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    • 1. 发明授权
    • SyAF structure to fabricate Mbit MTJ MRAM
    • SyAF结构制造Mbit MTJ MRAM
    • US07663131B2
    • 2010-02-16
    • US11715728
    • 2007-03-08
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngGuangli Liu
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngGuangli Liu
    • H01L47/00
    • H01L43/10B82Y25/00B82Y40/00G11C11/16H01F10/3254H01F10/3272H01F41/307H01L43/12
    • A MTJ that minimizes error count (EC) while achieving high MR value, low magnetostriction, and a RA of about 1100 Ω-μm2 for 1 Mbit MRAM devices is disclosed. The MTJ has a composite AP1 pinned layer made of a lower amorphous Co60Fe20B20 layer and an upper crystalline Co75Fe25 layer to promote a smoother and more uniform AlOx tunnel barrier. A “stronger oxidation” state is realized in the AlOx layer by depositing a thicker than normal Al layer or extending the ROX cycle time for Al oxidation and thereby reduces tunneling hot spots. The NiFe free layer has a low Fe content of about 8 to 21 atomic % and the Hf content in the NiFeHf capping layer is from 10 to 25 atomic %. A Ta hard mask is formed on the capping layer. EC (best) is reduced from >100 ppm to
    • 公开了一种在1兆比特MRAM器件实现高MR值,低磁致伸缩以及约1100Ωm2的RA的情况下最小化误差计数(EC)的MTJ。 MTJ具有由较低的非晶Co60Fe20B20层和上层结晶Co75Fe25层制成的复合AP1钉扎层,以促进更平滑和更均匀的AlOx隧道势垒。 在AlOx层中通过沉积比正常的Al层更厚或者延长了用于Al氧化的ROX循环时间,从而减少了隧道热点,实现了“更强的氧化”状态。 NiFe自由层的Fe含量低,为约8〜21原子%,NiFeHf覆盖层的Hf含量为10〜25原子%。 在封盖层上形成Ta硬掩模。 通过使用优选的MTJ构型,EC(最佳)从> 100ppm降低到<10ppm。
    • 3. 发明授权
    • High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same
    • 用于常规MRAM和STT-RAM的高性能MTJ元件及其制造方法
    • US08372661B2
    • 2013-02-12
    • US11981127
    • 2007-10-31
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngWitold Kula
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngWitold Kula
    • H01L21/00
    • H01L43/10B82Y10/00H01L27/228H01L43/08H01L43/12
    • A STT-RAM MTJ that minimizes spin-transfer magnetization switching current (Jc) is disclosed. The MTJ has a MgO tunnel barrier layer formed with a natural oxidation process to achieve a low RA (10 ohm-um2) and a Fe or Fe/CoFeB/Fe free layer which provides a lower intrinsic damping constant than a CoFeB free layer. A Fe, FeB, or Fe/CoFeB/Fe free layer when formed with a MgO tunnel barrier (radical oxidation process) and a CoFeB AP1 pinned layer in a MRAM MTJ stack annealed at 360° C. provides a high dR/R (TMR)>100% and a substantial improvement in read margin with a TMR/Rp_cov=20. High speed measurement of 100 nm×200 nm oval STT-RAM MTJs has shown a Jc0 for switching a Fe free layer is one half that for switching an amorphous CO40Fe40B20 free layer. A Fe/CoFeB/Fe free layer configuration allows the Hc value to be increased for STT-RAM applications.
    • 公开了使自旋转移磁化开关电流(Jc)最小化的STT-RAM MTJ。 MTJ具有形成有自然氧化工艺的MgO隧道阻挡层,以实现低的RA(10欧姆 - um2)和不含CoFeB自由层的较低的固有阻尼常数的Fe或Fe / CoFeB / Fe自由层。 当在360℃退火的MRAM MTJ堆叠中形成具有MgO隧道势垒(自由基氧化法)和CoFeB AP1钉扎层的Fe,FeB或Fe / CoFeB / Fe自由层时,提供高dR / R(TMR )> 100%,TMR / Rp_cov = 20时读取余量大幅度提高。 100 nm×200 nm椭圆STT-RAM MTJ的高速测量显示,用于切换无Fe层的Jc0是用于切换无定形CO40Fe40B20自由层的一半。 Fe / CoFeB / Fe自由层配置允许为STT-RAM应用增加Hc值。