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    • 3. 发明申请
    • CRYOCABLE
    • 低温电缆
    • WO1995028750A1
    • 1995-10-26
    • PCT/US1995003993
    • 1995-03-31
    • SUPERCONDUCTOR TECHNOLOGIES, INC.
    • SUPERCONDUCTOR TECHNOLOGIES, INC.HEY-SHIPTON, Gregory, LyntonKUNIMOTO, Wallace, YoshitoSCHAREN, Michael, JamesROHLFING, Stephan, MichaelKAPOLNEK, David, J.
    • H01R04/68
    • H01R4/68H01P5/085
    • An electrical interconnect provides a path between cryogenic or cryocooled circuitry and ambient temperatures. As a system, a cryocable (10) is combined with a trough-line contact or transition (20). In the preferred embodiment, the cryocable (10) comprises a conductor (11) disposed adjacent an insulator (12) which is in turn disposed adjacent another conductor (13). The components are sized so as to balance heat load through the cryocable (10) with the insertion loss. In the most preferred embodiment, a coaxial cryocable (10) has a center conductor (11) surrounded by a dielectric (12) (e.g. Teflon ) surrounded by an outer conductor (13) which has a thickness between about 6 and 20 microns. The heat load is preferably less than one Watt, and most preferably less than one tenth of a Watt, with an insertion loss less than one decibel. In another aspect of the invention, a trough-line contact or transition (20) is provided in which the center conductor (11) is partially enveloped by dielectric (12) to form a relatively flat portion (28). The preferred overall geometry of the preferred embodiment of the cable is generally cylindrical, although other geometries are possible (e.g. stripline, microstrip, coplanar or slotline geometries).
    • 电互连提供了低温或低温冷却电路与环境温度之间的路径。 作为系统,可冷冻(10)与槽线接触或过渡(20)组合。 在优选实施例中,可冷冻(10)包括邻近绝缘体(12)设置的导体(11),所述导体(11)又邻近另一个导体(13)设置。 这些部件的大小可以平衡通过可冷冻(10)的热负荷与插入损耗。 在最优选的实施例中,同轴可冷冻(10)具有由外部导体(13)围绕的电介质(12)(例如Teflon TM)围绕的中心导体(11),外导体(13)的厚度为约6至20 微米。 热负荷优选小于1瓦特,最优选小于瓦特的十分之一,插入损耗小于1分贝。 在本发明的另一方面,提供了一种槽线接触或过渡(20),其中中心导体(11)被电介质(12)部分地包围以形成相对平坦的部分(28)。 电缆的优选实施例的优选整体几何形状通常为圆柱形,尽管其他几何形状是可能的(例如,带状线,微带,共面或槽线几何形状)。
    • 6. 发明申请
    • LOW NOISE AMPLIFIER
    • 低噪音放大器
    • WO1994023470A1
    • 1994-10-13
    • PCT/US1994003113
    • 1994-03-23
    • SUPERCONDUCTOR TECHNOLOGIES, INC.
    • SUPERCONDUCTOR TECHNOLOGIES, INC.FENZI, Neal, O.LONG, Stephen, I.
    • H01Q01/26
    • H01Q1/364H01Q1/26H01Q23/00
    • A detector for electromagnetic radiation includes a high Q, low loss antenna (56, 58) and a low noise amplifier (66) requiring a high input impedance. In the preferred embodiment, the antenna comprises a low resistance (58), superconductive coil (56). The antenna forms a resonant circuit with a low loss capacitor (64), optionally a capacitor including superconductors. The output of the resonant circuit is provided as input to the semiconductor amplifier. In the preferred embodiment, junction FETs, preferably arranged in a cascode pair, are included in the semiconductor amplifier. In one aspect of the invention, feedback is provided from the output of the amplifier to its input. Effective loading of the antenna results, lowering the Q of the antenna, and broadening the bandwidth of the detector. Optimum matching of the antenna to the noise factor of the amplifier is achieved.
    • 用于电磁辐射的检测器包括需要高输入阻抗的高Q低损耗天线(56,58)和低噪声放大器(66)。 在优选实施例中,天线包括低电阻(58),超导线圈(56)。 天线形成具有低损耗电容器(64)的谐振电路,可选地,包括超导体的电容器。 谐振电路的输出作为输入提供给半导体放大器。 在优选实施例中,优选地以共源共栅对布置的结FET被包括在半导体放大器中。 在本发明的一个方面,从放大器的输出到其输入端提供反馈。 天线的有效载荷会降低天线的Q值,并增加探测器的带宽。 实现了天线与放大器噪声系数的最佳匹配。
    • 9. 发明申请
    • THIN FILM SUPERCONDUCTOR-INSULATOR-SUPERCONDUCTOR MULTI-LAYER FILMS AND METHOD FOR OBTAINING THE SAME
    • 薄膜超级电容器 - 绝缘体 - 超导体多层薄膜及其制造方法
    • WO1998018139A1
    • 1998-04-30
    • PCT/US1997018666
    • 1997-10-16
    • SUPERCONDUCTOR TECHNOLOGIES, INC.
    • SUPERCONDUCTOR TECHNOLOGIES, INC.RAO, Muralidhar, R.
    • H01B12/00
    • H01L39/2422Y10S428/93Y10S505/701Y10S505/741Y10S505/742
    • A high temperature superconductor (HTS) tri-layer structure (20) and a method for providing the same are described. Preferably two dimensional growth for all layers is provided resulting in smooth surfaces and highly crystalline layers. Full oxygenation of HTS under-layer(s) (24) is provided despite having thick intervening dielectric mid-layer (26). HTS over- and under-layers (28, 24) are preferably structurally and electrically similar and have high crystallinity, the HTS layers have high Tc (e.g. > 90 K) comparable to Tc of single layer superconductor layers and a high Jc (e.g. > 1,000,000 A/(cm x cm)), the tri-layer properties do not significantly degrade as the thickness of the layers is increased, and the dielectric mid-layer (26) has high resistivity and is substantially pin-hole free. The HTS tri-layer structure (20) of the present invention is achieved by using a capping-layer (25) to protect the HTS under-layer (24), by conducting an oxygen anneal to fully oxygenate the HTS layers, and/or by thermally matching the substrate (22) to the other layers (e.g. by using buffer layers (23) to overcome lattice mismatch problems). The present invention also provides an improved HTS capacitor having low loss at microwave frequencies and having a smaller size and/or greater capacitance per area unit when compared to conventional HTS capacitors.
    • 描述了高温超导体(HTS)三层结构(20)及其提供方法。 优选地,提供所有层的二维生长,得到光滑表面和高度结晶的层。 提供了HTS底层(24)的全氧合,尽管具有厚的中间介电中间层(26)。 HTS层和底层(28,24)优选在结构和电学上相似并且具有高结晶度,HTS层具有与单层超导体层的Tc相当的高Tc(例如> 90K)和高Jc(例如> 1,000,000A /(cm×cm)),三层性能随着层的厚度增加而不显着降低,并且电介质中间层(26)具有高电阻率并且基本上无针孔。 本发明的HTS三层结构(20)通过使用覆盖层(25)来保护HTS底层(24),通过进行氧退火以使HTS层完全充氧,和/或 通过将衬底(22)与其它层热匹配(例如通过使用缓冲层(23)来克服晶格失配问题)。 本发明还提供了一种改进的HTS电容器,其在微波频率下具有低损耗,并且与常规HTS电容器相比具有比每单位面积小的尺寸和/或更大的电容。
    • 10. 发明申请
    • METHOD AND APPARATUS FOR INCREASING POWER HANDLING CAPABILITIES OF HIGH TEMPERATURE SUPERCONDUCTING DEVICES
    • 提高高温超导装置功率处理能力的方法与装置
    • WO1996026555A1
    • 1996-08-29
    • PCT/US1996001780
    • 1996-02-07
    • SUPERCONDUCTOR TECHNOLOGIES, INC.
    • SUPERCONDUCTOR TECHNOLOGIES, INC.MATTHAEI, George, L.SCALAPINO, Douglas, J.HEY-SHIPTON, Gregory, L.
    • H01P03/08
    • H01P3/085H01P3/081
    • In a stripline transmission system (fig. 1), a center conductor (12) having edges (14) is disposed between generally planar, substantially parallel ground planes (16, 18). A first dielectric (22) supports the center conductor (12) which is disposed between the first and second ground planes (16, 18). Gap portions (20) are formed adjacent the center conductor edges (14), the gap (20) containing a dielectric having a dielectric constant lower than that of the solid dielectric (22). The dielectric in the gap (20) is preferably air or vacuum. In one embodiment (fig. 2), the gap portion (42) extends in the region laterally exterior to the center conductor edges (32) and between the ground planes (34, 36). In a microstrip embodiment (50 in fig. 3), a substrate (52) has substantially parallel first and second faces (54, 56), the first face (54) bearing a center conductor (58) having edges (64) with adjacent troughs (62) formed into the first face (54), and a ground plane (60) on the second face (56). Reduced losses and improved linearity results, thereby providing applications for components such as filters, receivers and transmitters.
    • 在带状线传输系统(图1)中,具有边缘(14)的中心导体(12)设置在大致平面的基本上平行的接地平面(16,18)之间。 第一电介质(22)支撑设置在第一和第二接地平面(16,18)之间的中心导体(12)。 间隙部分(20)邻近中心导体边缘(14)形成,间隙(20)包含介电常数低于固体电介质(22)介电常数的电介质。 间隙(20)中的电介质优选为空气或真空。 在一个实施例(图2)中,间隙部分(42)在中心导体边缘(32)的横向外部和接地平面(34,36)之间的区域中延伸。 在微带实施例(图3中的50)中,衬底(52)具有基本上平行的第一和第二面(54,56),第一面(54)承载具有边缘(64)的中心导体(58) 形成第一面(54)的槽(62)和第二面(56)上的接地平面(60)。 降低损耗和提高线性度,从而为滤波器,接收器和发射器等组件提供应用。