专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP2779470A1 Integrated circuit for transmitting and receiving an RF signal 有权
标题翻译： Integrierte Schaltung zumÜbertragenund Empfangen eines RF-Signals
公开(公告)号：EP2779470A1
公开(公告)日：2014-09-17
申请号：EP13159469.9
申请日：2013-03-15
申请人： Dialog Semiconductor B.V.
发明人： Papamichail, Michail , Aartsen, Wilhelmus Aart Johannes , Willms, Johannes Gerardus
IPC分类号： H04B1/18 , H04B1/04
CPC分类号： H03H7/38 , H01P1/10 , H03H7/40 , H03H7/42 , H03H7/425 , H04B1/0458 , H04B1/18
摘要： An integrated circuit (201), comprising a single-ended pin (202) for transmitting and/or receiving an RF signal. A first matching network (331) is configured to match an impedance of the RF signal. A second matching network (332) is configured to match an impedance of an on-chip differential circuit (303, 304). A third matching network (333) is configured to match an impedance of an on-chip single-ended circuit (305, 306), wherein the third matching network (333) is connectable to the first matching network (331). A transformer (307) is connected or connectable to the second matching network (332) and to the first matching network (331). Switches control an operating mode of the integrated circuit (201) The second matching network (332) is connected with the first matching network (331) via the transformer (307), or the third matching network (333) is connected with the first matching network (331).
摘要翻译：一种集成电路（201），包括用于发送和/或接收RF信号的单端引脚（202）。第一匹配网络（331）被配置为匹配RF信号的阻抗。第二匹配网络（332）被配置为匹配片上差分电路（303,304）的阻抗。第三匹配网络（333）被配置为匹配片上单端电路（305,306）的阻抗，其中第三匹配网络（333）可连接到第一匹配网络（331）。变压器（307）连接或连接到第二匹配网络（332）和第一匹配网络（331）。开关控制集成电路的工作模式（201）第二匹配网络（332）经由变压器（307）与第一匹配网络（331）连接，或者第三匹配网络（333）与第一匹配网络（331）。

2. 发明授权

EP2779470B1 Integrated circuit for transmitting and receiving an RF signal 有权
标题翻译：用于发送和接收RF信号的集成电路
公开(公告)号：EP2779470B1
公开(公告)日：2016-04-20
申请号：EP13159469.9
申请日：2013-03-15
申请人： Dialog Semiconductor B.V.
发明人： Papamichail, Michail , Aartsen, Wilhelmus Aart Johannes , Willms, Johannes Gerardus
IPC分类号： H04B1/18 , H04B1/04 , H03H7/38
CPC分类号： H03H7/38 , H01P1/10 , H03H7/40 , H03H7/42 , H03H7/425 , H04B1/0458 , H04B1/18

3. 发明公开

EP2387295A1 IC-Package with integrated impedance matching and harmonic suppression 审中-公开
标题翻译： IC-Packung mit integrierter Impedanzanpassung und harmonischerUnterdrückung
公开(公告)号：EP2387295A1
公开(公告)日：2011-11-16
申请号：EP10162427.8
申请日：2010-05-10
申请人： Dialog Semiconductor B.V.
发明人： Colussi, Laurentius Cornelis , Willms, Johannes Gerardus
IPC分类号： H05K1/02 , H01L23/66
CPC分类号： H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2223/6655 , H01L2224/05554 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19051 , H01L2924/30107 , H01L2924/3011 , H01P5/10 , H03F1/565 , H03F3/45475 , H05K1/0251 , H05K1/116 , H05K1/162 , H05K2201/09781 , H01L2924/00 , H01L2924/00015 , H01L2924/00014
摘要： A package connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit (72) to provide an impedance match for a signal to be sent to a circuit (74) external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs (2b1, 2b2) on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs (2b1, 2b2) have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.
摘要翻译：包装件，其在第一侧连接到印刷电路板，并且在与第一侧相对的第二侧固定有模具。该封装具有集成预匹配电路（72），以提供要发送到封装外部的电路（74）的信号的阻抗匹配。信号具有预定的主频率分量。预匹配电路在封装的预定层上具有一对传输线和一对短截线（2b1,2b2），并连接到一对传输线。一对短棒（2b1,2b2）具有长度，以形成信号中主频分量的谐波频率的短路。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式