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1. 发明申请

WO2011100207A3 INTERCONNECT PATTERN FOR TRANSCEIVER PACKAGE 审中-公开
标题翻译：收发器包装的互连模式
公开(公告)号：WO2011100207A3
公开(公告)日：2011-11-17
申请号：PCT/US2011023964
申请日：2011-02-08
申请人： ALTERA CORP , JIANG XIAOHONG , SHI HONG
发明人： JIANG XIAOHONG , SHI HONG
IPC分类号： H01L23/48 , H01L21/60 , H01L23/535
CPC分类号： H01L23/66 , H01L23/50 , H01L23/5286 , H01L2223/6638 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H01L2924/00
摘要： In one embodiment, signaling and ground contacts are located in at least two parallel, rectilinear rows along at least one edge of an interconnect package such as a BGA package. In one row, each of a plurality of ground contacts is located between two pairs of contacts for receiving differential signals. In the second row, each of a plurality of ground contacts is located between two pairs of contacts for transmitting differential signals and the ground contacts in the second row are offset by one column from the ground contacts in the first row. As a result, the ratio of signaling pairs to ground contacts is 2:2. Additional pairs of rows may also be used. In other embodiments, signaling and ground contacts are located in three parallel, rectilinear rows along at least one edge of the package. In the first row, ground contacts alternate with contacts for receiving differential signals and in the second row ground contacts alternate with contacts for transmitting differential signals. The third row of contacts is located between the first and second rows and contains contacts for receiving differential signals that alternate with contacts for transmitting differential signals. The ground contacts in the second row are offset by one column from the ground contacts in the first row. In a second embodiment, the receiving contacts in the third row are in the same column as the receiving contacts in the first row; and the transmitting contacts in the third row are in the same column as the transmitting contacts in the second row. In a third embodiment, the contacts in the third row are offset by one column from the corresponding contacts in the first or second rows. Each pair of contacts for receiving differential signals is formed by a contact in the first row and an adjacent contact in the third row; and each pair of contacts for transmitting differential signals is formed by a contact in the second row and an adjacent contact in the third row.
摘要翻译：在一个实施例中，信令和接地触点位于沿着诸如BGA封装的互连封装的至少一个边缘的至少两个平行直线排中。在一行中，多个接地触点中的每一个位于用于接收差分信号的两对触点之间。在第二行中，多个接地触点中的每一个位于用于传输差分信号的两对触点之间，并且第二行中的接地触点与第一行中的接地触点偏移一列。结果，信令对与接地触点的比例为2：2。还可以使用另外的行对。在其他实施例中，信号和接地触点沿着包装的至少一个边缘位于三个平行的直线行中。在第一行中，接地触点与用于接收差分信号的触点交替，而在第二行中，接地触点与用于传输差分信号的触点交替。第三行触点位于第一行和第二行之间，并且包含用于接收与用于传输差分信号的触点交替的差分信号的触点。第二行的接地触点与第一行的接地触点偏移一列。在第二实施例中，第三行中的接收触点与第一行中的接收触点在同一列中; 并且第三行中的发送触点与第二行中的发送触点在同一列中。在第三实施例中，第三行中的触点从第一行或第二行中的对应触点偏移一列。用于接收差分信号的每对触点由第一行中的触点和第三行中的相邻触点形成; 并且用于传输差分信号的每对触点由第二行中的触点和第三行中的相邻触点形成。

2. 发明申请

WO2011046809A2 IC PACKAGE WITH NON-UNIFORM DIELECTRIC LAYER THICKNESS 审中-公开
标题翻译：具有非均匀介质层厚度的IC封装
公开(公告)号：WO2011046809A2
公开(公告)日：2011-04-21
申请号：PCT/US2010051880
申请日：2010-10-08
申请人： ALTERA CORP , JIANG XIAHONG , SHI HONG , LIU HUI , XIE YUANLIN
发明人： JIANG XIAHONG , SHI HONG , LIU HUI , XIE YUANLIN
IPC分类号： H01L23/12 , H01L23/48 , H01L23/485
CPC分类号： H01L23/5383 , H01L23/12 , H01L23/48 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/92 , H01L2224/131 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92125 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/00 , H01L2924/014
摘要： An integrated circuit (IC) package substrate with non-uniform dielectric layers is disclosed. The IC package substrate is a multilayer package substrate that has dielectric layers and metal layers stacked up alternately. The dielectric layers in the package substrate have different thickness. The metal layers may be ground, signal or power layers. A thicker dielectric layer is placed in between a signal layer and a power layer in the package substrate. The thicker dielectric layer may be at least twice as thick as other dielectric layers in the package substrate. The thicker dielectric layer may provide better impedance control in the package substrate.
摘要翻译：公开了具有不均匀电介质层的集成电路（IC）封装基板。 IC封装基板是具有交替堆叠的电介质层和金属层的多层封装基板。封装衬底中的电介质层具有不同的厚度。金属层可以是接地，信号或功率层。在封装衬底中的信号层和功率层之间放置较厚的介电层。较厚的电介质层可以是封装衬底中其它电介质层的至少两倍。较厚的介电层可以在封装衬底中提供更好的阻抗控制。

3. 发明公开

EP2534683A4 INTERCONNECT PATTERN FOR TRANSCEIVER PACKAGE 有权
标题翻译： VERNETZUNGSMUSTERFÜR收发器 - PAKETE
公开(公告)号：EP2534683A4
公开(公告)日：2015-05-20
申请号：EP11742669
申请日：2011-02-08
申请人： ALTERA CORP
发明人： JIANG XIAOHONG , SHI HONG
IPC分类号： H01L23/50 , H01L23/66
CPC分类号： H01L23/66 , H01L23/50 , H01L23/5286 , H01L2223/6638 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H01L2924/00

4. 发明公开

EP2489068A4 IC PACKAGE WITH NON-UNIFORM DIELECTRIC LAYER THICKNESS 审中-公开
公开(公告)号：EP2489068A4
公开(公告)日：2018-03-21
申请号：EP10823860
申请日：2010-10-08
申请人： ALTERA CORP
发明人： JIANG XIAOHONG , SHI HONG , LIU HUI , XIE YUANLIN
IPC分类号： H01L23/66 , H01L23/498 , H01L23/50
CPC分类号： H01L23/5383 , H01L23/12 , H01L23/49822 , H01L23/50 , H01L23/64 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/92 , H01L2224/131 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92125 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/00 , H01L2924/014
摘要： An integrated circuit (IC) package substrate with non-uniform dielectric layers is disclosed. The IC package substrate is a multilayer package substrate that has dielectric layers and metal layers stacked up alternately. The dielectric layers in the package substrate have different thickness. The metal layers may be ground, signal or power layers. A thicker dielectric layer is placed in between a signal layer and a power layer in the package substrate. The thicker dielectric layer may be at least twice as thick as other dielectric layers in the package substrate. The thicker dielectric layer may provide better impedance control in the package substrate.

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