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1. 发明授权

US09464524B2 Anchor rod 有权
标题翻译：锚杆
公开(公告)号：US09464524B2
公开(公告)日：2016-10-11
申请号：US14345903
申请日：2012-07-10
申请人： Josef Glogger , Bernhard Winkler
发明人： Josef Glogger , Bernhard Winkler
IPC分类号： E21D20/02 , F16B13/14
CPC分类号： E21D20/02 , E21D20/021 , E21D20/025 , F16B13/141
摘要： An anchor rod is disclosed. The anchor rod includes an attachment region and an anchoring region which is insertable into a borehole and which has a profiled section. The profiled section interacts with a curable organic and/or inorganic mortar compound filled into the borehole. The profiled section includes a plurality of expansion sections disposed axially in a row which are conically shaped. For each of the plurality of expansion sections, a diameter of the expansion section increases in a direction toward a free front end of the anchor rod, a ratio of a distance of the expansion section to a mean borehole diameter is 0.40 to 0.60, a ratio of an outer diameter to a core diameter of the expansion section is 1.35 to 1.55, and a cone angle of the expansion section is 22.5° to 27.5°.
摘要翻译：公开了一种锚杆。锚杆包括附接区域和可插入钻孔中并具有成型部分的锚定区域。型材部分与填充到钻孔中的可固化的有机和/或无机砂浆化合物相互作用。成形部分包括多个沿圆锥形状排列成一列的膨胀部分。对于多个膨胀部中的每一个，膨胀部的直径朝向锚杆的自由前端的方向增大，膨胀部的距离与平均井眼直径的比率为0.40〜0.60，的外径与膨胀部的芯直径的比为1.35〜1.55，膨胀部的锥角为22.5°〜27.5°。

2. 发明授权

US08627720B2 Acceleration sensor 有权
标题翻译：加速度传感器
公开(公告)号：US08627720B2
公开(公告)日：2014-01-14
申请号：US13612042
申请日：2012-09-12
申请人： Thoralf Kautzsch , Bernhard Winkler , Dirk Meinhold , Ben Rosam , Bernd Foeste , Andreas Thamm , Boris Binder
发明人： Thoralf Kautzsch , Bernhard Winkler , Dirk Meinhold , Ben Rosam , Bernd Foeste , Andreas Thamm , Boris Binder
IPC分类号： G01P15/125 , H01L29/84 , H01L21/02
CPC分类号： G01P15/125 , B81B2201/0235 , B81C1/00182 , G01P15/0802
摘要： A semiconductor device includes a semiconductor substrate and a semiconductor mass element configured to move in response to an applied acceleration. The mass element is defined by trenches etched into the semiconductor substrate and a cavity below the mass element. The semiconductor device includes a sensing element configured to sense movement of the mass element.
摘要翻译：半导体器件包括半导体衬底和配置为响应于所施加的加速度而移动的半导体质量元件。质量元件由蚀刻到半导体衬底中的沟槽和质量元件下方的空腔限定。半导体器件包括感测元件，其被配置为感测质量元件的移动。

3. 发明授权

US08476990B2 MEMS resonator devices 有权
标题翻译： MEMS谐振器装置
公开(公告)号：US08476990B2
公开(公告)日：2013-07-02
申请号：US13241638
申请日：2011-09-23
申请人： Bernhard Winkler , Mohsin Nawaz , Florian Schoen
发明人： Bernhard Winkler , Mohsin Nawaz , Florian Schoen
IPC分类号： H03H9/24 , H03H9/125
CPC分类号： H03H9/02244 , G04C3/12 , G04F5/063 , H03B5/30 , H03H3/0072 , H03H9/02433 , H03H9/02448 , H03H9/2431
摘要： Embodiments are related to micro-electromechanical system (MEMS) devices, systems and methods. In one embodiment, a MEMS resonating device comprises a resonator element configured to provide timing; and at least one passive temperature compensation structure arranged on the resonator element.
摘要翻译：实施例涉及微机电系统（MEMS）装置，系统和方法。在一个实施例中，MEMS谐振装置包括被配置为提供定时的谐振元件; 以及布置在谐振器元件上的至少一个被动温度补偿结构。

4. 发明申请

US20130145720A1 MOUNTING RAIL 有权
标题翻译：安装轨
公开(公告)号：US20130145720A1
公开(公告)日：2013-06-13
申请号：US13695223
申请日：2011-01-12
申请人： Markus Heudorfer , Bernhard Sander , Holger Basche , Denis Novokshanov , Bernhard Winkler
发明人： Markus Heudorfer , Bernhard Sander , Holger Basche , Denis Novokshanov , Bernhard Winkler
IPC分类号： E04B1/41
CPC分类号： E04B1/4107
摘要： In an installation channel to be embedded into a curable construction material, e.g. concrete, having a support profile and preferably an attachment for attaching at least one add-on part to the installation channel, so that the outside of the support profile has a direct connection to the curable construction material at an embedding area, a potential fault block should be large so that large forces can be absorbed by the installation channel.A compressible insert is fastened to the outside of the support profile at the embedding area, so that part of the outside of the support profile is not in direct contact with the curable construction material at the embedding area.
摘要翻译：在嵌入可固化结构材料的安装通道中，例如，混凝土，具有支撑轮廓并且优选地用于将至少一个附加部件附接到安装通道的附件，使得支撑轮廓的外部在嵌入区域处具有与可固化结构材料的直接连接，潜在的故障块应大，使安装通道可以吸收较大的力。可压缩插入件在嵌入区域处紧固到支撑轮廓的外侧，使得支撑轮廓的外部的一部分在嵌入区域处不与可固化构造材料直接接触。

5. 发明授权

US08198690B2 MEMS devices and methods of manufacture thereof 有权
标题翻译： MEMS器件及其制造方法
公开(公告)号：US08198690B2
公开(公告)日：2012-06-12
申请号：US12853814
申请日：2010-08-10
申请人： Florian Schoen , Wolfgang Raberg , Bernhard Winkler , Werner Weber
发明人： Florian Schoen , Wolfgang Raberg , Bernhard Winkler , Werner Weber
IPC分类号： H01L29/84
CPC分类号： B81C1/00182 , B81B2201/0271 , H01L41/0933 , Y10S977/732
摘要： Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
摘要翻译：公开了微机电系统（MEMS）装置及其制造方法。在一个实施例中，MEMS器件包括第一半导体材料和设置在第一半导体材料中的至少一个沟槽，所述至少一个沟槽具有侧壁。绝缘材料层设置在第一半导体材料中的至少一个沟槽的侧壁的上部上方，以及靠近侧壁的第一半导体材料的顶表面的一部分之上。第二半导体材料或导电材料设置在至少一个沟槽内，并且至少在绝缘材料层的上方设置在靠近侧壁的第一半导体材料的顶表面的部分之上。

6. 发明授权

US08040207B2 MEMS resonator devices with a plurality of mass elements formed thereon 有权
标题翻译：具有形成在其上的多个质量元件的MEMS谐振器装置
公开(公告)号：US08040207B2
公开(公告)日：2011-10-18
申请号：US12354029
申请日：2009-01-15
申请人： Bernhard Winkler , Mohsin Nawaz , Florian Schoen
发明人： Bernhard Winkler , Mohsin Nawaz , Florian Schoen
IPC分类号： H03H9/24 , H03H9/125
CPC分类号： H03H9/02244 , G04C3/12 , G04F5/063 , H03B5/30 , H03H3/0072 , H03H9/02433 , H03H9/02448 , H03H9/2431
摘要： The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element having a circumference, an anchor region, and a plurality of beam elements coupling the anchor region and the resonator element. Further embodiments comprise additional devices, systems and methods.
摘要翻译：本发明涉及MEMS装置。在一个实施例中，微机电系统（MEMS）装置包括具有圆周，锚定区域和耦合锚定区域和谐振器元件的多个梁元件的谐振元件。另外的实施例包括附加的装置，系统和方法。

7. 发明申请

US20100301434A1 MEMS Devices and Methods of Manufacture Thereof 有权
标题翻译： MEMS器件及其制造方法
公开(公告)号：US20100301434A1
公开(公告)日：2010-12-02
申请号：US12853814
申请日：2010-08-10
申请人： Florian Schoen , Wolfgang Raberg , Bernhard Winkler , Werner Weber
发明人： Florian Schoen , Wolfgang Raberg , Bernhard Winkler , Werner Weber
IPC分类号： H01L29/84 , H01L21/30
CPC分类号： B81C1/00182 , B81B2201/0271 , H01L41/0933 , Y10S977/732
摘要： Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
摘要翻译：公开了微机电系统（MEMS）装置及其制造方法。在一个实施例中，MEMS器件包括第一半导体材料和设置在第一半导体材料中的至少一个沟槽，所述至少一个沟槽具有侧壁。绝缘材料层设置在第一半导体材料中的至少一个沟槽的侧壁的上部上方，以及靠近侧壁的第一半导体材料的顶表面的一部分之上。第二半导体材料或导电材料设置在至少一个沟槽内，并且至少在绝缘材料层的上方设置在靠近侧壁的第一半导体材料的顶表面的部分之上。

8. 发明申请

US20100176897A1 MEMS RESONATOR DEVICES 有权
标题翻译： MEMS谐振器器件
公开(公告)号：US20100176897A1
公开(公告)日：2010-07-15
申请号：US12354029
申请日：2009-01-15
申请人： Bernhard WINKLER , Mohsin NAWAZ , Florian SCHOEN
发明人： Bernhard WINKLER , Mohsin NAWAZ , Florian SCHOEN
IPC分类号： H03H9/24 , H03H9/46
CPC分类号： H03H9/02244 , G04C3/12 , G04F5/063 , H03B5/30 , H03H3/0072 , H03H9/02433 , H03H9/02448 , H03H9/2431
摘要： The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element having a circumference, an anchor region, and a plurality of beam elements coupling the anchor region and the resonator element. Further embodiments comprise additional devices, systems and methods.
摘要翻译：本发明涉及MEMS装置。在一个实施例中，微机电系统（MEMS）装置包括具有圆周，锚定区域和耦合锚定区域和谐振器元件的多个梁元件的谐振元件。另外的实施例包括附加的装置，系统和方法。

9. 发明授权

US07679151B2 Micromechanical device and method for manufacturing a micromechanical device 失效
标题翻译：微机械装置及其制造方法
公开(公告)号：US07679151B2
公开(公告)日：2010-03-16
申请号：US11668743
申请日：2007-01-30
申请人： Karlheinz Mueller , Bernhard Winkler
发明人： Karlheinz Mueller , Bernhard Winkler
IPC分类号： H01L29/06
CPC分类号： B81C1/00246 , B81B2203/0127 , B81B2203/0315 , B81C2203/075
摘要： In a method for manufacturing a micromechanical device having a region for forming an integrated circuit, at first a first layer is produced on a deeper-lying part in the substrate. Subsequently, a membrane layer is produced on the first layer and at least one channel completely penetrating the membrane layer is introduced in the membrane layer. After that, a region of the first layer below the membrane layer is removed to form a cavity. Finally, the channel is sealed and a planar surface is formed.
摘要翻译：在具有用于形成集成电路的区域的微机械器件的制造方法中，首先在衬底的较深的部分产生第一层。随后，在第一层上产生膜层，并且将完全穿透膜层的至少一个通道引入膜层。之后，去除膜层下面的第一层的区域以形成空腔。最后，通道密封并形成平面。

10. 发明申请

US20100032789A1 PASSIVE TEMPERATURE COMPENSATION OF SILICON MEMS DEVICES 有权
标题翻译：硅MEMS器件的被动温度补偿
公开(公告)号：US20100032789A1
公开(公告)日：2010-02-11
申请号：US12187443
申请日：2008-08-07
申请人： Florian Schoen , Robert Gruenberger , Mohsin Nawaz , Bernhard Winkler
发明人： Florian Schoen , Robert Gruenberger , Mohsin Nawaz , Bernhard Winkler
IPC分类号： H01L23/34 , H01L21/52
CPC分类号： B81B3/007 , B81B3/0081 , B81B2201/0271 , B81B2203/0118 , H01L2924/0002 , H03H3/0076 , H03H9/2431 , H03H9/2452 , H03H9/2457 , H03H9/2463 , H01L2924/00
摘要： The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element comprising a semiconducting material, and at least one trench formed in the resonator element and filled with a material comprising oxide. Further embodiments comprise additional devices, systems and methods.
摘要翻译：本发明涉及MEMS装置。在一个实施例中，微机电系统（MEMS）装置包括包括半导体材料的谐振元件和形成在谐振器元件中并填充有包含氧化物的材料的至少一个沟槽。另外的实施例包括附加的装置，系统和方法。

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