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    • 3. 发明申请
    • SUPPORT OF SHORT MESSAGE SERVICE IN IMS WITHOUT MSISDN
    • 在MSISDN中支持IMS中的短消息服务
    • US20140155112A1
    • 2014-06-05
    • US14131217
    • 2011-07-05
    • Attila MolnarAndras Pasztor
    • Attila MolnarAndras Pasztor
    • H04W4/14
    • H04W4/14H04L51/066H04L51/14H04L51/38H04L65/1006H04L65/1016H04L65/103H04L65/104H04W4/12H04W4/16H04W88/16
    • The application relates to Short Message Service SMS in IMS. The relevant standard is 3GPP TR 23.863. According to current standardised procedures, a UE in an originating network can submit an encapsulated SMS to an S-CSCF which forwards it to an IP-SM-GW in the originating network. The IP-SM-GW can extract the SMS and forward it to an SMS-SC. The SMS-SC can forward the SMS to an SMS-GMSC in the terminating network which delivers it to an IP-SM-GW in the terminating network. The can use the telephone uniform resource identifier associated with the IMSI of the message received for the target UE to send the short message encapsulated in the appropriate SIP method towards an S-CSCF which forwards it to the target UE. If the target UE is available via IMS forwarding via the SMS-SC is unnecessary. Therefore, the present application proposes to deliver a SIP message (S16) with encapsulated SMS content from the IP-SM-GW (300) in the originating network directly to an IP-SM-GW (500) in the terminating network without the usage of the SMS-SC.
    • 该应用涉及IMS中的短消息业务SMS。 相关标准是3GPP TR 23.863。 根据当前的标准化程序,始发网络中的UE可以将封装的SMS提交给S-CSCF,S-CSCF将其转发到始发网络中的IP-SM-GW。 IP-SM-GW可以提取SMS并将其转发到SMS-SC。 SMS-SC可以将SMS转发到终接网络中的SMS-GMSC,将终端网络传递到终端网络中的IP-SM-GW。 可以使用与针对目标UE接收的消息的IMSI相关联的电话统一资源标识符,将以适当的SIP方法封装的短消息发送到将其转发给目标UE的S-CSCF。 如果目标UE通过经由SMS-SC的IMS转发可用是不必要的。 因此,本申请提出将来自始发网络中的IP-SM-GW(300)的封装SMS内容的SIP消息(S16)直接传递到终止网络中的IP-SM-GW(500),而不使用 的SMS-SC。
    • 5. 发明授权
    • Conductive fluoropolymers
    • 导电氟聚合物
    • US06827881B2
    • 2004-12-07
    • US10293686
    • 2002-11-13
    • Attila MolnarSteven R. ParsonsThomas J. Blong
    • Attila MolnarSteven R. ParsonsThomas J. Blong
    • H01B124
    • H01B1/24C08F214/18C08L23/04C08L23/10C08L27/18C08L2666/04
    • The invention provides a melt-processable conductive fluorothermoplastic composition comprising three components. The first component is at least one melt-processable, thermoplastic fluoropolymer component having its interpolymerized units derived from (i) at least 50 wt % of TFE, and (ii) one or more ethylenically-unsaturated monomers represented by the formulas (a) CF2═CF—Rf, (b) CF2═CF—O—Rf′, and (c) CH2═CR2, wherein Rf is a perfluoroalkyl of 1 to 8 carbon atoms, Rf′ is Rf or a perfluoroalkoxy of 1 to 8 carbon atoms, and R is selected from H, F, Cl, or an aliphatic group having from 1 to 8 carbon atoms which may have F or Cl substituents. The thermoplastic fluoropolymer component is substantially free of interpolymerized units derived from VDF. The second component is from about 0.1 to about 10 weight percent of a hydrocarbon polymer, and the third component is from about 1 to about 20 weight percent of conductive filler. The invention also provides a method for making fluorothermoplastic compositions and shaped articles comprising a conductive fluorothermoplastic composition.
    • 本发明提供了包含三种组分的可熔融加工的导电性氟热塑性组合物。 第一组分是至少一种可熔融加工的热塑性含氟聚合物组分,其具有衍生自(i)至少50重量%的TFE的共聚单元,和(ii)由式(a)CF 2表示的一种或多种烯键式不饱和单体 = CF-Rf,(b)CF 2 = CF-O-Rf'和(c)CH 2 = CR 2,其中Rf是1至8个碳原子的全氟烷基,Rf'是Rf或1至8个碳原子的全氟烷氧基 并且R选自H,F,Cl或具有1至8个碳原子的可具有F或Cl取代基的脂族基团。 热塑性含氟聚合物组分基本上不含衍生自VDF的共聚单元。 第二组分为约0.1至约10重量%的烃聚合物,第三组分为约1至约20重量%的导电填料。 本发明还提供了制备含氟热塑性组合物的方法和包含导电性氟热塑性组合物的成型制品。