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1. 发明申请

WO2015074665A1 METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS 审中-公开
标题翻译：用于生产超级层的基板的方法
公开(公告)号：WO2015074665A1
公开(公告)日：2015-05-28
申请号：PCT/DK2014/050395
申请日：2014-11-20
申请人： DANMARKS TEKNISKE UNIVERSITET
发明人： WULFF, Anders Christian
IPC分类号： H01L39/24
CPC分类号： H01B12/10 , C25D3/12 , C25D3/38 , C25D5/022 , C25D5/12 , C25D5/14 , C25D5/40 , C25D5/48 , C25F3/02 , H01B12/06 , H01B13/0009 , H01B13/008 , H01L39/04 , H01L39/126 , H01L39/248
摘要： There is provided a method for producing a substrate suitable for supporting an elongated superconducting element, wherein one or more elongated strips of masking material are placed on a solid element (202) so as to form one or more exposed elongated areas being delimited on one or two sides by elongated strip of masking material, and placing filling material on the solid element so that each exposed elongated area within the one or more exposed elongated areas is covered by a portion of filling material (318a-c) where each portion of filling material also covers at least a portion of the adjacent elongated strip of masking material and subsequently removing the one or more elongated strips of masking material so as to form one or more corresponding undercut volumes, where each undercut volume within the one or more undercut volumes is formed along a portion of filling material and between the portion of filling material and the solid element. The method may further comprise placing buffer material (640) and or superconducting material (642, 644, 646)) on the substrate, so as to provide a superconducting structure (601) with reduced AC losses.
摘要翻译：提供了一种用于制造适合于支撑细长超导元件的基底的方法，其中一个或多个细长的掩模材料条被放置在固体元件（202）上，以便形成一个或多个暴露的细长区域，两边通过细长的掩模材料带，并将填充材料放置在固体元件上，使得一个或多个暴露的细长区域内的每个暴露的细长区域被填充材料（318a-c）的一部分覆盖，其中填充材料的每一部分还覆盖相邻细长条带的至少一部分掩模材料，随后移除一个或多个细长的掩模材料条，以便形成一个或多个相应的底切体积，其中形成一个或多个底切体积内的每个底切体积沿着填充材料的一部分和填充材料的部分和固体元件之间。该方法还可以包括将缓冲材料（640）和/或超导材料（642,644,646）放置在衬底上，以便提供具有减小的AC损耗的超导结构（601）。

2. 发明申请

WO2013174380A1 METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS 审中-公开
标题翻译：用于生产超级层的基板的方法
公开(公告)号：WO2013174380A1
公开(公告)日：2013-11-28
申请号：PCT/DK2013/050148
申请日：2013-05-17
申请人： DANMARKS TEKNISKE UNIVERSITET
发明人： WULFF, Anders Christian
IPC分类号： H01L39/14 , H01L39/24
CPC分类号： H01L39/2454 , H01L39/143 , H01L39/248 , H05K1/092 , Y10T29/49014
摘要： There is provided a method for producing a substrate (600) suitable for supporting an elongated superconducting element, wherein, e.g., a deformation process is utilized in order to form disruptive strips in a layered solid element, and where etching is used to form undercut volumes (330, 332) between an upper layer (316) and a lower layer (303) of the layered solid element. Such relatively simple steps enable providing a substrate which may be turned into a superconducting structure, such as a superconducting tape, having reduced AC losses, since the undercut volumes (330, 332) may be useful for separating layers of material. In a further embodiment, there is placed a superconducting layer on top of the upper layer (316) and/or lower layer (303), so as to provide a superconducting structure with reduced AC losses.
摘要翻译：提供了一种用于制造适合于支撑细长超导元件的基底（600）的方法，其中例如使用变形过程以在层状固体元件中形成破坏性条带，并且其中使用蚀刻来形成底切体积（330,332）在层状固体元件的上层（316）和下层（303）之间。这种相对简单的步骤使得能够提供可以变成具有减小的AC损耗的超导结构（例如超导带）的衬底，因为底切体积（330,332）可用于分离材料层。在另一个实施例中，在上层（316）和/或下层（303）的顶部设置超导层，以便提供具有减小的AC损耗的超导结构。

3. 发明公开

EP3072167A1 METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS 审中-公开
标题翻译：生产超导层衬底的方法
公开(公告)号：EP3072167A1
公开(公告)日：2016-09-28
申请号：EP14802590.1
申请日：2014-11-20
申请人： Danmarks Tekniske Universitet
发明人： WULFF, Anders Christian
IPC分类号： H01L39/24
CPC分类号： H01B12/10 , C25D3/12 , C25D3/38 , C25D5/022 , C25D5/12 , C25D5/14 , C25D5/40 , C25D5/48 , C25F3/02 , H01B12/06 , H01B13/0009 , H01B13/008 , H01L39/04 , H01L39/126 , H01L39/248
摘要： There is provided a method for producing a substrate suitable for supporting an elongated superconducting element, wherein one or more elongated strips of masking material are placed on a solid element (202) so as to form one or more exposed elongated areas being delimited on one or two sides by elongated strip of masking material, and placing filling material on the solid element so that each exposed elongated area within the one or more exposed elongated areas is covered by a portion of filling material (318a-c) where each portion of filling material also covers at least a portion of the adjacent elongated strip of masking material and subsequently removing the one or more elongated strips of masking material so as to form one or more corresponding undercut volumes, where each undercut volume within the one or more undercut volumes is formed along a portion of filling material and between the portion of filling material and the solid element. The method may further comprise placing buffer material (640) and or superconducting material (642, 644, 646)) on the substrate, so as to provide a superconducting structure (601) with reduced AC losses.
摘要翻译：提供了一种用于制造适于支撑细长超导元件的基板的方法，其中一个或多个细长遮蔽材料条被放置在实体元件（202）上以形成一个或多个暴露细长区域，两侧由细长的掩蔽材料条带覆盖，并且将填充材料放置在固体元件上，使得一个或多个暴露的细长区域内的每个暴露的细长区域被部分填充材料（318a-c）覆盖，其中填充材料还覆盖相邻的细长遮蔽材料带的至少一部分，随后移除一个或多个细长遮蔽材料带以形成一个或多个对应的底切体积，其中形成一个或多个底切体积内的每个底切体积沿着一部分填充材料以及在填充材料部分和固体元件之间。该方法可以进一步包括在衬底上放置缓冲材料（640）和/或超导材料（642,644,646）），以提供具有降低的AC损耗的超导结构（601）。

4. 发明授权

EP2852987B1 METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS 有权
标题翻译：用于生产基板超导体层
公开(公告)号：EP2852987B1
公开(公告)日：2016-05-04
申请号：EP13725267.2
申请日：2013-05-17
申请人： Danmarks Tekniske Universitet
发明人： WULFF, Anders Christian
IPC分类号： H01L39/14 , H01L39/24
CPC分类号： H01L39/2454 , H01L39/143 , H01L39/248 , H05K1/092 , Y10T29/49014

5. 发明公开

EP2852987A1 METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS 有权
标题翻译：用于生产基板超导体层
公开(公告)号：EP2852987A1
公开(公告)日：2015-04-01
申请号：EP13725267.2
申请日：2013-05-17
申请人： Danmarks Tekniske Universitet
发明人： WULFF, Anders Christian
IPC分类号： H01L39/14 , H01L39/24
CPC分类号： H01L39/2454 , H01L39/143 , H01L39/248 , H05K1/092 , Y10T29/49014
摘要： There is provided a method for producing a substrate (600) suitable for supporting an elongated superconducting element, wherein, e.g., a deformation process is utilized in order to form disruptive strips in a layered solid element, and where etching is used to form undercut volumes (330, 332) between an upper layer (316) and a lower layer (303) of the layered solid element. Such relatively simple steps enable providing a substrate which may be turned into a superconducting structure, such as a superconducting tape, having reduced AC losses, since the undercut volumes (330, 332) may be useful for separating layers of material. In a further embodiment, there is placed a superconducting layer on top of the upper layer (316) and/or lower layer (303), so as to provide a superconducting structure with reduced AC losses.

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