会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 83. 发明申请
    • TEMPERATURE CONTROLLING CRYOGENIC PACKAGE SYSTEM
    • 温度控制低温包装系统
    • WO1996021129A1
    • 1996-07-11
    • PCT/US1995016921
    • 1995-12-26
    • SUPERCONDUCTOR TECHNOLOGIES, INC.
    • SUPERCONDUCTOR TECHNOLOGIES, INC.ROHLFING, Stephan, M.FORSE, Roger, J.SCHAREN, Michael, J.KUNIMOTO, Wallace
    • F25B29/00
    • G05D23/1912H01L39/04H01L2924/0002H01L2924/00
    • A temperature controlled cryogenic package system (6) for efficiently and precisely monitoring and controlling the operating temperature of a high temperature superconductor circuit (10) placed on a substrate (8). The cryogenic package system (6) comprises a heating element (22) formed on the same substrate (8), a control circuit (24) capable of activating and deactivating the heating element (22), and a temperature sensor (38) placed in thermal proximity to the high temperature superconductor circuit (10). The temperature sensor (38) monitors the operating temperature of the high temperature superconductor circuit (10), and conveys temperature information to the control circuit (24). The control circuit (24) activates or deactivates the heating element (22) according to the warming or cooling effect that is necessary in order to maintain the high temperature superconductor circuit (10) within a predetermined temperature range, where the range of temperature fluctuation is within plus or minus 0.1 K of a predetermined temperature.
    • 一种温度控制低温封装系统(6),用于有效且精确地监测和控制放置在基板(8)上的高温超导体电路(10)的工作温度。 低温包装系统(6)包括形成在同一基板(8)上的加热元件(22),能够激活和去激活加热元件(22)的控制电路(24)和置于 热接近高温超导体电路(10)。 温度传感器(38)监视高温超导体电路(10)的工作温度,并将温度信息传送给控制电路(24)。 控制电路(24)根据为了将高温超导体电路(10)保持在预定的温度范围所需要的升温或冷却效果而激活或去激活加热元件(22),其中温度波动范围为 在正负0.1K的预定温度下。
    • 84. 发明公开
    • METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS
    • 生产超导层衬底的方法
    • EP3072167A1
    • 2016-09-28
    • EP14802590.1
    • 2014-11-20
    • Danmarks Tekniske Universitet
    • WULFF, Anders Christian
    • H01L39/24
    • H01B12/10C25D3/12C25D3/38C25D5/022C25D5/12C25D5/14C25D5/40C25D5/48C25F3/02H01B12/06H01B13/0009H01B13/008H01L39/04H01L39/126H01L39/248
    • There is provided a method for producing a substrate suitable for supporting an elongated superconducting element, wherein one or more elongated strips of masking material are placed on a solid element (202) so as to form one or more exposed elongated areas being delimited on one or two sides by elongated strip of masking material, and placing filling material on the solid element so that each exposed elongated area within the one or more exposed elongated areas is covered by a portion of filling material (318a-c) where each portion of filling material also covers at least a portion of the adjacent elongated strip of masking material and subsequently removing the one or more elongated strips of masking material so as to form one or more corresponding undercut volumes, where each undercut volume within the one or more undercut volumes is formed along a portion of filling material and between the portion of filling material and the solid element. The method may further comprise placing buffer material (640) and or superconducting material (642, 644, 646)) on the substrate, so as to provide a superconducting structure (601) with reduced AC losses.
    • 提供了一种用于制造适于支撑细长超导元件的基板的方法,其中一个或多个细长遮蔽材料条被放置在实体元件(202)上以形成一个或多个暴露细长区域, 两侧由细长的掩蔽材料条带覆盖,并且将填充材料放置在固体元件上,使得一个或多个暴露的细长区域内的每个暴露的细长区域被部分填充材料(318a-c)覆盖,其中填充材料 还覆盖相邻的细长遮蔽材料带的至少一部分,随后移除一个或多个细长遮蔽材料带以形成一个或多个对应的底切体积,其中形成一个或多个底切体积内的每个底切体积 沿着一部分填充材料以及在填充材料部分和固体元件之间。 该方法可以进一步包括在衬底上放置缓冲材料(640)和/或超导材料(642,644,646)),以提供具有降低的AC损耗的超导结构(601)。