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1. 发明授权

US08736645B2 Printhead fabrication methods and printheads 有权
标题翻译：打印头制造方法和打印头
公开(公告)号：US08736645B2
公开(公告)日：2014-05-27
申请号：US13382805
申请日：2009-07-08
申请人： Napoleon J. Leoni , Omer Gila , Cary G. Addington , Paul H. McClelland , Henryk Birecki
发明人： Napoleon J. Leoni , Omer Gila , Cary G. Addington , Paul H. McClelland , Henryk Birecki
IPC分类号： B41J2/39 , B41J2/395 , B21D53/00 , B29C65/00 , B32B37/00 , G05G15/00 , H01L21/30 , H01L21/46
CPC分类号： B41J2/39 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1634 , B41J2/1646 , Y10T29/49002 , Y10T29/49401
摘要： A printhead and related fabrication method are described with the printhead including a spacer layer.
摘要翻译：描述打印头和相关的制造方法，打印头包括间隔层。

2. 发明申请

US20130021393A1 STATIC ELECRONIC DISPLAY 审中-公开
标题翻译：静态显示
公开(公告)号：US20130021393A1
公开(公告)日：2013-01-24
申请号：US13189469
申请日：2011-07-22
申请人： Gregg A. Combs , Cary G. Addington
发明人： Gregg A. Combs , Cary G. Addington
IPC分类号： G09G5/10
CPC分类号： G09G3/2074 , G09G2300/0443 , G09G2300/0452
摘要： A static electronic display employs pixels having a plurality of subpixels that exhibit one of a minimum intensity and a maximum intensity of an intensity range of the image. The static electronic display includes an array of the pixels of an electrode patterned to represent image pixels of the image. A relative number of minimum intensity subpixels and maximum intensity subpixels of each pixel in the array corresponds to an intensity level of a corresponding image pixel of the image.
摘要翻译：静态电子显示器使用具有多个子像素的像素，其呈现图像的强度范围的最小强度和最大强度之一。静电电子显示器包括图案化以表示图像的图像像素的电极的像素的阵列。阵列中每个像素的最小强度子像素和最大强度子像素的相对数量对应于图像的相应图像像素的强度水平。

3. 发明申请

US20120098406A1 PIXEL STRUCTURES 失效
标题翻译：像素结构
公开(公告)号：US20120098406A1
公开(公告)日：2012-04-26
申请号：US12911218
申请日：2010-10-25
申请人： Vincent C. Korthuis , Cary G. Addington , Peter S. Nyholm
发明人： Vincent C. Korthuis , Cary G. Addington , Peter S. Nyholm
IPC分类号： H01J1/00 , H01J9/00
CPC分类号： G02F1/167 , G02F2001/1676
摘要： In an embodiment, a pixel structure has an electrical conductor, a dielectric on the electrical conductor, a plurality of ribs on the dielectric, and a plurality of discrete protrusions protruding from a surface of each of the ribs. The plurality ribs define a plurality of compartments on the dielectric.
摘要翻译：在一个实施例中，像素结构具有电导体，电导体上的电介质，电介质上的多个肋，以及从每个肋的表面突出的多个离散突起。多个肋在电介质上限定多个隔室。

4. 发明授权

US06927108B2 Solution-processed thin film transistor formation method 失效
公开(公告)号：US06927108B2
公开(公告)日：2005-08-09
申请号：US10617114
申请日：2003-07-09
申请人： Jian-gang Weng , Ravi Prasad , Cary G Addington , Man Ho Cheung
发明人： Jian-gang Weng , Ravi Prasad , Cary G Addington , Man Ho Cheung
IPC分类号： H01L21/336 , H01L51/00 , H01L51/05 , H01L51/30 , H01L51/40 , H01L21/00
CPC分类号： H01L51/0021 , H01L27/283 , H01L29/66742 , H01L51/0017 , H01L51/0036 , H01L51/0037 , H01L51/0097 , H01L51/0541 , H01L51/0545
摘要： An exemplary solution-processed thin film transistor formation method of the invention forms conductive solution-processed thin film material contacts, semiconductor solution-processed thin film material active regions, and dielectric solution-processed thin film material isolations in a sequence and organization to form a solution-processed thin film structure capable of transistor operation. During or after the formation of the transistor structure, laser ablation is applied to one or more of the conductive solution-processed thin film material contacts, the semiconductor solution-processed thin film material active regions and the dielectric solution-processed thin film material isolations to pattern or complete patterning of a material being selectively ablated.

5. 发明授权

US08115313B2 Method to form an interconnect 有权
标题翻译：形成互连的方法
公开(公告)号：US08115313B2
公开(公告)日：2012-02-14
申请号：US11581047
申请日：2006-10-12
申请人： Jian-Gang Weng , Ravi Prasad , Cary G. Addington , Peter S. Nyholm
发明人： Jian-Gang Weng , Ravi Prasad , Cary G. Addington , Peter S. Nyholm
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76898 , H01L21/288 , H01L21/76802 , H01L21/76838 , H01L21/76877 , Y10S438/94 , Y10S977/773
摘要： A plurality of electrodes are electrically coupled to each other by conductive interconnects formed from selectively sintered nanoparticles.
摘要翻译：多个电极通过由选择性烧结的纳米颗粒形成的导电互连彼此电耦合。

6. 发明申请

US20110085224A1 ELECTRONIC DISPLAY DEVICE PROVIDING STATIC GRAYSCALE IMAGE 有权
标题翻译：电子显示设备提供静态灰度图像
公开(公告)号：US20110085224A1
公开(公告)日：2011-04-14
申请号：US12578939
申请日：2009-10-14
申请人： Cary G. Addington , Jong-Souk Yeo
发明人： Cary G. Addington , Jong-Souk Yeo
IPC分类号： G02F1/167 , H01J9/20
CPC分类号： G02F1/167
摘要： In one embodiment, a device includes a first display element including: a first electrode; a transparent dielectric layer having recessed regions therein over the first electrode; a halftoned second electrode opposite the first electrode; and a fluid with colorant particles between the first electrode and the second electrode, wherein a voltage signal applied between the first electrode and the second electrode controls movement of the colorant particles such that a first voltage signal provides a clear optical state by compacting the colorant particles into the recessed regions and a second voltage signal provides a grayscale optical state by attracting the colorant particles to the second electrode.
摘要翻译：在一个实施例中，一种装置包括第一显示元件，包括：第一电极; 透明电介质层，其在第一电极之上具有凹陷区域; 与第一电极相对的半色调的第二电极; 以及在第一电极和第二电极之间具有着色剂颗粒的流体，其中施加在第一电极和第二电极之间的电压信号控制着色剂颗粒的运动，使得第一电压信号通过压实着色剂颗粒提供清晰的光学状态并且第二电压信号通过将着色剂颗粒吸引到第二电极来提供灰度光学状态。

7. 发明授权

US07833426B2 Features in substrates and methods of forming 有权
标题翻译：基材特征和成型方法
公开(公告)号：US07833426B2
公开(公告)日：2010-11-16
申请号：US11803179
申请日：2007-05-11
申请人： Leo C. Clarke , Chris Aschoff , Cary G. Addington
发明人： Leo C. Clarke , Chris Aschoff , Cary G. Addington
IPC分类号： G01D15/00 , B23P17/00
CPC分类号： B41J2/14145 , B41J2/1603 , B41J2/1623 , B41J2/1625 , B41J2/1631 , B41J2/1634 , B41J2/1639 , B41J2/1645 , Y10T29/49401 , Y10T156/10
摘要： The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.
摘要翻译：所描述的实施例涉及衬底中的特征及其形成方法。一个示例性实施例可以是包括在第一衬底表面和大致相对的第二衬底表面之间延伸的衬底的微器件，以及沿着不横向于第一表面的孔轴线形成在第一表面中的至少一个特征。

8. 发明授权

US07728425B2 Seal of fluid port 有权
标题翻译：流体口密封
公开(公告)号：US07728425B2
公开(公告)日：2010-06-01
申请号：US11157350
申请日：2005-06-21
申请人： Cary G. Addington , Shell Elaine Whittington , Peter Mardilovich , William Wren
发明人： Cary G. Addington , Shell Elaine Whittington , Peter Mardilovich , William Wren
IPC分类号： H01L23/10
CPC分类号： H05K5/0095 , B81C1/00333 , B81C2203/019 , H01L21/50 , H01L23/44 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component, a lid sealed to the base, the lid including a fillport, and the fillport hermetically sealed by light irradiation.
摘要翻译：电子部件包装系统的一个实施例包括适于支撑电子部件的基座，密封到基座的盖子，盖子包括填充口，以及通过光照射密封的填充口。

9. 发明授权

US07658470B1 Method of using a flexible circuit 有权
标题翻译：使用柔性电路的方法
公开(公告)号：US07658470B1
公开(公告)日：2010-02-09
申请号：US11118200
申请日：2005-04-28
申请人： Brian Jones , Robert Weber , Cary G Addington , Si-Lam Choy
发明人： Brian Jones , Robert Weber , Cary G Addington , Si-Lam Choy
IPC分类号： B41J2/14 , B41J2/175 , B41J2/05
CPC分类号： B41J2/17526 , B41J2/14072 , H05K3/0058 , H05K3/386 , H05K2201/09036 , H05K2201/09063 , H05K2201/2072
摘要： A method of using a flexible circuit, including attaching a first portion of the flexible circuit, via an attaching surface of the flexible circuit, to a first surface of a chip carrier. Statically bending a bending portion of the flexible circuit around an edge formed at the intersection of the first surface of the chip carrier, and a second surface of the chip carrier. Adhesively attaching a second portion of the flexible circuit, via the attaching surface, to the second surface of the chip carrier, where the second portion of the flexible circuit has at least one first anchor structure formed in the attaching surface, where the at least one first anchor structure is adapted to accept an adhesive.
摘要翻译：一种使用柔性电路的方法，包括通过柔性电路的附接表面将柔性电路的第一部分附接到芯片载体的第一表面。围绕形成在芯片载体的第一表面的交点处的边缘和芯片载体的第二表面静态弯曲柔性电路的弯曲部分。将柔性电路的第二部分经由附接表面粘附到芯片载体的第二表面，其中柔性电路的第二部分具有形成在附接表面中的至少一个第一锚定结构，其中至少一个第一锚结构适于接受粘合剂。

10. 发明授权

US07135405B2 Method to form an interconnect 有权
标题翻译：形成互连的方法
公开(公告)号：US07135405B2
公开(公告)日：2006-11-14
申请号：US10912442
申请日：2004-08-04
申请人： Jian-Gang Weng , Ravi Prasad , Cary G. Addington , Peter S. Nyholm
发明人： Jian-Gang Weng , Ravi Prasad , Cary G. Addington , Peter S. Nyholm
IPC分类号： H01L39/00
CPC分类号： H01L21/76898 , H01L21/288 , H01L21/76802 , H01L21/76838 , H01L21/76877 , Y10S438/94 , Y10S977/773
摘要： Embodiments of methods, apparatuses, devices, and/or systems for forming an interconnect are described.
摘要翻译：描述了用于形成互连的方法，设备，设备和/或系统的实施例。

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