：US11306423
申请日：2005-12-28
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F3/048 , F28F3/06 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular to the first fins, a heat pipe connecting the base and the conducting member to transfer heat from the base to the conducting member.
摘要翻译：用于从电子元件散热的散热器包括：底座，其具有从其向上延伸的多个第一鳍片;导电构件，其与底座热接触;以及多个第二翅片，其从导电构件的两个相对的侧面向不同方向延伸，垂直于第一散热片的热管，连接基座和导电构件以将热量从基座传导到导电构件的热管。

10. 发明授权

US07283368B2 Heat dissipating assembly 失效
标题翻译：散热组件
公开(公告)号：US07283368B2
公开(公告)日：2007-10-16
申请号：US11163516
申请日：2005-10-21
申请人： Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Chun-Chi Chen
发明人： Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating assembly includes a heat sink (10) having a chassis (12), a back plate (30) and a plurality of fasteners (40). Each fastener includes a screw cap (42), a spring (44) and a sleeve (46). The screw cap and the sleeve are movably connected together. The screw cap includes a head (420) and a tube (422) extending from the head. The tube includes a first cavity (424) and a second cavity (426). The back plate forms a plurality of posts (34) passing through the chassis and threadedly engaging in the first cavities of the tubes. A spring (44) is compressed between the first cavity of the tube and a bottom wall of the sleeve, for providing appropriate downwardly pressing force on the chassis of the heat sink against a CPU (22) mounted on a PCB (20).
摘要翻译：散热组件包括具有底盘（12），后板（30）和多个紧固件（40）的散热器（10）。每个紧固件包括螺帽（42），弹簧（44）和套筒（46）。螺帽和套筒可移动地连接在一起。螺旋盖包括头部（420）和从头部延伸的管（422）。管包括第一腔（424）和第二腔（426）。后板形成穿过底盘并且螺纹地接合在管的第一腔中的多个柱（34）。弹簧（44）在管的第一腔和套筒的底壁之间被压缩，用于在安装在PCB（20）上的CPU（22）的散热片的底盘上提供适当的向下按压力。

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