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    • 4. 发明授权
    • Systems, circuits and methods for extending the detection range of an inspection system by avoiding circuit saturation
    • 通过避免电路饱和来延长检查系统的检测范围的系统,电路和方法
    • US07423250B2
    • 2008-09-09
    • US11181237
    • 2005-07-14
    • Christian H. WoltersAnatoly RomanovskyAlexander Slobodov
    • Christian H. WoltersAnatoly RomanovskyAlexander Slobodov
    • H03F3/08
    • H03F3/08
    • Inspection systems, circuits and methods are provided to enhance defect detection by addressing saturation levels of the amplifier and analog-digital circuitry as a limiting factor of the measurement detection range of an inspection system. In accordance with one embodiment of the invention, a method for inspecting a specimen includes directing light to the specimen and detecting light scattered from the specimen. However, the step of detecting may use only one photodetector for detecting the light scattered from the specimen and for converting the light into an electrical signal. The step of detecting also includes generating a first signal and a second signal in response to the electrical signal, where the second signal differs from the first. For example, the first signal may be generated to have a higher resolution than the second signal for detecting substantially lower levels of the scattered light. In most cases, the method may use the first signal for detecting features, defects or light scattering properties of the specimen until the first signal reaches a predetermined threshold value. Once the predetermined threshold value is reached, however, the method may use the second signal for said detecting.
    • 提供了检查系统,电路和方法,以通过解决放大器和模拟数字电路的饱和电平作为检查系统的测量检测范围的限制因素来增强缺陷检测。 根据本发明的一个实施例,用于检查样本的方法包括将光引导到样本并检测从样本散射的光。 然而,检测步骤可以仅使用一个光电检测器来检测从样本散射的光并将光转换成电信号。 检测步骤还包括响应于电信号产生第一信号和第二信号,其中第二信号与第一信号不同。 例如,可以产生第一信号以具有比用于检测基本上较低级别的散射光的第二信号更高的分辨率。 在大多数情况下,该方法可以使用第一信号来检测样本的特征,缺陷或光散射性质,直到第一信号达到预定阈值。 然而,一旦达到预定阈值,该方法可以使用第二信号进行所述检测。
    • 5. 发明授权
    • Extended defect sizing range for wafer inspection
    • 晶圆检查扩展缺陷尺寸范围
    • US09091666B2
    • 2015-07-28
    • US13369294
    • 2012-02-09
    • Zhongping CaiYury YuditskyAnatoly RomanovskyAlexander Slobodov
    • Zhongping CaiYury YuditskyAnatoly RomanovskyAlexander Slobodov
    • G01N21/88G01N21/95
    • G01N21/9501
    • Various embodiments for extended defect sizing range for wafer inspection are provided. One inspection system includes an illumination subsystem configured to direct light to the wafer. The system also includes an image sensor configured to detect light scattered from wafer defects and to generate output responsive to the scattered light. The image sensor is also configured to not have an anti-blooming feature such that when a pixel in the image sensor reaches full well capacity, excess charge flows from the pixel to one or more neighboring pixels in the image sensor. The system further includes a computer subsystem configured to detect the defects on the wafer using the output and to determine a size of the defects on the wafer using the output generated by a pixel and any neighboring pixels of the pixel to which the excess charge flows.
    • 提供了用于晶片检查的扩展缺陷尺寸范围的各种实施例。 一个检查系统包括配置成将光引导到晶片的照明子系统。 该系统还包括图像传感器,其被配置为检测从晶片缺陷散射的光并且响应于散射光产生输出。 图像传感器还被配置为不具有防喷射特征,使得当图像传感器中的像素达到满井容量时,过量电荷从图像传感器中的像素流向一个或多个相邻像素。 该系统还包括被配置为使用输出来检测晶片上的缺陷的计算机子系统,并且使用由像素和多余电荷流过的像素的任何相邻像素产生的输出来确定晶片上的缺陷的尺寸。
    • 8. 发明授权
    • Systems, circuits and methods for reducing thermal damage and extending the detection range of an inspection system
    • 用于减少热损伤并延长检查系统检测范围的系统,电路和方法
    • US07436508B2
    • 2008-10-14
    • US11181228
    • 2005-07-14
    • Christian H. WoltersAnatoly Romanovsky
    • Christian H. WoltersAnatoly Romanovsky
    • G01N21/00
    • G01N21/47G01N21/21G01N21/9501G01N21/95607
    • Inspection systems, circuits, and methods are provided to enhance defect detection by reducing thermal damage to large particles by dynamically altering the incident laser beam power level supplied to the specimen during a surface inspection scan. In one embodiment, an inspection system includes an illumination subsystem for directing light to a specimen at a first power level, a detection subsystem for detecting light scattered from the specimen, and a power attenuator subsystem for dynamically altering the power level directed to the specimen based on the scattered light detected from the specimen. For example, the power attenuator subsystem may reduce the directed light to a second power level, which is lower than the first, if the detected scattered light exceeds a predetermined threshold level. In addition reducing thermal damage, the systems and methods described herein may be used to extend the measurement detection range of an inspection system by providing a variable-power inspection system.
    • 提供检查系统,电路和方法以通过在表面检查扫描期间动态地改变提供给样本的入射激光束功率水平来减小对大颗粒的热损伤来增强缺陷检测。 在一个实施例中,检查系统包括用于将光引导到第一功率级的样本的照明子系统,用于检测从样本散射的光的检测子系统和用于动态地改变针对标本的功率水平的功率衰减器子系统 对从样品检测到的散射光。 例如,如果检测到的散射光超过预定的阈值电平,则功率衰减器子系统可以将定向光减少到低于第一功率电平的第二功率电平。 此外,减少热损伤,本文所述的系统和方法可以用于通过提供可变功率检查系统来扩展检查系统的测量检测范围。