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81. 发明申请

WO2011100207A3 INTERCONNECT PATTERN FOR TRANSCEIVER PACKAGE 审中-公开
标题翻译：收发器包装的互连模式
公开(公告)号：WO2011100207A3
公开(公告)日：2011-11-17
申请号：PCT/US2011023964
申请日：2011-02-08
申请人： ALTERA CORP , JIANG XIAOHONG , SHI HONG
发明人： JIANG XIAOHONG , SHI HONG
IPC分类号： H01L23/48 , H01L21/60 , H01L23/535
CPC分类号： H01L23/66 , H01L23/50 , H01L23/5286 , H01L2223/6638 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H01L2924/00
摘要： In one embodiment, signaling and ground contacts are located in at least two parallel, rectilinear rows along at least one edge of an interconnect package such as a BGA package. In one row, each of a plurality of ground contacts is located between two pairs of contacts for receiving differential signals. In the second row, each of a plurality of ground contacts is located between two pairs of contacts for transmitting differential signals and the ground contacts in the second row are offset by one column from the ground contacts in the first row. As a result, the ratio of signaling pairs to ground contacts is 2:2. Additional pairs of rows may also be used. In other embodiments, signaling and ground contacts are located in three parallel, rectilinear rows along at least one edge of the package. In the first row, ground contacts alternate with contacts for receiving differential signals and in the second row ground contacts alternate with contacts for transmitting differential signals. The third row of contacts is located between the first and second rows and contains contacts for receiving differential signals that alternate with contacts for transmitting differential signals. The ground contacts in the second row are offset by one column from the ground contacts in the first row. In a second embodiment, the receiving contacts in the third row are in the same column as the receiving contacts in the first row; and the transmitting contacts in the third row are in the same column as the transmitting contacts in the second row. In a third embodiment, the contacts in the third row are offset by one column from the corresponding contacts in the first or second rows. Each pair of contacts for receiving differential signals is formed by a contact in the first row and an adjacent contact in the third row; and each pair of contacts for transmitting differential signals is formed by a contact in the second row and an adjacent contact in the third row.
摘要翻译：在一个实施例中，信令和接地触点位于沿着诸如BGA封装的互连封装的至少一个边缘的至少两个平行直线排中。在一行中，多个接地触点中的每一个位于用于接收差分信号的两对触点之间。在第二行中，多个接地触点中的每一个位于用于传输差分信号的两对触点之间，并且第二行中的接地触点与第一行中的接地触点偏移一列。结果，信令对与接地触点的比例为2：2。还可以使用另外的行对。在其他实施例中，信号和接地触点沿着包装的至少一个边缘位于三个平行的直线行中。在第一行中，接地触点与用于接收差分信号的触点交替，而在第二行中，接地触点与用于传输差分信号的触点交替。第三行触点位于第一行和第二行之间，并且包含用于接收与用于传输差分信号的触点交替的差分信号的触点。第二行的接地触点与第一行的接地触点偏移一列。在第二实施例中，第三行中的接收触点与第一行中的接收触点在同一列中; 并且第三行中的发送触点与第二行中的发送触点在同一列中。在第三实施例中，第三行中的触点从第一行或第二行中的对应触点偏移一列。用于接收差分信号的每对触点由第一行中的触点和第三行中的相邻触点形成; 并且用于传输差分信号的每对触点由第二行中的触点和第三行中的相邻触点形成。

82. 发明申请

WO2007069224A3 ENHANCED SUBSTRATE USING METAMATERIALS 审中-公开
标题翻译：使用金属材料的增强基材
公开(公告)号：WO2007069224A3
公开(公告)日：2007-11-15
申请号：PCT/IB2006054899
申请日：2006-12-15
申请人： NXP BV , WYLAND CHRIS
发明人： WYLAND CHRIS
IPC分类号： H01L23/66 , H01P3/08 , H01Q15/00 , H05K1/02
CPC分类号： H01Q15/0086 , H01L23/64 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H05K1/0236 , H01L2924/00
摘要： In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate (10) is configured as a meta-material. The meta-material provides noise protection for a signal line (15) having a pre-determined length disposed on the meta-material. The substrate comprises a dielectric material (2, 4, 6) having a topside surface and an underside surface. A conductive material (30) is arranged into pre-determined shapes (35) having a collective length. Dielectric material envelops the conductive material and the conductive material is disposed at a first predetermined distance (55) from the topside surface and at a second predetermined distance from the underside surface. The collective length of the conductive material (30) is comparable to the pre-determined length of the signal line (15).
摘要翻译：通过包装提高信号质量，可以使用超材料。元材料被设计成使信号的作用方式使得信号的形状表现得如同介电常数和磁导率不同于使用的绝缘体的实际介电常数和磁导率。在示例性实施例中，衬底（10）被配置为超常材料。超临界材料为具有设置在超常材料上的预定长度的信号线（15）提供噪声保护。衬底包括具有顶侧表面和下表面的电介质材料（2,4,6）。导电材料（30）被布置成具有共同长度的预定形状（35）。电介质材料包围导电材料，并且导电材料设置在与顶侧表面相距第一预定距离（55）处并且距离下表面第二预定距离。导电材料（30）的总长度与信号线（15）的预定长度相当。

83. 发明申请

WO2006097893A2 METHOD AND SYSTEM FOR OUTPUT MATCHING OF RF TRANSISTORS 审中-公开
标题翻译：射频晶体管输出匹配的方法与系统
公开(公告)号：WO2006097893A2
公开(公告)日：2006-09-21
申请号：PCT/IB2006/050791
申请日：2006-03-14
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , BLEDNOV, Igor
发明人： BLEDNOV, Igor
CPC分类号： H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6644 , H01L2224/45015 , H01L2224/48011 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48247 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01055 , H01L2924/01061 , H01L2924/01074 , H01L2924/01082 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/19051 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/49018 , H01L2924/00 , H01L2224/45099 , H01L2924/207 , H01L2924/20753
摘要： A high frequency power device (100) is described comprising a high frequency power transistor (102) having a first main electrode, a second main electrode acting as output electrode and a control electrode, and an output compensation circuit (104) for compensating parasitic output capacitance of the transistor (102). The output compensation circuit is physically positioned relative to the transistor such that a shorter bond wire between the output electrode of the transistor and an output lead of the high frequency power device is obtained. The output compensation circuit (104) therefore is physically located in between an input lead (108) of the high frequency power device (100) and the transistor (102). The inductance introduced by the bond wire Lcomp from the output compensation circuit (104) to the output electrode of the transistor (102) can be used as a feedback signal. Selection of the mutual inductive coupling between the bond wire LcOmP and a bond wire connected to the pre-matching circuit (106) allows to further optimize the properties of the high frequency power device.
摘要翻译：一种高频功率器件（100）被描述为包括具有第一主电极，作为输出电极的第二主电极和控制电极的高频功率晶体管（102）和用于补偿寄生输出的输出补偿电路（104）晶体管（102）的电容。输出补偿电路相对于晶体管物理定位，使得在晶体管的输出电极和高频功率器件的输出引线之间获得较短的接合线。因此，输出补偿电路（104）物理地位于高频功率器件（100）的输入引线（108）和晶体管（102）之间。由接合线Lcomp从输出补偿电路（104）引入到晶体管（102）的输出电极的电感可以用作反馈信号。选择接合线LcOmP和连接到预匹配电路（106）的接合线之间的互感耦合允许进一步优化高频功率器件的特性。

84. 发明申请

WO1992017905A1 METHOD FOR PRODUCING COAXIAL CONNECTIONS FOR ELECTRONIC COMPONENTS, AND COMPONENT CASING CONTAINING SUCH CONNECTIONS 审中-公开
标题翻译：用于生产电子部件的同轴连接的方法以及包含这种连接的组件盒
公开(公告)号：WO1992017905A1
公开(公告)日：1992-10-15
申请号：PCT/FR1992000241
申请日：1992-03-17
申请人： THOMSON-CSF , VAL, Christian
发明人： THOMSON-CSF
IPC分类号： H01L23/498
CPC分类号： H01L23/66 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2223/6611 , H01L2223/6622 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01058 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/157 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/167 , H01L2924/1679 , H01L2924/19051 , H01L2924/20752 , H01L2924/3011 , H05K1/0243 , H05K3/3421 , H05K2201/09809 , H05K2201/10689 , Y10T29/49123 , Y10T29/49144 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A method for producing coaxial connections for the input/output links of the component and/or the casing in which it is encapsulated. Specifically, the component is placed in a casing (B) and connected thereto in a conventional manner via wires, whereafter the wires are covered with a first insulating layer (21) followed by a second, conductive layer (24), so that said second layer is connected to the casing's earth contacts (PE1). The layers (21, 24) thereby form collectively produced coaxial structures with the connecting wires (F). A similar process is used for the casing's own input/output connections (P).
摘要翻译： PCT No.PCT / FR92 / 00241 Sec。 371日期：1992年11月10日 102（e）日期1992年11月10日PCT 1991年3月17日PCT公布。出版物WO92 / 17905 日期为1992年10月15日。本发明的一个目的是生产用于封装该部件和/或壳体的输入/输出链路的同轴连接。更准确地说，放置在包装（B）中的部件通常通过电线连接到其包装; 导线接下来被第一绝缘层（21）覆盖，然后由第二导电层（24）覆盖，使得该第二层连接到封装的接地焊盘（PE1）。因此，层（21,24）与连接线（F）形成共同生产的同轴结构。类似的过程用于包装本身的输入/输出连接（P）。

86. 发明公开

EP2534683A4 INTERCONNECT PATTERN FOR TRANSCEIVER PACKAGE 有权
标题翻译： VERNETZUNGSMUSTERFÜR收发器 - PAKETE
公开(公告)号：EP2534683A4
公开(公告)日：2015-05-20
申请号：EP11742669
申请日：2011-02-08
申请人： ALTERA CORP
发明人： JIANG XIAOHONG , SHI HONG
IPC分类号： H01L23/50 , H01L23/66
CPC分类号： H01L23/66 , H01L23/50 , H01L23/5286 , H01L2223/6638 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H01L2924/00

87. 发明公开

EP2246884A4 WIRING BOARD FOR HIGH FREQUENCY, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRONIC DEVICE AND COMMUNICATION APPARATUS 有权
标题翻译：电路板频率高，封装，LEG POSE的电子元件，电子器件及通信装置
公开(公告)号：EP2246884A4
公开(公告)日：2012-04-18
申请号：EP09706773
申请日：2009-01-30
申请人： KYOCERA CORP
发明人： SHIRASAKI TAKAYUKI
IPC分类号： H01L23/12 , H01L23/02 , H01L23/64 , H01L23/66 , H05K9/00
CPC分类号： H01L23/047 , H01L23/49838 , H01L23/647 , H01L23/66 , H01L24/48 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/19041 , H01L2924/19051 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/023 , H05K1/0237 , H05K9/0064 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A high frequency wiring board (4) includes a dielectric substrate (4a), a line conductor (4b) for high frequency signal transmission formed on a first surface of the dielectric substrate (4a) from a connection end (4bc) to an end (4ba), a ground conductor (4c) which is disposed aligned with one side (4bb) of the line conductor (4b) with a distance therebetween, and is disposed so as to cross over a hypothetical extension line extending from the end (4ba) in parallel with a line direction of the line conductor (4b), and a terminating resistor (4d) configured to electrically connect an end portion of the line conductor (4b) and the ground conductor (4c).
摘要翻译：一种高频电路板（4）包括电介质基片（4a）中，在端部形成在从连接端（4BC）的电介质基片（4a）的一个第一表面到高频信号传输的线路导体（4B）（ 4BA），一个接地导体（4c）的所有其设置与一侧对齐（4 BB）线路导体的（4b）上的距离在其间，并且被设置成跨越的假想延长线从所述端部延伸（4BA）在与被配置为电线路导体（4b）中，和一个终接电阻器（4D）的线方向平行连接在线路导体（4b）的和接地导体（图4c）的端部。

88. 发明公开

EP2387295A1 IC-Package with integrated impedance matching and harmonic suppression 审中-公开
标题翻译： IC-Packung mit integrierter Impedanzanpassung und harmonischerUnterdrückung
公开(公告)号：EP2387295A1
公开(公告)日：2011-11-16
申请号：EP10162427.8
申请日：2010-05-10
申请人： Dialog Semiconductor B.V.
发明人： Colussi, Laurentius Cornelis , Willms, Johannes Gerardus
IPC分类号： H05K1/02 , H01L23/66
CPC分类号： H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2223/6655 , H01L2224/05554 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19051 , H01L2924/30107 , H01L2924/3011 , H01P5/10 , H03F1/565 , H03F3/45475 , H05K1/0251 , H05K1/116 , H05K1/162 , H05K2201/09781 , H01L2924/00 , H01L2924/00015 , H01L2924/00014
摘要： A package connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit (72) to provide an impedance match for a signal to be sent to a circuit (74) external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs (2b1, 2b2) on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs (2b1, 2b2) have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.
摘要翻译：包装件，其在第一侧连接到印刷电路板，并且在与第一侧相对的第二侧固定有模具。该封装具有集成预匹配电路（72），以提供要发送到封装外部的电路（74）的信号的阻抗匹配。信号具有预定的主频率分量。预匹配电路在封装的预定层上具有一对传输线和一对短截线（2b1,2b2），并连接到一对传输线。一对短棒（2b1,2b2）具有长度，以形成信号中主频分量的谐波频率的短路。

89. 发明公开

EP2273550A3 Enhanced substrate using metamaterials 审中-公开
标题翻译： VerstärktesSubstrat mit Metamaterialien
公开(公告)号：EP2273550A3
公开(公告)日：2011-08-10
申请号：EP10175620.3
申请日：2006-12-15
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Wyland, Chris
IPC分类号： H01L23/66 , H01P3/08 , H01Q15/00 , H05K1/02
CPC分类号： H01Q15/0086 , H01L23/64 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H05K1/0236 , H01L2924/00
摘要： A method of desigjning a meta-material using resistance-inductance-capacitance data from two-dimensional electromagnetic meta-material models. The method comprises defining desired application parameters (2210) for the structure; constructing a lank circuit (2220); selecting the RLC values (2230) in the tank circuit to obtain a desired signal response and determining a configuration of corresponding geometries; simulating two-dimensional cross-sections (2240) of the structure to find desired RLC tank circuit values; calculating equivalent RLC values (2250) for a structure length and one of the two- dimensional cross-sections.
摘要翻译：使用来自二维电磁超常材料模型的电阻 - 电感 - 电容数据来设计超材料的方法。该方法包括为该结构定义所需的应用参数（2210）; 构建一个电路（2220）; 选择储存器电路中的RLC值（2230）以获得期望的信号响应并确定相应几何的配置; 模拟结构的二维截面（2240）以找到所需的RLC电路电路值; 计算结构长度和二维横截面之一的等效RLC值（2250）。

90. 发明授权

EP1041632B1 A compensation structure for a bond wire at high frequency operation 有权
标题翻译：补偿结构在高频率操作的连接线
公开(公告)号：EP1041632B1
公开(公告)日：2007-05-09
申请号：EP00302567.3
申请日：2000-03-28
申请人： THE WHITAKER CORPORATION
发明人： Kinayman, Noyan , Jain, Nitin
IPC分类号： H01L23/66 , H01L23/64
CPC分类号： H01L23/66 , H01L24/45 , H01L24/48 , H01L2223/6611 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2924/01019 , H01L2924/01079 , H01L2924/14 , H01L2924/1423 , H01L2924/19041 , H01L2924/19051 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/20644

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