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81. 发明申请

US20080050872A1 Fabrication of a high speed RRAM having narrow pulse width programming capabilities 审中-公开
标题翻译：制造具有窄脉冲编程能力的高速RRAM
公开(公告)号：US20080050872A1
公开(公告)日：2008-02-28
申请号：US11510428
申请日：2006-08-24
申请人： Sheng Teng Hsu , Tingkai Li
发明人： Sheng Teng Hsu , Tingkai Li
IPC分类号： H01L21/8244 , H01L21/8234
CPC分类号： H01L27/101 , H01L45/04 , H01L45/1253 , H01L45/147
摘要： A method of selecting a cathode material and a resistance material for use in a RRAM includes determining the work function of a group of potential resistance materials; determining the work function of a group of potential cathode materials; and selecting a suitable material for the resistance material from the group of potential resistance materials and selecting a suitable material for the cathode material from the group of potential cathode material, wherein the work function of the cathode material is at least 0.2 eV less than the work function of the resistance material.
摘要翻译：选择用于RRAM的阴极材料和电阻材料的方法包括确定一组电阻材料的功函数; 确定一组潜在阴极材料的功函数; 并从潜在的电阻材料组中选择合适的电阻材料材料，并从潜在的阴极材料组中选择合适的阴极材料材料，其中阴极材料的功函数比工件小至少0.2eV 电阻材料的功能。

82. 发明申请

US20070278574A1 Compound semiconductor-on-silicon wafer with a thermally soft insulator 审中-公开
标题翻译：具有热软绝缘体的复合半导体硅片
公开(公告)号：US20070278574A1
公开(公告)日：2007-12-06
申请号：US11443144
申请日：2006-05-30
申请人： Sheng Teng Hsu , Tingkai Li , Jong-Jan Lee
发明人： Sheng Teng Hsu , Tingkai Li , Jong-Jan Lee
IPC分类号： H01L27/12 , H01L21/84
CPC分类号： H01L21/02381 , H01L21/0245 , H01L21/02488 , H01L21/02505 , H01L21/02529 , H01L21/02538 , H01L21/7624
摘要： A method is provided for forming a compound semiconductor-on-silicon (Si) wafer with a thermally soft insulator. The method forms a Si substrate, with a thermally soft insulator layer overlying the Si substrate. A silicon oxide layer is formed immediately overlying the thermally soft insulator layer, a top Si layer overlies the silicon oxide, and a lattice mismatch buffer layer overlies the top Si layer. A compound semiconductor layer is formed overlying the lattice mismatch buffer layer. The thermally soft insulator has a liquid phase temperature lower than the liquid phase temperatures of Si and the compound semiconductor. For example, the thermally soft insulator may have a flow temperature in the range of about 500° C. to 900° C., where the flow temperature is greater than the solid phase temperature and less than the liquid phase temperature.
摘要翻译：提供了一种用热软性绝缘体形成硅化合物半导体（Si）晶片的方法。该方法形成Si衬底，具有覆盖Si衬底的热软绝缘层。形成刚好覆盖在热软绝缘体层上的氧化硅层，顶部Si层覆盖在氧化硅上，并且晶格失配缓冲层覆盖在顶部Si层上。形成覆盖晶格失配缓冲层的化合物半导体层。该热软绝缘体的液相温度低于Si和化合物半导体的液相温度。例如，热软绝缘体可以具有在约500℃至900℃的范围内的流动温度，其中流动温度大于固相温度并且小于液相温度。

83. 发明授权

US07303971B2 MSM binary switch memory device 有权
标题翻译： MSM二进制开关存储器件
公开(公告)号：US07303971B2
公开(公告)日：2007-12-04
申请号：US11184660
申请日：2005-07-18
申请人： Sheng Teng Hsu , Tingkai Li
发明人： Sheng Teng Hsu , Tingkai Li
IPC分类号： H01L21/20
CPC分类号： H01L27/101 , G11C13/0007 , G11C2213/31 , H01L27/2409 , H01L27/2463 , H01L29/66143 , H01L29/872 , H01L45/04 , H01L45/1233 , H01L45/147
摘要： A metal/semiconductor/metal (MSM) binary switch memory device and fabrication process are provided. The device includes a memory resistor bottom electrode, a memory resistor material over the memory resistor bottom electrode, and a memory resistor top electrode over the memory resistor material. An MSM bottom electrode overlies the memory resistor top electrode, a semiconductor layer overlies the MSM bottom electrode, and an MSM top electrode overlies the semiconductor layer. The MSM bottom electrode can be a material such as Pt, Ir, Au, Ag, TiN, or Ti. The MSM top electrode can be a material such as Pt, Ir, Au, TiN, Ti, or Al. The semiconductor layer can be amorphous Si, ZnO2, or InO2.
摘要翻译：提供金属/半导体/金属（MSM）二进制开关存储器件和制造工艺。该器件包括存储器电阻器底部电极，存储器电阻器底部电极上方的存储器电阻器材料，以及存储器电阻器材料上的存储器电阻器顶部电极。 MSM底部电极覆盖存储电阻器顶部电极，半导体层覆盖在MSM底部电极上，并且MSM顶部电极覆盖半导体层。 MSM底部电极可以是诸如Pt，Ir，Au，Ag，TiN或Ti的材料。 MSM顶部电极可以是诸如Pt，Ir，Au，TiN，Ti或Al的材料。半导体层可以是非晶Si，ZnO 2或InO 2。

84. 发明授权

US07297642B2 Sputter-deposited rare earth element-doped silicon oxide film with silicon nanocrystals for electroluminescence applications 失效
标题翻译：溅射沉积的稀土元素掺杂氧化硅膜与硅纳米晶体用于电致发光应用
公开(公告)号：US07297642B2
公开(公告)日：2007-11-20
申请号：US11334015
申请日：2006-01-18
申请人： Wei Gao , Tingkai Li , Robert A. Barrowcliff , Yoshi Ono , Sheng Teng Hsu
发明人： Wei Gao , Tingkai Li , Robert A. Barrowcliff , Yoshi Ono , Sheng Teng Hsu
IPC分类号： H01L21/31
CPC分类号： H05B33/145 , H01L21/3115 , H01L31/03046 , Y02E10/544
摘要： A method is provided for forming a rare earth (RE) element-doped silicon (Si) oxide film with nanocrystalline (nc) Si particles. The method comprises: providing a first target of Si, embedded with a first rare earth element; providing a second target of Si; co-sputtering the first and second targets; forming a Si-rich Si oxide (SRSO) film on a substrate, doped with the first rare earth element; and, annealing the rare earth element-doped SRSO film. The first target is doped with a rare earth element such as erbium (Er), ytterbium (Yb), cerium (Ce), praseodymium (Pr), or terbium (Tb). The sputtering power is in the range of about 75 to 300 watts (W). Different sputtering powers are applied to the two targets. Also, deposition can be controlled by varying the effective areas of the two targets. For example, one of the targets can be partially covered.
摘要翻译：提供了一种用于形成具有纳米晶体（nc）Si颗粒的稀土（RE）元素掺杂硅（Si）氧化物膜的方法。该方法包括：提供嵌入有第一稀土元素的Si的第一靶; 提供Si的第二个目标; 共溅射第一和第二个目标; 在掺杂有第一稀土元素的衬底上形成富Si氧化硅（SRSO）膜; 并对稀土元素掺杂的SRSO膜退火。第一靶用铒（Er），镱（Yb），铈（Ce），镨（Pr）或铽（Tb）等稀土元素掺杂。溅射功率在约75至300瓦（W）的范围内。不同的溅射功率被应用于两个目标。此外，可以通过改变两个目标的有效面积来控制沉积。例如，其中一个目标可以被部分覆盖。

85. 发明授权

US07256426B2 Rare earth element-doped silicon/silicon dioxide lattice structure 失效
标题翻译：稀土元素掺杂硅/二氧化硅晶格结构
公开(公告)号：US07256426B2
公开(公告)日：2007-08-14
申请号：US11039463
申请日：2005-01-19
申请人： Tingkai Li , Wei Gao , Yoshi Ono , Sheng Teng Hsu
发明人： Tingkai Li , Wei Gao , Yoshi Ono , Sheng Teng Hsu
IPC分类号： H01L27/15 , H01L21/00
CPC分类号： C23C14/16 , C03C17/34 , C23C14/10 , C23C28/322 , C23C28/323 , C23C28/345 , C23C28/3455 , C23C28/42 , H01L21/02164 , H01L21/02266 , H01L21/0237 , H01L21/02532 , H01L21/02573 , H01L21/0259 , H01L21/02631 , H01L21/02667 , H01L21/31608 , H01L33/26
摘要： Provided are an electroluminescence (EL) device and corresponding method for forming a rare earth element-doped silicon (Si)/Si dioxide (SiO2) lattice structure. The method comprises: providing a substrate; DC sputtering a layer of amorphous Si overlying the substrate; DC sputtering a rare earth element; in response, doping the Si layer with the rare earth element; DC sputtering a layer of SiO2 overlying the rare earth-doped Si; forming a lattice structure; annealing; and, in response to the annealing, forming nanocrystals in the rare-earth doped Si having a grain size in the range of 1 to 5 nanometers (nm). In one aspect, the rare earth element and Si are co-DC sputtered. Typically, the steps of DC sputtering Si, DC sputtering the rare earth element, and DC sputtering the SiO2 are repeated 5 to 60 cycles, so that the lattice structure includes the plurality (5-60) of alternating SiO2 and rare earth element-doped Si layers.
摘要翻译：提供了一种用于形成稀土元素掺杂硅（Si）/二氧化硅（SiO 2）晶格结构的电致发光（EL）器件和相应的方法。该方法包括：提供衬底; DC溅射覆盖衬底的非晶硅层; 直流溅射稀土元素; 作为响应，用稀土元素掺杂Si层; DC溅射一层SiO 2，覆盖稀土掺杂的Si; 形成晶格结构; 退火; 并且响应于退火，在具有1至5纳米（nm）范围内的晶粒尺寸的稀土掺杂Si中形成纳米晶体。一方面，稀土元素和Si共溅射。通常，DC溅射Si，DC溅射稀土元素和DC溅射SiO 2的步骤重复5至60个循环，使得晶格结构包括多个（5-60）交替的SiO 2和稀土元素掺杂 Si层。

86. 发明授权

US07235407B2 System and method for forming a bipolar switching PCMO film 有权
标题翻译：用于形成双极开关PCMO膜的系统和方法
公开(公告)号：US07235407B2
公开(公告)日：2007-06-26
申请号：US10855942
申请日：2004-05-27
申请人： Tingkai Li , Lawrence J. Charneski , Wei-Wei Zhuang , David R. Evans , Sheng Teng Hsu
发明人： Tingkai Li , Lawrence J. Charneski , Wei-Wei Zhuang , David R. Evans , Sheng Teng Hsu
IPC分类号： H01L21/00
CPC分类号： H01L45/04 , H01L45/1233 , H01L45/147 , H01L45/1616
摘要： A multi-layer PrxCa1-xMnO3 (PCMO) thin film capacitor and associated deposition method are provided for forming a bipolar switching thin film. The method comprises: forming a bottom electrode; depositing a nanocrystalline PCMO layer; depositing a polycrystalline PCMO layer; forming a multi-layer PCMO film with bipolar switching properties; and, forming top electrode overlying the PCMO film. If the polycrystalline layers are deposited overlying the nanocrystalline layers, a high resistance can be written with narrow pulse width, negative voltage pulses. The PCMO film can be reset to a low resistance using a narrow pulse width, positive amplitude pulse. Likewise, if the nanocrystalline layers are deposited overlying the polycrystalline layers, a high resistance can be written with narrow pulse width, positive voltage pulses, and reset to a low resistance using a narrow pulse width, negative amplitude pulse.
摘要翻译：提供了多层Pr 1 x 1 x x MnO 3（PCMO）薄膜电容器和相关的沉积方法，用于形成双极开关薄膜。该方法包括：形成底部电极; 沉积纳米晶体PCMO层; 沉积多晶的PCMO层; 形成具有双极开关特性的多层PCMO膜; 并且形成覆盖PCMO膜的顶部电极。如果多晶层沉积在纳米晶层之上，则可以用窄脉冲宽度，负电压脉冲写入高电阻。 PCMO膜可以使用窄脉冲宽度，正幅度脉冲复位为低电阻。同样，如果纳米晶层沉积在多晶层上，则可以用窄脉冲宽度，正电压脉冲写入高电阻，并使用窄脉冲宽度，负幅度脉冲将其复位为低电阻。

87. 发明授权

US07214583B2 Memory cell with an asymmetric crystalline structure 有权
标题翻译：具有不对称晶体结构的记忆单元
公开(公告)号：US07214583B2
公开(公告)日：2007-05-08
申请号：US11130983
申请日：2005-05-16
申请人： Sheng Teng Hsu , Tingkai Li , David R. Evans , Wei-Wei Zhuang , Wei Pan
发明人： Sheng Teng Hsu , Tingkai Li , David R. Evans , Wei-Wei Zhuang , Wei Pan
IPC分类号： H01L21/8242
CPC分类号： G11C13/0007 , G11C2213/31 , H01L45/04 , H01L45/1233 , H01L45/147 , H01L45/1608 , H01L45/1625
摘要： Asymmetrically structured memory cells and a fabrication method are provided. The method comprises: forming a bottom electrode; forming an electrical pulse various resistance (EPVR) first layer having a polycrystalline structure over the bottom electrode; forming an EPVR second layer adjacent the first layer, with a nano-crystalline or amorphous structure; and, forming a top electrode overlying the first and second EPVR layers. EPVR materials include CMR, high temperature super conductor (HTSC), or perovskite metal oxide materials. In one aspect, the EPVR first layer is deposited with a metalorganic spin coat (MOD) process at a temperature in the range between 550 and 700 degrees C. The EPVR second layer is formed at a temperature less than, or equal to the deposition temperature of the first layer. After a step of removing solvents, the MOD deposited EPVR second layer is formed at a temperature less than, or equal to the 550 degrees C.
摘要翻译：提供了非对称结构的存储单元和制造方法。该方法包括：形成底部电极; 在底部电极上形成具有多晶结构的电脉冲各种电阻（EPVR）第一层; 用纳米结晶或无定形结构形成邻近第一层的EPVR第二层; 并且形成覆盖在第一和第二EPVR层上的顶部电极。 EPVR材料包括CMR，高温超导体（HTSC）或钙钛矿金属氧化物材料。在一个方面，EPVR第一层在550-700℃的温度范围内用金属有机旋涂（MOD）工艺沉积.EPVR第二层是在小于或等于沉积温度的第一层。在除去溶剂的步骤之后，将MOD沉积的EPVR第二层在小于或等于550℃的温度下形成。

88. 发明授权

US07193280B2 Indium oxide conductive film structures 有权
标题翻译：氧化铟导电膜结构
公开(公告)号：US07193280B2
公开(公告)日：2007-03-20
申请号：US11039543
申请日：2005-01-19
申请人： Tingkai Li , Sheng Teng Hsu
发明人： Tingkai Li , Sheng Teng Hsu
IPC分类号： H01L29/76 , H01L29/94 , H01L31/00 , H01L29/788
CPC分类号： H01L21/28185 , H01L21/28194 , H01L21/28273 , H01L21/28291 , H01L21/31604 , H01L29/513 , H01L29/517 , H01L29/78391
摘要： One-transistor ferroelectric memory devices using an indium oxide film (In2O3), an In2O3 film structure, and corresponding fabrication methods have been provided. The method for controlling resistivity in an In2O3 film comprises: depositing an In film using a PVD process, typically with a power in the range of 200 to 300 watts; forming a film including In overlying a substrate material; simultaneously (with the formation of the In-including film) heating the substrate material, typically the substrate is heated to a temperature in the range of 20 to 200 degrees C.; following the formation of the In-including film, post-annealing, typically in an O2 atmosphere; and, in response to the post-annealing: forming an In2O3 film; and, controlling the resistivity in the In2O3 film. For example, the resistivity can be controlled in the range of 260 to 800 ohm-cm.
摘要翻译：使用氧化铟膜（In 2 O 3 O 3），In 2 N 3 O 3的<！ - SIPO - >单晶体铁电存储器件 >膜结构，并提供相应的制造方法。用于控制In 2 N 3 O 3膜中的电阻率的方法包括：使用PVD工艺沉积In膜，通常具有200至300瓦特的功率; 形成包括在衬底材料中的膜; 同时（形成含In膜）加热衬底材料，通常将衬底加热至20至200℃的温度范围; 在形成含In膜之后，通常在O 2气氛中进行后退火; 并且响应于后退火：形成In 2 N 3 O 3膜; 并且控制In 2 N 3 O 3膜中的电阻率。例如，电阻率可以控制在260至800欧姆 - 厘米的范围内。

89. 发明授权

US07166485B1 Superlattice nanocrystal Si-SiO2 electroluminescence device 有权
标题翻译：超晶格纳米晶Si-SiO2电致发光器件
公开(公告)号：US07166485B1
公开(公告)日：2007-01-23
申请号：US11175797
申请日：2005-07-05
申请人： Tingkai Li , Sheng Teng Hsu , Wei-Wei Zhuang
发明人： Tingkai Li , Sheng Teng Hsu , Wei-Wei Zhuang
IPC分类号： H01L21/00 , H01L29/06
CPC分类号： H01L33/34 , B82Y20/00 , H01L33/0012
摘要： A superlattice nanocrystal Si—SiO2 electroluminescence (EL) device and fabrication method have been provided. The method comprises: providing a Si substrate; forming an initial SiO2 layer overlying the Si substrate; forming an initial polysilicon layer overlying the initial SiO2 layer; forming SiO2 layer overlying the initial polysilicon layer; repeating the polysilicon and SiO2 layer formation, forming a superlattice; doping the superlattice with a rare earth element; depositing an electrode overlying the doped superlattice; and, forming an EL device. In one aspect, the polysilicon layers are formed by using a chemical vapor deposition (CVD) process to deposit an amorphous silicon layer, and annealing. Alternately, a DC-sputtering process deposits each amorphous silicon layer, and following the forming of the superlattice, polysilicon is formed by annealing the amorphous silicon layers. Silicon dioxide can be formed by either thermal annealing or by deposition using a DC-sputtering process.
摘要翻译：已经提供了超晶格纳米晶Si-SiO 2电致发光（EL）器件及其制造方法。该方法包括：提供Si衬底; 形成覆盖Si衬底的初始SiO 2层; 形成覆盖初始SiO 2层的初始多晶硅层; 形成覆盖初始多晶硅层的SiO 2层; 重复多晶硅和SiO 2层形成，形成超晶格; 用稀土元素掺杂超晶格; 沉积覆盖掺杂超晶格的电极; 并且形成EL器件。在一个方面，通过使用化学气相沉积（CVD）工艺沉积非晶硅层和退火来形成多晶硅层。或者，DC溅射工艺沉积每个非晶硅层，并且在形成超晶格之后，通过退火非晶硅层形成多晶硅。可以通过热退火或通过使用DC溅射工艺的沉积来形成二氧化硅。

90. 发明授权

US07153708B2 Seed layer processes for MOCVD of ferroelectric thin films on high-k gate oxides 失效
公开(公告)号：US07153708B2
公开(公告)日：2006-12-26
申请号：US11249883
申请日：2005-10-12
申请人： Tingkai Li , Sheng Teng Hsu
发明人： Tingkai Li , Sheng Teng Hsu
IPC分类号： H01L21/00
CPC分类号： H01L21/28273 , C23C16/0272 , C23C16/40 , C23C16/56 , H01L21/28194 , H01L21/28291 , H01L21/31691 , H01L28/56 , H01L29/513 , H01L29/517
摘要： A method of forming a ferroelectric thin film on a high-k layer includes preparing a silicon substrate; forming a high-k layer on the substrate; depositing a seed layer of ferroelectric material at a relatively high temperature on the high-k layer; depositing a top layer of ferroelectric material on the seed layer at a relatively low temperature; and annealing the substrate, the high-k layer and the ferroelectric layers to form a ferroelectric thin film.

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