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    • 1. 发明授权
    • Parallel, adaptive delta sigma ADC
    • 并行,自适应Δ西格玛ADC
    • US07193544B1
    • 2007-03-20
    • US11220712
    • 2005-09-08
    • Michael M. FitelsonAaron PesetskiAlfred P. Turley
    • Michael M. FitelsonAaron PesetskiAlfred P. Turley
    • H03M3/00
    • H03M3/396H03M3/388H03M3/468
    • An apparatus performs adaptive analog-to-digital conversion. The apparatus according to one embodiment comprises a frequency modulator unit for changing an input analog signal into a modulated analog signal with a frequency spectrum in a bandwidth of interest, a parallel delta sigma conversion unit operatively connected to the frequency modulator unit, the parallel delta sigma conversion unit converting the modulated analog signal into a digital signal, and a controller operatively connected to the frequency modulator unit and the parallel delta sigma conversion unit, the controller adjusting at least one parameter relating to a frequency characteristic of the frequency modulator unit and/or the parallel delta sigma conversion unit.
    • 一种装置执行自适应模数转换。 根据一个实施例的装置包括:频率调制器单元,用于将输入的模拟信号改变成具有感兴趣带宽中的频谱的经调制的模拟信号,可操作地连接到频率调制器单元的并行ΔΣ转换单元,并行Δ西格玛 转换单元将调制的模拟信号转换为数字信号,以及可操作地连接到频率调制器单元和并行ΔΣ转换单元的控制器,所述控制器调整与频率调制器单元的频率特性相关的至少一个参数和/或 并行ΔΣ转换单元。
    • 3. 发明授权
    • Process for forming a component insulator on a silicon substrate
    • 在硅衬底上形成部件绝缘体的工艺
    • US5110755A
    • 1992-05-05
    • US460703
    • 1990-01-04
    • Li-Shu ChenRathindra N. GhoshtagoreAlfred P. TurleyLouis A. Yannone
    • Li-Shu ChenRathindra N. GhoshtagoreAlfred P. TurleyLouis A. Yannone
    • H01L21/306H01L21/762
    • H01L21/76264H01L21/306H01L21/7627
    • A process for forming an insulating layer of silicon dioxide in a silicon substrate that surrounds and electrically insulates a semiconductor device is disclosed herein. The process comprises the steps of forming a recess on the outer surface of the silicon substrate that encompasses the site of the semiconductor device by photo-resist patterned reactive ion etching, and then removing silicon on the surface of the resulting recess whose crystal structure has been damaged by the reactive ion etching. Next, dopant atoms are selectively deposited on the surface of the recess so that the surface of the recess might be rendered into a porous layer of silicon when immersed in hydrogen fluoride and subjected to an electrical current. Prior to the porousification step, silicon is epitaxially grown within the walls of the recess to form the site for a semiconductor device. The substrate is then immersed in hydrogen fluoride while a current is conducted through it in order to porousify the silicon between the device island and the rest of the substrate. Finally, the substrate is thermally oxidized in order to render the porous layer of silicon into a insulating layer of silicon dioxide. The provision of such individual insulating layers around each of the devices on the substrate allows the manufacture of a high density and radiation hard semiconductor array that is not susceptible to electrical current leakage between components.
    • 本文公开了一种在半导体器件中包围并电绝缘的硅衬底中形成二氧化硅绝缘层的工艺。 该方法包括以下步骤:在硅衬底的外表面上形成通过光致抗蚀剂图案化反应离子蚀刻包围半导体器件的位置的凹槽,然后在晶体结构已经形成的凹槽的表面上除去硅 被反应离子蚀刻损坏。 接下来,掺杂剂原子被选择性地沉积在凹部的表面上,使得当浸入氟化氢中并且经受电流时,凹槽的表面可能变成多孔硅层。 在多孔化步骤之前,在凹槽的壁内外延生长硅以形成半导体器件的部位。 然后将衬底浸入氟化氢中,同时通过电流进行电流以使器件岛和衬底的其余部分之间的硅多孔化。 最后,将基底热氧化,以使硅的多孔层成为二氧化硅的绝缘层。 在衬底上的每个器件周围提供这些单独的绝缘层允许制造不易受组件之间的电流泄漏敏感的高密度和辐射硬的半导体阵列。