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    • 2. 发明申请
    • TEMPERATURE CONTROLLING CRYOGENIC PACKAGE SYSTEM
    • 温度控制低温包装系统
    • WO1996021129A1
    • 1996-07-11
    • PCT/US1995016921
    • 1995-12-26
    • SUPERCONDUCTOR TECHNOLOGIES, INC.
    • SUPERCONDUCTOR TECHNOLOGIES, INC.ROHLFING, Stephan, M.FORSE, Roger, J.SCHAREN, Michael, J.KUNIMOTO, Wallace
    • F25B29/00
    • G05D23/1912H01L39/04H01L2924/0002H01L2924/00
    • A temperature controlled cryogenic package system (6) for efficiently and precisely monitoring and controlling the operating temperature of a high temperature superconductor circuit (10) placed on a substrate (8). The cryogenic package system (6) comprises a heating element (22) formed on the same substrate (8), a control circuit (24) capable of activating and deactivating the heating element (22), and a temperature sensor (38) placed in thermal proximity to the high temperature superconductor circuit (10). The temperature sensor (38) monitors the operating temperature of the high temperature superconductor circuit (10), and conveys temperature information to the control circuit (24). The control circuit (24) activates or deactivates the heating element (22) according to the warming or cooling effect that is necessary in order to maintain the high temperature superconductor circuit (10) within a predetermined temperature range, where the range of temperature fluctuation is within plus or minus 0.1 K of a predetermined temperature.
    • 一种温度控制低温封装系统(6),用于有效且精确地监测和控制放置在基板(8)上的高温超导体电路(10)的工作温度。 低温包装系统(6)包括形成在同一基板(8)上的加热元件(22),能够激活和去激活加热元件(22)的控制电路(24)和置于 热接近高温超导体电路(10)。 温度传感器(38)监视高温超导体电路(10)的工作温度,并将温度信息传送给控制电路(24)。 控制电路(24)根据为了将高温超导体电路(10)保持在预定的温度范围所需要的升温或冷却效果而激活或去激活加热元件(22),其中温度波动范围为 在正负0.1K的预定温度下。
    • 10. 发明公开
    • TEMPERATURE CONTROLLING CRYOGENIC PACKAGE SYSTEM
    • 温度控制低温包装系统
    • EP0800639A1
    • 1997-10-15
    • EP95944736.0
    • 1995-12-26
    • SUPERCONDUCTOR TECHNOLOGIES INC.
    • ROHLFING, Stephan, M.FORSE, Roger, J.SCHAREN, Michael, J.KUNIMOTO, Wallace
    • H01L39F25B21G05D23
    • G05D23/1912H01L39/04H01L2924/0002H01L2924/00
    • A temperature controlled cryogenic package system (6) for efficiently and precisely monitoring and controlling the operating temperature of a high temperature superconductor circuit (10) placed on a substrate (8). The cryogenic package system (6) comprises a heating element (22) formed on the same substrate (8), a control circuit (24) capable of activating and deactivating the heating element (22), and a temperature sensor (38) placed in thermal proximity to the high temperature superconductor circuit (10). The temperature sensor (38) monitors the operating temperature of the high temperature superconductor circuit (10), and conveys temperature information to the control circuit (24). The control circuit (24) activates or deactivates the heating element (22) according to the warming or cooling effect that is necessary in order to maintain the high temperature superconductor circuit (10) within a predetermined temperature range, where the range of temperature fluctuation is within plus or minus 0.1 K of a predetermined temperature.
    • 一种温控低温包装系统(6),用于有效和精确地监测和控制放置在基底(8)上的高温超导体电路(10)的操作温度。 该低温包装系统(6)包括在同一衬底(8)上形成的加热元件(22),能够启动和停用加热元件(22)的控制电路(24),以及温度传感器(38) 热接近高温超导体电路(10)。 温度传感器(38)监测高温超导体电路(10)的工作温度,并将温度信息传送给控制电路(24)。 根据为了将高温超导体电路(10)保持在预定温度范围内所需的加温或冷却效应,控制电路(24)启动或停用加热元件(22),其中温度波动的范围是 在预定温度的正负0.1K内。