会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 81. 发明授权
    • SyAF structure to fabricate Mbit MTJ MRAM
    • SyAF结构制造Mbit MTJ MRAM
    • US07663131B2
    • 2010-02-16
    • US11715728
    • 2007-03-08
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngGuangli Liu
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngGuangli Liu
    • H01L47/00
    • H01L43/10B82Y25/00B82Y40/00G11C11/16H01F10/3254H01F10/3272H01F41/307H01L43/12
    • A MTJ that minimizes error count (EC) while achieving high MR value, low magnetostriction, and a RA of about 1100 Ω-μm2 for 1 Mbit MRAM devices is disclosed. The MTJ has a composite AP1 pinned layer made of a lower amorphous Co60Fe20B20 layer and an upper crystalline Co75Fe25 layer to promote a smoother and more uniform AlOx tunnel barrier. A “stronger oxidation” state is realized in the AlOx layer by depositing a thicker than normal Al layer or extending the ROX cycle time for Al oxidation and thereby reduces tunneling hot spots. The NiFe free layer has a low Fe content of about 8 to 21 atomic % and the Hf content in the NiFeHf capping layer is from 10 to 25 atomic %. A Ta hard mask is formed on the capping layer. EC (best) is reduced from >100 ppm to
    • 公开了一种在1兆比特MRAM器件实现高MR值,低磁致伸缩以及约1100Ωm2的RA的情况下最小化误差计数(EC)的MTJ。 MTJ具有由较低的非晶Co60Fe20B20层和上层结晶Co75Fe25层制成的复合AP1钉扎层,以促进更平滑和更均匀的AlOx隧道势垒。 在AlOx层中通过沉积比正常的Al层更厚或者延长了用于Al氧化的ROX循环时间,从而减少了隧道热点,实现了“更强的氧化”状态。 NiFe自由层的Fe含量低,为约8〜21原子%,NiFeHf覆盖层的Hf含量为10〜25原子%。 在封盖层上形成Ta硬掩模。 通过使用优选的MTJ构型,EC(最佳)从> 100ppm降低到<10ppm。
    • 88. 发明授权
    • Hard biased materials for recording head applications
    • 用于记录头应用的硬偏置材料
    • US07327540B2
    • 2008-02-05
    • US10858029
    • 2004-06-01
    • Yun-Fei LiKunliang ZhangChyu-Jiuh Torng
    • Yun-Fei LiKunliang ZhangChyu-Jiuh Torng
    • G11B5/33G11B5/127G11B5/39
    • G11B5/39Y10T428/11Y10T428/115
    • A hard bias layer that forms an abutting junction with a free layer in a GMR element and is comprised of FePtCu or FePtCuX where X is B, C, O, Si, or N is disclosed. The FePtCu layer has a composition of about 45 atomic % Fe, 45 atomic % Pt, and 10 atomic % Cu and does not require a seed layer to achieve an ordered structure. The FePtCu layer is annealed at a temperature of about 280° C. and has an Hc value more than double that of a conventional CoCrPt hard bias layer with a similar thickness. Since the FePtCu hard bias layer adjoins a free layer, it has a higher sensor edge pinning efficiency than a configuration with a CoCrPt layer on a seed layer. The novel hard bias layer is compatible with either a top or bottom spin valve structure in a GMR sensor.
    • 公开了与GMR元件中的自由层形成邻接连接并由FePtCu或FePtCuX组成的硬偏置层,其中X是B,C,O,Si或N。 FePtCu层具有约45原子%Fe,45原子%Pt和10原子%Cu的组成,并且不需要种子层来实现有序结构。 FePtCu层在约280℃的温度下进行退火,并且其Hc值大于具有相似厚度的常规CoCrPt硬偏压层的Hc值的两倍以上。 由于FePtCu硬偏置层与自由层相邻,因此与种子层上的CoCrPt层的配置相比,传感器边缘钉扎效率更高。 新颖的硬偏置层与GMR传感器中的顶部或底部自旋阀结构兼容。